• Transactions of the Korean Society of Automotive Engineers
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• v.11 no.1
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• pp.121-127
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• 2003

The stiffness of a bushing in a suspension is extremely important for the overall performance of the suspension system. A new measurement system including the flexible jig was developed to measure the multi-directional stiffness of bushings. To overcome the disadvantage of building each individual jig for each type and size of a bushing, we designed the flexible jig which can accommodate numerous bushings of similar shapes and sizes. Upon using the novel design of the flexible jig in the industry, we could successfully measure the torsional and conical stiffness of many bushings and apply the data for the prediction and evaluation of the performance of a suspension system, which would assist designing the optimal suspension system.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.31 no.1 s.256
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• pp.1-10
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• 2007

This paper presents a design guidance of jig/fixture for flexible manufacturing system based on the verification of a base assembly motion instability. In flexible assembly system, the base assembly needs to be maintained in its assembled state without being taken apart. This requires stability in motion while the base assembly is handled or tilted. Therefore, the instability of the base assembly motion should be considered when determining the guide line of designing jig/fixture by evaluating a degree of the motion instability of the base assembly. To derive the instability, first we inference collision free assembly directions by extracting separable directions for the mating parts and calculate the separability which gives informations as to how the parts can be easily separated. Using these results, we determine the instability evaluated by summing all the modified separabilities of each component part within base assembly.

• Design & Manufacturing
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• v.14 no.3
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• pp.23-30
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• 2020

Laser Assisted Thermo-Compression Bonding (LATCB) has been proposed to improve the "chip tilt due to the difference in solder bump height" that occurs during the conventional semiconductor chip bonding process. The bonding module of the LATCB system has used a piezoelectric actuator to control the inclination of the compression jig on a micro scale, and the piezoelectric actuator has been directly coupled to the compression jig to minimize the assembly tolerance of the compression jig. However, this structure generates a lateral force in the piezoelectric actuator when the compression jig is tilted, and the stacked piezoelectric element vulnerable to the lateral force has a risk of failure. In this paper, the optimal design of the flexure hinge was performed to minimize the lateral force generated in the piezoelectric actuator when the compression jig is tilted by using the displacement difference of the piezoelectric actuator in the bonding module for LATCB. The design variables of the flexure hinge were defined as the hinge height, the minimum diameter, and the notch radius. And the effect of the change of each variable on the stress generated in the flexible hinge and the lateral force acting on the piezoelectric actuator was analyzed. Also, optimization was carried out using commercial structural analysis software. As a result, when the displacement difference between the piezoelectric actuators is the maximum (90um), the maximum stress generated in the flexible hinge is 11.5% of the elastic limit of the hinge material, and the lateral force acting on the piezoelectric actuator is less than 1N.

• Radiation Oncology Journal
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• v.7 no.2
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• pp.299-303
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• 1989

Authors have developed highly reproducible calibration method for the Micro-Selectron HDR Ir-192 system (Nucletron, Motherland). The new jig has a 10cm radius circular hole in the $30cm{\times}30cm{\times}0.2cm$ acrylic plate, and 5F flexible bronchial tubes are attached around the hole. The source moves along the circle in the tubes and the ionization chamber is placed verticaly at the center of the circular hole (center of the jig). Dose distribution near the center was derived theoretically, and measured with the film dosimetry system. Theoretical calculation and measurement show the error margin below $0.1\%$ for 1mm or 2mm position deviation. We have measured at 12 and 24 points of circle with 1, 6, 11 and 21 second dwell time of source in order to calculate the activity of the source. Measurements have been repeated daily for 50 days. The accuracy and the reproducibility are below $1\%$ error margin. The half life of the source from our measurement is estimated $73.4\pm0.4$ days.

• Transactions on Electrical and Electronic Materials
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• v.4 no.2
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• pp.10-14
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• 2003

Flexible displays such as plastic-based liquid crystal displays (LCDs) and organic light-emitting diode displays (OLEDDs) have been researched and developed at KETI since 1997. The plastic film substrate is very weak to heat and pressure compared to glass substrate, that its fabrication process is limited to 110$^{\circ}C$ and low pressure. The ITO films were deposited on the bare plastic film substrate by rf-magnetron sputtering. Moreover, in order to maintain uniform cell gap and pressure on the plastic film substrate, we utilized newly-invented jig and fabrication process. Electro-optical characteristics were better than or equivalent to those of typical glass LCDs though it is thinner, lighter-weight, and more robust than glass LCDs.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.102-110
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• 2023

This paper introduces scarf welding process of thin substrates using flexible laser transmission welding (f-LTW) technology. We examined the behavior of tensile strength relative to the scarf angle for flexible applications. Thin plastic substrates with the thickness of less than 100 ㎛ were bonded and a jig to form a slope at the edge of the substrate was developed. By developing the scarf welding process, we successfully created a flexible bonding technology that maintains joint's thickness after the process. The tensile strength of the joint was assessed through uniaxial test, and we found that the tensile strength increases as the slope of bonding interface decreases. By conducting stress analysis at the bonding interface with respect to the slope angle, design factor of bonding structure was investigated. These findings suggest that the tensile strength depends on the geometry of the joint, even under the same process conditions, and highlights the significance of considering the geometry of the joint in welding processes.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2007.06a
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• pp.540-543
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• 2007

In this paper, we propose a new approach to reduce the audible noise generated by TFT-LCD module in mobile applications. We also analyzed impact factors which effect on the audible noise. It is expected that this noise source comes from various impact factors such as vibration of flexible printed-circuit board (FPCB) and LCD panel, and static electricity charged in window and back-light unit. Windowless type and window type models are evaluated to analyze noise level due to the static electricity charged in window. To obtain reliable and reproducible data, we constructed controllable test jig and measurement set-up.