• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2011년도 제40회 동계학술대회 초록집
• /
• pp.9-9
• /
• 2011

There has been strong demand for novel nonvolatile memory technology for low-cost, large-area, and low-power flexible electronics applications. Resistive memories based on metal oxide thin films have been extensively studied for application as next-generation nonvolatile memory devices. However, although the metal oxide-based resistive memories have several advantages, such as good scalability, low-power consumption, and fast switching speed, their application to large-area flexible substrates has been limited due to their material characteristics and necessity of a high-temperature fabrication process. As a promising nonvolatile memory technology for large-area flexible applications, we present a graphene oxide-based memory that can be easily fabricated using a room temperature spin-casting method on flexible substrates and has reliable memory performance in terms of retention and endurance. The microscopic origin of the bipolar resistive switching behaviour was elucidated and is attributed to rupture and formation of conducting filaments at the top amorphous interface layer formed between the graphene oxide film and the top Al metal electrode, via high-resolution transmission electron microscopy and in situ x-ray photoemission spectroscopy. This work provides an important step for developing understanding of the fundamental physics of bipolar resistive switching in graphene oxide films, for the application to future flexible electronics.

• ETRI Journal
• /
• 제38권6호
• /
• pp.1163-1171
• /
• 2016

Integration technologies involving flexible substrates are receiving significant attention owing the appearance of new products regarding wearable and Internet of Things technologies. There has been a continuous demand from the industry for a reliable bonding method applicable to a low-temperature process and flexible substrates. Up to now, however, an anisotropic conductive film (ACF) has been predominantly used in applications involving flexible substrates; we therefore suggest low-temperature lead-free soldering and bonding processes as a possible alternative for flex-on-flex applications. Test vehicles were designed on polyimide flexible substrates (FPCBs) to measure the contact resistances. Solder bumping was carried out using a solder-on-pad process with Solder Bump Maker based on Sn58Bi for low-temperature applications. In addition, thermocompression bonding of FPCBs was successfully demonstrated within the temperature of $150^{\circ}C$ using a newly developed fluxing underfill material with fluxing and curing capabilities at low temperature. The same FPCBs were bonded using commercially available ACFs in order to compare the joint properties with those of a joint formed using solder and an underfill. Both of the interconnections formed with Sn58Bi and ACF were examined through a contact resistance measurement, an $85^{\circ}C$ and 85% reliability test, and an SEM cross-sectional analysis.

• 한국기계가공학회지
• /
• 제12권6호
• /
• pp.30-36
• /
• 2013

An FFD(flexible fine die) is an embossed mold that consists of a thin plate ranging from 0.6 to 3 mm in thickness. FFDs are primarily used for cutting LCD films and F-PCB sheets. In the high-speed micro-milling process of flexible fine dies, the lubrication and cooling of the cutting edges is very important from the aspect of eco machining and cutting performance. In this paper, a comparative study of tool wear and surface roughness between cutting fluid and hybrid lubrication for eco-machining of FFD was conducted for processes of high-speed machining of highly hardened material (STC5, HRC52). Especially, the incorporated fluid method for eco machining, in which the cutting performances can be simultaneously measured, was introduced. The machining results show that hybrid lubrication, instead of conventional cutting fluid, leads to excellent tool wear and surface roughness and represents the proper conditions for eco micro-machining of flexible fine dies.

• Composites Research
• /
• 제31권6호
• /
• pp.355-364
• /
• 2018

Flexible energy-storage devices (FESDs) have been studied and developed extensively over the last few years because of demands in various fields. Since electrochemical performance and mechanical flexibility must be taken into account together, different framework from composition of conventional energy-storage devices (ESDs) is required. Numerous types of electrodes have been proposed to implement the FESDs. Herein, we review the works related to the FESDs so far and focus on free-standing electrodes and, especially substrate-based ones. The way to utilize carbon woven fabric (CF) or carbon cloth (CC) as flexible substrates is quite simple and intuitive. However, it is meaningful in the point of that the framework exploiting CF or CC can be extended to other applications resulting in multifunctional composites. Therefore, summary, which is on utilization of carbon-based material and conductive substrate containing CF and CC for ESDs, turns out to be helpful for other researchers to have crude concepts to get into energy-storage multi-functional composite. Moreover, polymer electrolytes are briefly explored as well because safety is one of the most important issues in FESDs and the electrolyte part mainly includes difficult obstacles to overcome. Lastly, we suggest some points that need to be further improved and studied for FESDs.

