• Journal of Adhesion and Interface
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• v.25 no.1
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• pp.162-168
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• 2024

The effect of maleinized polybutadiene (MPB) on the mechanical properties of epoxy resins including adhesion strength, elongation and impact peel resistance was investigated in this study, in which MPB is an anhydride-functionalized polybutadiene prepolymer. Different molecular weights (3.1K and 5.6K) of MPB were added to diglycidyl ether bisphenol-A (DEGBA), an epoxy resin, to increase its impact peel strength and elongation. At various loading percent (5, 10, 15, 20 and 25 wt%) of MPB in the epoxy resin, significant improvements of mechanical properties were observed. According to the comparative analysis results, the modified epoxy system with 15 wt% (3.1K) MPB exhibited the highest lap shear strength, about 40% higher than that of neat epoxy. The tensile strength and elongation steadily and simultaneously increased as the loading percent of MPB increased. The impact peel strengths at low (-40℃) and room (23℃) temperatures were substantially improved by MPB incorporation into epoxy resins. Reactive and flexible MPB prepolymer seems to construct strong nano-structured networks with rigid epoxy backbones without sacrificing the tensile and adhesion strengths while increasing impact resistance/toughness and elongation properties. For higher impact peel while maintaining adhesion and tensile strengths, approximately 10-15 wt% MPB loading in epoxy resin was suggested. Consequently, incorporation of functionalized MPB prepolymer into epoxy system is an easy and efficient way for improving some crucial mechanical properties of epoxy resins.

• Applied Chemistry for Engineering
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• v.8 no.6
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• pp.973-978
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• 1997

The toughness and morphology of epoxy resin based on diglycidyl ether of bisphenol A(DGEBA) cured with of tris (dimethylaminomethy]) phenol(DMP-30) and castor oil (CO) as a toughening modifier have been studied. Mixtures of CO and an epoxy resin showed a higher miscibility than the classical CTBN modified epoxy resin. The glass transition temperature($T_g$) was decreased with the CO content and the cure temperature. It is interpreted that the networks of epoxy matrix obtained at high temperature are apparently looser and more flexible due to the lower crosslinking density. The toughness was slightly increased with the CO content at $40^{\circ}C$ of curing temperature. The toughness increased with increasing the cure temperature and CO content.

• Proceedings of the Korea Concrete Institute Conference
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• 2005.05b
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• pp.277-280
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• 2005

Epoxy-mortar composites have been wildly used as finishing and repairing materials in the construction because of their excellent properties. Conventional epoxy-mortars and concretes have an inferior applicability and cost performance ratio due to the two component mixing of the epoxy resin and hardener. In this study, we examined the engineering effect of compressive strength and flexible strength according to the various epoxy-hardener in underwater and humidity environment, and evaluated the hardener types and physical effect of Epoxy mortar using cement binder in underwater and air condition. In this study, it was clarified that the engineering properties of repairing epoxy-motars were effected by the type of hardener.

• Composites Research
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• v.35 no.2
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• pp.69-74
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• 2022

In this study, the conductive paste used in a wide range such as wiring in the electronic packaging field, the automobile industry, and electronic products is manufactured under various process conditions due to the simplicity of the process, and then the thermal, mechanical, and electrical characteristics are analyzed and simulation studies are conducted to optimize the process. to establish the conditions of the conductive paste manufacturing process. First, a conductive paste was prepared by setting various types of binder resin, an essential component of the conductive paste, and characteristics such as thermal conductivity, tensile strength, and elongation were analyzed. Among the binder resins, the conductive paste applied with a flexible epoxy material had the best physical properties, and a simulation study was conducted based on the physical property data base of the conductive face. As a result of the simulation, the best physical properties were exhibited when the Ag flake volume fraction was 60%.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.380-380
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• 2013

본 논문에서는 외기 환경 요인 중에서 H2O와 O2의 영향으로 성능이 저하되는 유기박막트랜지스터(OTFT)의 수명시간 향상을 위하여 필요한 passivation layer의 효과에 대하여 알아 보았다. OTFT에 기존의 액상 공정이나 증착 공정으로 단일 passivation layer또는 다층 passivation layer를 형성하는 방식과는 다르게 향후에 산업 전반에 적용이 기대되는 것을 고려하여 제작 공정의 간편성을 위하여 film 형태로 되어 있는 열경화성 epoxy resin film으로 passivation layer를 구현하는 방법을 사용하여 OTFT의 storage stability를 평가하였다. passivation layer가 없는 OTFT와 열경화성 epoxy resin film으로 passivation된 OTFT의 전기적 특성이 서로 비교 평가되었으며 또한 30일 동안 온도 $25^{\circ}C$ 상대습도 40%의 환경을 갖는 Desicator 안에서 소자를 보관하여 시간에 따른 전기적 특성 변화를 검증하여 epoxy resin film의 passivation layer으로의 적용가능성을 검증하였다. 결과적으로 30일 후의 passivation layer가 없는 OTFT의 전기적 특성은 매우 낮게 떨어진 반면에 epoxy resin film으로 passivation layer가 구현된 OTFT의 mobility는 $0.060cm^2$/Vs, VT는 -0.18 V, on/off ratio는 $3.7{\times}10^3$으로 초기의 소자 특성이 잘 유지되는 결과를 얻었다. OTFT는 Flexible한 polyethersulfone (PES)기판에 게이트 전극이 하부에 있는 Bottom gate 구조로 제작되었고 채널 형성을 위한 유기반도체 재료로 6,13-bis (triisopropylsilylethynyl) (TIPS) pentacene이 사용되었고 spin coating된 Poly-4-vinylphenol (PVP)가 게이트 절연체로 사용되었다. 이때 Au전극은 Shadow mask를 이용하여 증착하였다. 또한 OTFT의 채널 길이 $100{\mu}m$, 채널 폭 $300{\mu}m$의 영역에 Drop casting법을 사용하여 채널을 형성하였다. 물리적 특성은 scanning electron microscopy (SEM), scanning probe microscopy (SPM), x-ray diffraction (XRD)를 사용하여 분석하였고, 전기적 특성은 Keithley-4200을 사용하여 추출하였다.

