• 소성∙가공
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• 제33권2호
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• pp.112-117
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• 2024

In this study, the friction and wear characteristics of Inconel 600 in the superplastic forming process of Ti6Al4V were evaluated through pin-on-disc tests. To achieve an efficient and systematic experimental design, the Taguchi method was employed. The wear track of the Inconel 600 pin showed scratches in the sliding contact direction, confirming that the wear mechanism is abrasive wear. Through sensitivity analysis such as ANOVA and Main effects, it was confirmed that both normal force and sliding distance have a significant impact on the wear. Changes in sliding velocity and distance did not affect the friction coefficient, which remained relatively constant at approximately 0.380. The wear prediction model for Inconel 600 in the superplastic forming of Ti6Al4V was constructed, which can be utilized as a guideline for the prediction and management of tool wear.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2009년도 춘계학술대회 논문집
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• pp.423-424
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• 2009

• Design & Manufacturing
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• 제12권3호
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• pp.13-18
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• 2018

Flexible display tends to grow every year, It tends to be larger, slimmer, and higher in image quality. Therefore, accuracy is required in the manufacturing process of each part. In the curved monitor, the bottom chassis has a structure to which other parts can be attached. The accuracy of the curvature which the bottom chassis of the curve monitor monitors has is important. If the curvature error is large, serious defects such as cracks, warpage, twisting and the like occur. Curvature was analyzed using 3D scanner. In the Forming process and Restriking process steps, spring go occurred, and spring back occurred in the Notching process and Bending process steps. Even in the same process, it was confirmed that the curvature value varied depending on the formed shape.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.1276-1277
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• 2006

The ever increasing requirements on today's compacts with regard to their geometry and precision call for flexible high-precision and most capable production systems. DORST Technologies has coped with these requirements by developing the new HP series for pressing forces between 1600 kN and 16000 kN and the new HS series for pressing forces between 150 kN and 1200 kN. These fully hydraulic presses featuring upper ram, lower ram, core rod, filler, up to 4 lower tool levels and up to 4 upper tool levels with closed-loop controlled movements. Thanks to latest servo technology and an electronic bus system it is possible to have all movements closed-loop controlled in the desired relation to each other. Thus, today's hydraulic presses provide high stroke rates, low energy consumption and a user-friendly interface. The input of data is carried out via clearly arranged screen masks on a touch-screen. The innovative DORST $IPG^{(R)}$ (Intelligent Program Generator) has been designed to support the set-up staff in preparing and optimizing the toolprogram. The combination of the machine type with the hydraulic unit determines the productivity in consideration of the specific application and the part to be pressed. Thanks to the closed-loop control circuits, DORST hydraulic automatic presses of the latest generation ensure unmatched precision and repeatability - and consequently process reliability - often without necessitating subsequent machining steps.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 금형가공,미세가공,플라스틱가공 공동 심포지엄
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• pp.193-197
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• 2005

This paper presents a method by which multiple holes of ultra small size can be punched simultaneously. Silicon wafers were used to fabricate punching die. Workpiece used in the present investigation were the rolled pure copper of $3{\mu}m$ in thickness and CP titanium of $1.5{\mu}m$ in thickness. The metal foils were punched with the dies and arrays of circular and rectangular holes were made. The diameter of holes ranges from $2-10{\mu}m$. The process set-up is similar to that of the flexible rubber pad forming or Guerin process. Arrays of holes were punched successfully in one step forming. The punched holes were examined in terms of their dimensions, surface qualities, and potential defect. The effects of the die hole dimension on ultra small size hole formation of the thin foil were discussed. The optimum process condition such as proper die shape and diameter-thickness ratio (d/t) were also discussed. The results in this paper show that the present method can be successfully applied to the fabrication of ultra small size hole array in a one step operation.

• 열처리공학회지
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• 제30권3호
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• pp.113-116
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• 2017

100 nm thick Sn doped ZnO (ZTO) single layer, 15 nm thick Ag buffered ZTO (ZTO/Ag), Ag intermediated ZTO (ZTO/Ag/ZTO) and Ag capped ZTO (Ag/ZTO) films were prepared on poly-carbonate (PC) substrates by RF and DC magnetron sputtering and then the influence of the Ag thin film on the optical and electrical properties of ZTO films were investigated. As deposited ZTO thin films show the visible transmittance of 81.8%, while ZTO/Ag/ZTO trilayer films show a higher visible transmittance of 82.5% in this study. From the observed results, it can be concluded that the 15 nm thick Ag interlayer enhances the opto-electrical performance of ZTO thin films effectively for use as flexible transparent conducting oxides films in various opto-electrical applications.

• 소성∙가공
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• 제8권3호
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• pp.269-275
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• 1999

A variable blank holding force method is proposed to improve deep drawing characteristics of sheet materials. In this method, the blank holding force (BHF) is controlled throughout a drawing process so that the punch load does not exceed a critical value, which is slightly less than the conventional process with the conforming process with the variable BHF is more flexible than the conventional process with the constant BHF and it could be used for improving the product's quality and drawability. In this paper we suggest a method controlling the BHF as a function of punch travel during the forming process. The optimization BHF curves are determined theoretically and experimentally. It is concluded that for the case of optimum BHF control methods the drawn cup height and the drawing formability achieved by this method are increased than those for constant BHF method. Also, as comparing the wall thickness distribution of the cup drawn by the constant BHF and the optimum BHF control, the BHF control reduce the wall thickness variation of the drawn cup at the cup wall and make the cup thickness distribution more uniformly than the constant BHF.

