• Title/Summary/Keyword: Flexible circuit board

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Planar Fashionable Circuit Board Technology and Its Applications

  • Lee, Seul-Ki;Kim, Bin-Hee;Yoo, Hoi-Jun
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.9 no.3
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    • pp.174-180
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    • 2009
  • A new flexible electronics technology, named P-FCB (Planar Fashionable Circuit Board), is introduced. P-FCB is a circuit board technology implemented on the plain fabric patch for wearable electronics applications. In this paper, the manufacturing of P-FCB, and its electrical characteristics such as sheet resistance, maximum current density, and frequency characteristics are reported. The fabrication methods and their electrical characteristics of passive devices such as resistor, capacitor, and inductor in P-FCB are discussed. In addition, how to integrate silicon chip directly to the fabric for the flexible electronics system are described. Finally, examples of P-FCB applications will be presented.

Wireless Audio-visual Interface over UWB

  • Cui, Wei
    • 한국정보디스플레이학회:학술대회논문집
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    • 2008.10a
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    • pp.1491-1494
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    • 2008
  • Typically internal mobile LCD display modules are connected to the mobile product baseband PCB with flexible printed circuit board equipped with board-to-board connector. This solution has a drawback of limiting the product concept work to certain solutions that are based on connector size, location, flexible PCB length, bending, etc. in the display module. Also flexible printed circuit board based solutions are not completely optimized from reliability point of view, causing flex circuit board breakings. For the external displays in the PC or Home entertainment market, the cable solution is too expensive and resource demanding. The wireless solution has obvious advantages over reliability, low cost and flexibility. This paper describes a wireless audio-visual interface solution.

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Laser Cutting of Flexible Printed Circuit Board in Liquid (연성인쇄회로기판의 액중 레이저 절단)

  • Kim, Teakgu;Kim, Joohan
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.22 no.1
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    • pp.56-62
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    • 2013
  • The laser cutting process which is flexible and rapid usually provides a better result in cutting of flexible printed circuit boards (FPCB). However, circuit-short by the re-deposition of debris from laser ablation or its heat affect zone (HAZ) on the cutting surfaces can be a problem. A laser cutting process of FPCB in the presence of liquid can minimize these negative effects. The temperature distribution of copper and polymer parts of FPCB was analyzed with numerical simulation and the experimental results were presented to evaluate this process. Generally, laser cutting under liquid has advantages of less re-deposition of carbides and less HAZ on the cutting edges. However, bubble generation and laser beam control through the liquid media should be considered carefully to obtain a successful result.

Study on High Speed Laser Cutting of Rigid Flexible Printed Circuit Board by using UV Laser with Nano-second Pulse Width (자외선 나노초 펄스 레이저를 이용한 경연성(Rigid Flexible) 인쇄전자회로기판(Printed Circuit Board) 고속 절단에 관한 연구)

  • Bae, Han-Sung;Park, Hee-Chun;Ryu, Kwang-Hyun;Nam, Gi-Jung
    • Journal of the Korean Society for Precision Engineering
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    • v.27 no.2
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    • pp.20-24
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    • 2010
  • High speed cutting processes of rigid flexible printed circuit board by making use of high power UV laser with nano-second pulse width have been proposed and investigated experimentally. Also robust laser cutting system has been designed and developed in order to obtain a good cutting quality of rigid and flexible PCB with multi-layers (2-6 layers). Power controller module developed for ourselves is adapted to control the laser output power in the range less than 1%. The systems show the good performance of cutting speed, cutting width and cutting accuracy, respectively. Especially we have confirmed that the short circuit problem due to the carbonized contamination occurred in cross section of multi-layers by thermal effect of high power laser has been improved largely by using multi-pass cutting process with low power and high speed.

Design of flexible assembly line for printed circuit board(PCB) manufacturing of amdahl company

  • Park, Kwangtae;Adiga, Sadashiv
    • Proceedings of the Korean Operations and Management Science Society Conference
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    • 1992.04b
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    • pp.159-168
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    • 1992
  • 생산라인의 line balancing이 흐름생산에 있어서 일관된 생산을 하기 위한 필수조건이다. 여러 다양한 제품을 생산하는 printed circuit board(PCB) 공장에서의 line balancing을 얻기 위해서는 mixed model line balancing절차를 설명하고자 한다.