• Proceedings of the KIEE Conference
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• 1994.07b
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• pp.1323-1326
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• 1994

the application of epoxy composite materials for outdoor insulating systems has some significant advantages compared with conventional inorganic materials, that is low weight in combination with high mechanical strength, small dimensions and design versatility. The experimental results for the basis composition and interlace characteristics of the matrix resin/inorganic fillers($SiO_2$) which are the composite materials have been studied. The electrical characteristics(electrical breakdown, dielectric, insulating resistivity, tracking) and mechanical characteristics( tensile strength, elongation, flexible strength) in the epoxy composite materials have been studied. The life of the epoxy composite material was evaluated by accelerated Weather-Ometer test and the degradation process due to outdoor exposure condition is discussed with respect to the mechanical and electrical properties.

• Korean Journal of Materials Research
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• v.9 no.1
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• pp.65-72
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• 1999

In order to minimize flexible printed circuit(FPC), which is used in computer, communication, medical facility, aviation space industry, it is required to improve the interfacial adhesion of polymide/epoxy or polyimide/polyimide consists of FPC. In this study, it was considered to improve the adhesion strength of polyimide/epoxy joint by introducing functional group on polyimide film and improving mechanical property of epoxy. Functional group on polyimide film was introduced by changing polyimide film surface to polyamic acid in KOH aqueous solution. The optimum conditions for surface modification were the concentration of 1M KOH and treatment time of 5min. Also, the optimum adhesion strength of polyimide/epoxy joint was obtained using rubber modified epoxy and polyamic acid as a base resin and curing agent of epoxy adhesive, respectively. The degree of surface modification of polyimide film examined with contact angle measurement of FTIR, thus modification of polyimide to polyamic acid was identified. Fracture surface of plymide/epoxy joint was analyzed by scanning electron microscopy, and modified polyamic acid reimidezed to polymide as increasing curing temperature.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.75-81
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• 2017

The effects of KOH pretreatment and annealing conditions on the interfacial adhesion and the reliability between epoxy resin and polyimide substrate in the flexible printed circuit board were quantitatively evaluated using $180^{\circ}$ peel test. The initial peel strength of the polyimide without the KOH treatment was 29.4 g/mm and decreased to 10.5 g/mm after 100hrs at $85^{\circ}C/85%$ R.H. temperature/humidity treatment. In case of the polyimide with annealing after KOH treatment, initial peel strength was 29.6 g/mm and then maintained around 27.5 g/mm after $85^{\circ}C/85%$ R.H. temperature/humidity treatment. Systematic X-ray photoelectron spectroscopy analysis results showed that the peel strength after optimum annealing after KOH treatment was maintained high not only due to effective recovery of the polyimide damage by the polyimide surface treatment process, but also effective removal of metallic ions and impurities during various wet process.

• Composites Research
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• v.34 no.3
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• pp.148-154
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• 2021

Carbon/epoxy composite bipolar plate (BP) is a BP that is likely to replace existing graphite bipolar plate of vanadium redox flow cell (VRFB) due to its high mechanical properties and productivity. Multi-functional carbon/epoxy composite BP requires graphite coating or additional surface treatment to reduce interfacial contact resistance (ICR). However, the expanded graphite coating has the disadvantage of having low durability under VRFB operating conditions, and the surface treatments incur additional costs. In this work, an excessive resin absorption method is developed, which uniformly removes the resin rich area on the surface of the BP to expose carbon fibers by applying polyester fabric. This method not only reduces ICR by exposing carbon fibers to BP surfaces, but also forms a unique ditch pattern that can effectively hold carbon felt electrodes in place. The acidic environmental durability, mechanical properties, and gas permeability of the developed carbon/epoxy composite BP are experimentally verified.

• Journal of Information Display
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• v.4 no.1
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• pp.17-23
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• 2003

A thermoset type anisotropic conductive adhesive film (ACAF) comprising epoxy resin and natural butyl rubber (NBR) as the binder, micro-encapsulated imidazole as the curing agent, and Ni/Au coated polymer bead as a conductive particle has been studied. These films have been prepared to respond to requirements such as improved contact resistance, current status less of than 60 ${\mu}m$ and reliability. These films can also be used for connection between the ITO glass for LCD panel and the flexible circuit board. The curing conditions for the connection were 40, 20 and 15 seconds at 150, 170 and 190 $^{\circ}C$, respectively. The initial contact resistance and adhesion strength were 0.5 ${\Omega}/square$ and 0.4 kg/cm under the condition of 30 kgf/$^{cm}^2}$, respectively. After completing one thousand thermal shock cycling tests between -15 $^{\circ}C$ and 100 $^{\circ}C$, the contact resistance was maintained below 0.7 ${\Omega}/square$. Durability against high temperature (80$^{\circ}C$) and high humidity (85 % RH) was also tested to confirm long-term stability (1000 hrs) of the conduction.