• 제목/요약/키워드: Flexible material

검색결과 1,047건 처리시간 0.031초

A Review on Thermoelectric Technology: Conductive Polymer Based Thermoelectric Materials

  • Park, Dabin;Kim, Jooheon
    • 한국전기전자재료학회논문지
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    • 제35권3호
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    • pp.203-214
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    • 2022
  • Thermoelectric (TE) heating and cooling devices, which are able to directly convert thermal energy into electrical energy and vice versa, are effective and have exhibited a potential for energy harvesting. With the increasing consumer demands for various wearable electronics, organic-based TE composite materials offer a promise for the TE devices applications. Conductive polymers are widely used as flexible TE materials replacing inorganic materials due to their flexibility, low thermal conductivity, mechanical flexibility, ease of processing, and low cost. In this review, we briefly introduce the latest research trends in the flexible TE technology and provide a comprehensive summary of specific conductive polymer-based TE material fabrication technologies. We also summarize the manufacture for high-efficiency TE composites through the complexation of a conductive polymer matrix/inorganic TE filler. We believe that this review will inspire further research to improve the TE performance of conductive polymers.

A Flexible Amorphous $Bi_5Nb_3O_{15}$ Film for the Gate Insulator of the Low-Voltage Operating Pentacene Thin-Film Transistor Fabricated at Room Temperature

  • Kim, Jin-Seong;Cho, Kyung-Hoon;Seong, Tae-Geun;Choi, Joo-Young;Nahm, Sahn
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2010년도 춘계학술회의 초록집
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    • pp.17-17
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    • 2010
  • The amorphous $Bi_5Nb_3O_{15}$ film grown at room temperature under an oxygen-plasma sputtering ambient (BNRT-$O_2$ film) has a hydrophobic surface with a surface energy of $35.6\;mJm^{-2}$, which is close to that of the orthorhombic pentacene ($38\;mJm^{-2}$, resulting in the formation of a good pentacene layer without the introduction of an additional polymer layer. This film was very flexible, maintaining a high capacitance of $145\;nFcm^{-2}$ during and after 10s bending cycles with a small curvature radius of 7.5 mm. This film was optically transparent. Furthermore, the flexible, pentacene-based, organic thin-film transistors (OTFTs) fabricated on the polyethersulphone substrate at room temperature using a BNRT-$O_2$ film as a gate insulator exhibited a promising device performance with a high field effect mobility of $0.5\;cm^2V^{-1}s^{-1}$, an on/off current modulation of $10^5$ and a small subthreshold slope of $0.2\;Vdecade^{-1}$ under a low operating voltage of -5 V. This device also maintained a high carrier mobility of $0.45\;cm^2V^{-1}s^{-1}$ during the bending with a small curvature radius of 9 mm. Therefore, the BNRT-$O_2$ film is considered a promising material for the gate insulator of the flexible, pentacene-based OTFT.

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Curing Kinetics and Chemorheological Behavior of No-flow Underfill for Sn/In/Bi Solder in Flexible Packaging Applications

  • Eom, Yong-Sung;Son, Ji-Hye;Bae, Hyun-Cheol;Choi, Kwang-Seong;Lee, Jin-Ho
    • ETRI Journal
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    • 제38권6호
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    • pp.1179-1189
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    • 2016
  • A chemorheological analysis of a no-flow underfill was conducted using curing kinetics through isothermal and dynamic differential scanning calorimetry, viscosity measurement, and solder (Sn/27In/54Bi, melting temperature of $86^{\circ}C$) wetting observations. The analysis used an epoxy system with an anhydride curing agent and carboxyl fluxing capability to remove oxide on the surface of a metal filler. A curing kinetic of the no-flow underfill with a processing temperature of $130^{\circ}C$ was successfully completed using phenomenological models such as autocatalytic and nth-order models. Temperature-dependent kinetic parameters were identified within a temperature range of $125^{\circ}C$ to $135^{\circ}C$. The phenomenon of solder wetting was visually observed using an optical microscope, and the conversion and viscosity at the moment of solder wetting were quantitatively investigated. It is expected that the curing kinetics and rheological property of a no-flow underfill can be adopted in arbitrary processing applications.

고성능 유연 발광 다이오드 소자 구현을 위한 레이저 기반 페로브스카이트 소재의 재결정화 (Laser-Induced Recrystallization of Perovskite Materials for High-Performance Flexible Light-Emitting Diode)

  • 허재찬;김지은;이동규;황윤식;우유미;이한얼;박정환
    • 한국전기전자재료학회논문지
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    • 제36권3호
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    • pp.286-291
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    • 2023
  • Perovskite materials are promising candidates for next-generation optoelectronic devices owing to their outstanding external quantum efficiency, high color purity, and ability to tune the light emission wavelength. However, conventional thermal annealing processes caused the degradation of perovskite, resulting in poor optoelectronic properties and a short lifetime. Herein, we propose a laser-induced recrystallization of perovskite thin film to enhance its light-emitting properties. Laser-induced recrystallization process was performed using rapid and instantaneous laser heating, which successfully induced grain growth of the perovskite material. The laser processing conditions were thoroughly optimized based on theoretical calculations and various material analyses such as x-ray diffraction, scanning electron microscope, and photoluminescence spectroscopy.