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A RF MEMS Transmitter Based on Flexible Printed Circuit Boards (연성 인쇄 회로 기판을 이용한 초고주파 MEMS 송신기 연구)

  • Myoung, Seong-Sik;Kim, Seon-Il;Jung, Joo-Yong;Yook, Jong-Gwan
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.19 no.1
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    • pp.61-70
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    • 2008
  • This paper presents the flexible MEMS transmitter based on flexible printed circuit board or FPCB, which can be transformed to arbitrary shape. The FPCB is suitable to fabricate light weight and small size modules with the help of its thin thickness. Moreover a module based on FPCB can be attached on the arbitrary curved surface due to its flexible enough to be lolled up like paper. In this paper, the flexible MEMS transmitter integrated on FPCB for a short-distance sensor network which is based on orthogonal frequency division multiplexing(OFDM) communication system is proposed. The active device of the proposed flexible MEMS transmitter is fabricated on InGaP/GaAs HBT process which has been used for power amplifier design to take advantages of high linear and high efficient characteristics. Moreover, the passive devices such as the filter and signal lines are integrated and fabricated on the FPCB board. The performance of the fabricated flexible MEMS transmitter is analyzed with EVM characteristics of the output signal.

Miniature planar stack using the flexible Printed Circuit Board as current collectors (연성 기판을 전류 집전체로 사용한 평판형 연료전지 스택)

  • Kim, Sung-Han;Cha, Hye-Yeon;Miesse, Craig M.;Cha, Suk-Won;Jang, Jae-Hyuk
    • 한국신재생에너지학회:학술대회논문집
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    • 2008.05a
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    • pp.1-4
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    • 2008
  • Fuel cells have the potential of providing several times higher energy storage densities than those possible using current state-of-the-art lithium-ion batteries, but current energy density of fuel cell system is not better than that of lithium-ion batteries. To achieve the high energy density, volume and weight of fuel cell system need to be reduced by miniaturizing system components such as stack, fuel tank, and balance-of-plant. In this paper, the thin flexible PCB (Printed circuit board) is used as a current collector to reduce the stack volume. Two end plates are made from light weight aluminum alloy plate. The plate surface is wholly oxidized through the anodizing treatment for electrical insulation. The opening rate of cathode plate hole is optimized through unit cell performance measurement of various opening rates. The performances are measured at room temperature and ambient pressure condition without any repulsive air supply. The active area of MEA is 10.08 $cm^2$ and active area per a unit cell is 1.68 $cm^2$. The peak power density is about 210 mW/$cm^2$ and the air-breathing planar stack of 2 Wis achieved as a small volume of 18 cc.

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Design and Fabrication of Flexible Thin Multilayered Planar Coil for Micro Electromagnetic Induction Energy Harvester (초소형 전자기 유도방식 에너지 하베스터용 연성 박막 다적층 평판 코일 설계 및 제작)

  • Park, Hyunchul
    • Journal of the Korean Society for Precision Engineering
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    • v.33 no.7
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    • pp.601-606
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    • 2016
  • In this paper, an energy harvester is developed that has advantages regarding piezoelectric noise minimization, mass production, and an easily available environmental energy source, electromagnetic induction, as well as low-frequency bandwidth and high amplitude. A process for fabricating a three-dimensional multilayered planar coil using micro-electro-mechanical systems (MEMS) on a flexible printed circuit board FPCB is introduced. Optimal shape and size were calculated via internal resistance and inductance, and a prototype was fabricated through the MEMS procedure while considering the possibility of mass production. Although the internal resistance matched the designed value, the electromotive force generated did not reach the intended amount. The main reason for the decrease in efficiency was the low area of coil outskirt exposed to the magnetic field while there was relative motion between the magnet and the coil.