• 한국전기전자재료학회논문지
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• 제36권5호
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• pp.454-462
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• 2023

금속 나노 입자의 플래시 램프 어닐링 공정은 빠른 가공 속도(밀리초 단위), 저온 공정, 롤투롤 공정과의 호환성 등 이유로 유연한 기판 위에 고성능 전극을 제조하기 위한 강력한 솔루션으로 제공되어 왔다. 그러나 금속 나노 입자[예를 들면, 금(Au), 은(Ag), 구리(Cu) 등]는 저온 공정을 위한 미세 금속 나노 입자(직경 10 nm 미만)의 제조가 어렵고, 고가이며, 잉크보관 및 플래시 램프 어닐링 과정에서 산화가 발생하는 등의 한계가 존재했다. 이러한 이유로 유기금속화합물 잉크는 금속 나노 입자를 대체할 수 있는 재료로서 저렴한 가격(기존 금속 나노 잉크 대비 1/100의 가격)과 저온 공정성, 높은 재료 안정성으로 인해 제안되었다. 하지만 이러한 장점에도 불구하고, 유기금속화합물의 플래시 램프 어닐링 처리를 통한 유연한 전극의 제조는 광범위하게 연구되지 않고 있다. 본 논문에서는 사전 경험 없이 은 유기금속화합물을 플래시 램프 어닐링하는 과정에서 발생할 수 있는 어려움을 최소화하기 위해 재료 매개변수와 플래시광 처리 매개변수(에너지 밀도, 펄스 지속시간 등)를 고려하여 유연 기판에 전극을 제조하기 위한 최적의 조건을 결정하는 방법을 실험적으로 가이드하고자 한다.

• 예술인문사회 융합 멀티미디어 논문지
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• 제7권6호
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• pp.897-906
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• 2017

프로젝션 맵핑(공간증강현실)은 현실세계에서 다양한 가상의 환영(幻影)을 만들어내는 것으로 최근에 많은 분야에 사용되고 있다. 기존의 프로젝션 맵핑에서는 사용자와의 자연스러운 상호작용으로서 접히거나 구부러지는 것 과 같은 유연한 물체의 기하학적인 변형 속성(예: 용지)의 움직임을 고려하지 않았다. 또한, 정적 물체에 대한 프로젝션 맵핑에 대한 많은 연구가 있었지만, 유연한 타깃의 움직임을 추적하고 사용자와의 상호작용 측면에서 모양이 변형된 물체에 맵핑을 정확히 하는 다이내믹 프로젝션 맵핑은 여전히 도전해야할 연구 분야이다. 따라서 본 논문에서는 Unity3D와 ARToolkit을 이용한 실험을 통해 단단하지 않은 물체에 대한 견실한 추적과 정확한 맵핑 방법을 제안한다. 제안하는 방법은 큐빅 베지어 곡면 형성, 움직임 변형 값 렌더링 과정, 멀티플 마커 인식과 트래킹 과정, 실시간 웹캠 지속 촬영의 4가지 실험 단계로 구성된다. 사용자는 물체에 변형을 주기 위해 직접 접고, 휘고, 구부리고 비틀 수 있다. 제안 방법은 세 가지 긍정적인 결과를 도출할 수 있다. 첫째, 물체의 형태가 강하게 변형되어 있어도 감지 가능하다. 둘째, 사용자가 직접 물체에 변형을 주는 과정에서 물체의 일부분을 차단하고 있을 때의 Occlusion오류를 줄일 수 있어 정확한 트래킹을 할 수 있다. 셋째, 제안 방법의 견실하고 정확함은 빠른 속도로 물체의 움직임을 감지하게 하므로 실시간으로 결과 값을 물체에 투영할 수 있다.

• 소성∙가공
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• 제15권1호
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• pp.9-14
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• 2006

In the present research, the simultaneous punching of ultra small size hole of $2\~10\;{\mu}m$ in diameter on flat rolled thin metal foils was conducted with elastic polymer punch. Workpiece used in the present investigation were the rolled pure copper of $3{\mu}m$ in thickness and CP titanium of 1.5fm in thickness. The metal foils were punched with the dies and arrays of circular and rectangular holes were made. The process set-up is similar to that of the flexible rubber pad farming or Guerin process. Arrays of holes were punched successfully in one step forming. The punched holes were examined in terms of their dimensions. The effects of the wafer die hole dimension and heat treatment of the workpiece on ultra small size hole formation of the thin foil were discussed. The process condition such as proper die shape, pressure, pressure rate and diameter-thickness ratio (d/t) were also discussed. The results in this paper show that the present method can be successfully applied to the fabrication of ultra small size hole away in a one step operation.