• 대한기계학회논문집A
• /
• 제34권3호
• /
• pp.299-305
• /
• 2010

가변성형 공정에서 동일한 크기의 성형펀치 배열로 구성된 가변금형을 이용하는 경우 펀치의 크기가 일정하여 성형 가능한 곡률 반경이 제한되기 때문에 비교적 유연성이 낮다. 이에 본 연구에서는 가변금형의 유연성을 높이기 위하여 분할가변금형에 대한 개념을 제안하였다. 임의의 성형면을 형성하기 위하여 두 가지 크기의 펀치로 구성된 펀치 블록을 착안하였다. 상대적으로 큰 곡률 반경을 갖는 성형영역에 대해서는 크기가 큰 펀치 블록을 적용하였으며, 작은 곡률 반경을 갖는 성형영역에 대해서는 작은 크기의 펀치로 구성된 펀치 블록을 적용하였다. 해석적 연구를 토대로 성형된 제품의 단면 형상을 비교하였으며 이로부터 서로 다른 크기의 펀치 블록을 조합하여 구성한 분할가변금형을 이용한 판재의 성형공정이 비교적 복잡한 곡률 반경 분포를 갖는 곡면 가공에 적합함을 확인하였다.

• 한국전기전자재료학회논문지
• /
• 제26권12호
• /
• pp.894-898
• /
• 2013

Zinc oxide(ZnO) was sputtered on various glass and flexible substrates such as polyethylene terephthalate(PET) and polycarbonate(PC). A Q-switched $Nd:YVO_4$ laser with a wavelength of 1,064 nm was used for the direct etching of ZnO films. It was possible to obtain laser etched line patterns on the ZnO films on PC substrate at some specific laser beam conditions. In the flexible substrates, more thermal energy of laser beam is expected to be spreaded for the etching process.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
• /
• pp.67-67
• /
• 2012

Graphene, two-dimensional one-atom-thick planar sheet of carbon atoms densely packed in a honeycomb crystal lattice, exhibits fascinating electrical properties, such as a linear energy dispersion relation and high mobility in addition to a wide-range optical absorption and high thermal conductivity. Graphene's outstanding tensile strength allows graphene-based electronic and photonic devices to be flexible, bendable, or even stretchable. Recently many groups have reported high performance electronic and optoelectronic devices based on graphene materials, i.e. field-effect transistors, gas sensors, nonvolatile memory devices, and plasmonic waveguides, in which versatile properties of graphene materials have been incorporated into a flexible electronic or optoelectronic platform. However, there are several fundamental or technological hurdles to be overcome in real applications of graphene in electronics and optoelectronics. In this tutorial we will present a short introduction to the basic material properties and recent progresses in applications of graphene to electronics and optoelectronics and discuss future outlook of graphene-based devices.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2009년도 추계학술대회 논문집
• /
• pp.179-179
• /
• 2009

For the deposition of the semiconductor nanocrystals or quantum dots, it is required to have the substrates with smooth surface roughness. Slot-die coating method wad adopted and optimized varying the processing parameters like coating speed, gap distance, solution concentration, etc to get the smooth coated films on flexible substrates. The coating speed in slot-die method was varied from 1 m/min to 2.5 m/min focusing especially on its industrial usage. The gap distance between the substrate surface and slot-die lip was changed also to control mainly the thickness of coated films.

• 한국고분자학회:학술대회논문집
• /
• 한국고분자학회 2006년도 IUPAC International Symposium on Advanced Polymers for Emerging Technologies
• /
• pp.364-364
• /
• 2006

The rheological properties of Parmax 1200, a new semi-flexible substituted polyphenylene, were investigated. The reported high stiffness of the material was confirmed. The rheological measurements proved that, despite the very high stiffness of the molecules, Parmax showed shear thinning and that, although the viscosity is very high and the melt is highly elastic, the polymer can be extruded in the melt. A worm-like morphology was detected in AFM and TEM. This morphology could explain the reported mechanical and rheological behaviour. The compatibility with flexible chain polymers (e.g. polycarbonate) could also be explained by the worm-like morphology.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2002년도 하계학술대회 논문집
• /
• pp.185-189
• /
• 2002

Flexible displays such as plastic based LCDs and organic light-emitting diodes for mobile communication devices have been researched and developed at KETI in KOREA since 1997. The Plastic film substrate has so poor thermal tolerance and non-rigidness that the fabrication of active devices and panel assembly have to perform at low temperature and pressure. In addition, high thermal expansion of the substrate is also a serious problem for reliable metallic film deposition. In this paper, we investigated particularly on the fundamental characteristics of various plastic substrates and then, suggested novel methods that improve the fabrication processes of plastic LCD panel. In order to maintain stable substrate surface and uniform cell gap during panel assembly, we utilized newly-invented iii and vacuum chuck. Electro-optical characteristics of fabricated plastic LCD are better than or equivalent to those of typical glass based LCDs though it is thinner, lighter-weight and more robust.