유연보의 과도 진동 감쇠를 위한 점탄성 재료의 최적 분포 (Optimal Distribution of Viscoelastic Material for Transient Vibration Suppression of a Flexible Beam)

  • Kim, Tae-Woo;Kim, Ji-Hwan
    • 한국소음진동공학회:학술대회논문집
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    • 한국소음진동공학회 2002년도 추계학술대회논문초록집
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    • pp.362.1-362
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    • 2002
  • Eigenvalues are taken as performance criteria for structural damping design using viscoelastic material. Given material properties, optimal distribution of damping material is sought based on eigenvalue sensitivity. For eigenanalysis of frequency dependent viscoelastic material rented structures, Golla-Hughes-McTavish(GHM) model is used and some dominant modes are chosen for consideration. (omitted)

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생산시스템에서의 물류시스템 기술분석 (Technical Analysis of Material Handling System in Production System)

  • 김동훈
    • 연구논문집
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    • 통권26호
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    • pp.57-68
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    • 1996
  • Recently, a lot of researches on material handling system are actively studied for realization of FA(Factory Automation), FMS(Flexible Manufacturing System) and CIM(Computer Integrated Manufacturing). Management and application of material handling system are precondition technologies playing an important part in integration of production system including manufacturing. assemhly, and inspection cell. In this paper, the general situation of automation technology is investigated and technology level is analyzed in comparision with an advanced country. And the operation trend and part of material handling system including AS/RS, AGV, and Conveyor, are studied. And also technologies related to material handling system in the inside and outside of the country are studied.

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COIN형 리튬 폴리머전지의 충방전 특성

  • 박수길;박종은;손원근;이흥기;김상욱;이주성
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1997년도 추계학술대회 논문집
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    • pp.497-500
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    • 1997
  • Conducting polymer is new material in lithium secondary battery. conducting polymer has a lot of merit which is flexible and good handing so that this material is used battery system, solid polymer electrolytes airs used PEO(Polyethylene oxide) and PEO/PMMA branding material adding by liquid plasticizer or lithium salt polymer electrolyte which is added liquid plasticizer, lithium salt decreased the crystallity and thermal stability is over than 13$0^{\circ}C$. it is very useful tn apply lithium secondary battery system.

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가변성형기술을 활용한 항공기 윙렛용 몰드 제작에 관한 수치적 연구 (Numerical Study of Aircraft Winglet Mold Manufacturing using Flexible Forming)

  • 박지우;구태완;김정;강범수
    • 소성∙가공
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    • 제23권8호
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    • pp.482-488
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    • 2014
  • Flexible forming technology has advantages in sheet metal forming, because it can be implemented to produce various shaped molds using a single apparatus. Due to this advantage, it is possible to apply it to the manufacture of an aircraft winglet mold. Presently, most aircraft winglets are manufactured from composite materials. Therefore, the mold for the curing process is an essential element in the fabrication of such composite materials. Compared to conventional mold forming, flexible forming has some advantages such as reduced manufacturing cost and uniformity of mold thickness. If the thickness of the mold is consistent, then the heat transfer will occur uniformly during the curing process leading to improved formability of the composite material. In the current study, numerical simulations were performed to investigate the possibility of flexible forming for manufacturing of the winglet mold. In order to match the size of the actual product, the shape of objective surface was divided to fit the dimensions of the apparatus. The results from the numerical simulations are compared with the objective surface to verify the accuracy. In conclusion, the current study confirms the feasibility and the potential to manufacture winglet molds by flexible forming.

PCM을 활용한 가변형 몰드 제작 프로세스 (Flexible Mold Production Process for Using the PCM)

  • 김태구;이동훈;김선국
    • 한국건축시공학회:학술대회논문집
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    • 한국건축시공학회 2014년도 춘계 학술논문 발표대회
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    • pp.272-273
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    • 2014
  • Existing the free-form concrete segments (FCS) mold is produced by state of solid such as steel, wood, Styrofoam that can not be recycled. Using FCS mold result in delay on schedule and decrease of productivity because it consists of irregular curved variety and it requires more time than fixed mold. Thus, FCS mold should be developed which can reduce the costs and also it can be used as semipermanent. The aim of this study is to suggest of flexible mold production process for using the phase change materials(PCM). PCM is maintain that its solid state at low temperature but it changes phase to liquid state by heating. PCM is suitable material for flexible mold due to change of phase in relatively high temperature compare to other phase change materials such as water. Flexible mold is possible that reuse semi-permanently made by PCM. Thus, this study is proposed the process of flexible mold production for using the PCM. The study results will be used as the basic theory for studies on production and installation of FCS.

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Effects of Misalignment of High Speed Flexible Coupling on the Fighter Aircraft Transmission Characteristics

  • Samikkanu, Nagesh;Basha, Abu Muhammed Junaid
    • International Journal of Fluid Machinery and Systems
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    • 제5권2호
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    • pp.91-99
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    • 2012
  • The Fighter aircraft transmission system consists of a light weight, High Speed Flexible Coupling (HSFC) known as Power Take-Off shaft (PTO) for connecting Engine gearbox (EGB) with Accessory Gear Box (AGB). The HSFC transmits the power through series of specially contoured metallic annular thin flexible plates whose planes are normal to the torque axis. The HSFC operates at high speed ranging from 10,000 to 18,000 rpm. The HSFC is also catered for accommodating larger lateral and axial misalignment resulting from differential thermal expansion of the aircraft engine and mounting arrangement. The contoured titanium alloy flexible plates are designed with a thin cross sectional profile to accommodate axial and parallel misalignment by the elastic material flexure. This paper investigates the effect of misalignment on the transmission characteristics of the HSFC couplings. A mathematical model for the HSFC coupling with misalignment has been developed for analyzing the torque transmission and force interaction characteristics. An extensive testing has been conducted for validating characteristics of the designed coupling under various misalignment conditions. With this the suitability of the model adapted for the design iteration of HSFC development is validated. This method will reduce the design iteration cycles of HSFC and can be extended for the similar development of flexible couplings.