• Journal of Welding and Joining
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• 제32권3호
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• pp.34-42
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• 2014

Flexible devices have been developed from their rigid, heavy origins to become bendable, stretchable and portable. Such a paper displays, e-skin, textile electronics are emerging research areas and became a mainstream of overall industry. Thin film transistors, diodes and sensors built on plastic sheets, textile and other unconventional substrates have a potential applications in wearable displays, biomedical devices and electronic system. In this review, we describe current trends in technologies for flexible/wearable electronics.

• 센서학회지
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• 제26권5호
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• pp.301-305
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• 2017

This paper presents a wearable human health-monitoring band. The band consists of a body temperature detector (BTD) and a hear rate detector (HRD). The BTD and HRD are realized using an inkjet-printed flexible temperature sensor and a commercial heart rate sensor module, respectively. The sensitivity of the fabricated BTD was found to be $-31/^{\circ}C$ with a linearity of 99.82%. The HRD using the commercial heart rate sensor module has a good performance with a standard deviation of 0.85 between the data of a commercial smart watch and the fabricated HRD.

• 마이크로전자및패키징학회지
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• 제19권3호
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• pp.15-20
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• 2012

In electronics industry, the coming electronic devices will be expected to be high integration and convergence electronics. And also, it will be expected that the coming electronics will be flexible, bendable and wearable electronics. Therefore, the demands and interests of bonding technology between flexible substrate and chip for mobile electronics, e-paper etc. have been increased because of weight and flexibility of flexible substrate. Considering fine pitch for high density and thermal damage of flexible substrate during bonding process, the micro solder bump technology for high density and low temperature bonding process for reducing thermal damage will be required. In this study, we researched on bonding technology of chip and flexible substrate by using 25um Cu pillar bumps and Sn-Bi solder bumps were formed by electroplating. From the our study, we suggest technology on Cu pillar bump formation, Sn-Bi solder bump formation, and bonding process of chip and flexible substrate for the coming electronics.

• 한국세라믹학회지
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• 제54권6호
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• pp.518-524
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• 2017

A flexible thermoelectric device using body heat has drawn attention as a power source for wearable devices. In this study, thermoelectric thick films were fabricated by cold pressing method using p-type antimony telluride and n-type bismuth telluride powders in accordance with specific loads. Thermoelectric thick films were denser and improved the electrical and thermoelectric properties while increasing the load of the cold pressing. The thickness of the specimen can be controlled by the amount of material; specimens were approximately 700 um in thickness. Flexible thermoelectric devices were manufactured by using the thermoelectric thick films on PI (Polyimide) substrate. The process is cheap, efficient, easy and scalable. Evaluation of power generation performance and flexibility on the fabricated flexible thermoelectric device was carried out. The flexible thermoelectric device has great flexibility and good performance and can be applied to wearable electronics as a power source.

• JSTS:Journal of Semiconductor Technology and Science
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• 제9권3호
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• pp.174-180
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• 2009

A new flexible electronics technology, named P-FCB (Planar Fashionable Circuit Board), is introduced. P-FCB is a circuit board technology implemented on the plain fabric patch for wearable electronics applications. In this paper, the manufacturing of P-FCB, and its electrical characteristics such as sheet resistance, maximum current density, and frequency characteristics are reported. The fabrication methods and their electrical characteristics of passive devices such as resistor, capacitor, and inductor in P-FCB are discussed. In addition, how to integrate silicon chip directly to the fabric for the flexible electronics system are described. Finally, examples of P-FCB applications will be presented.

• 한국전기전자재료학회논문지
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• 제35권2호
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• pp.119-128
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• 2022

Recent advancement of Internet of Things (IoT) and energy harvesting technology enable realization of flexible thermoelectric energy harvester (f-TEH), with technological prowess for use in biomedical monitoring system integrated applications. To expand a flexible thermoelectric energy harvesting platform, the f-TEH must be required for optimized flexible thermoelectric materials and device structure. In response to these demands related to thermoelectric energy harvesting, many research groups have investigated various f-TEHs applied as a power source for wearable electronics. As a key member of the f-TEH, film-based f-TEHs possess significant applicability in research to realize self-powered wearable electronics, owing to their excellent flexibility, low thermal conductivity, and convenient fabrication process. Thus, based on the rapid growth of thermoelectric film technology, this review aims to overview comprehensively the f-TEH made of various inorganic/organic thermoelectric materials including developed fabrication methods, high thermoelectric performance, and wide-range applications.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.392.1-392.1
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• 2016

Nowadays, research interest in developing the wearable devices are growing remarkably. Portable consumer electronic systems are becoming lightweight, flexible and even wearable. In fact, wearable electronics require energy storage device with thin, foldable, stretchable and conformable properties. Accordingly, developing the flexible energy storage devices with desirable abilities has become the main focus of research area. Among various energy storage devices, supercapacitors have been considered as an attractive next generation energy storage device owing to their advantageous properties of high power density, rapid charge-discharge rate, long-cycle life and high safety. The energy being stored in pseudocapacitors is relatively higher compared to the electrochemical double-layer capacitors, which is due to the continuous redox reactions generated in the electrode materials of pseudocapacitors. Generally, transition metal oxides/hydroxide (such as $Co_3O_4$, $Ni(OH)_2$, $NiFe_2O_4$, $MnO_2$, $CoWO_4$, $NiWO_4$, etc.) with controlled nanostructures (NSs) are used as electrode materials to improve energy storage properties in pseudocapacitors. Therefore, different growth methods have been used to synthesize these NSs. Of various growth methods, electrochemical deposition is considered to be a simple and low-cost method to facilely integrate the various NSs on conductive electrodes. Herein, we synthesized amorphous $NiWO_4$ NSs on cost-effective conductive textiles by a facile electrochemical deposition. The as-grown amorphous $NiWO_4$ NSs served as a flexible and efficient electrode for energy storage applications.

• 마이크로전자및패키징학회지
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• 제20권2호
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• pp.1-9
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• 2013

Recently flexible electronic devices have attracted a great deal of attention because of new application possibilities including flexible display, flexible memory, flexible solar cell and flexible sensor. In particular, development of flexible memory is essential to complete the flexible integrated systems such as flexible smart phone and wearable computer. Research of flexible memory has primarily focused on organic-based materials. However, organic flexible memory has still several disadvantages, including lower electrical performance and long-term reliability. Therefore, emerging research in flexible electronics seeks to develop flexible and stretchable technologies that offer the high performance of conventional wafer-based devices as well as superior flexibility. Development of flexible memory with inorganic silicon materials is based on the design principle that any material, in sufficiently thin form, is flexible and bendable since the bending strain is directly proportional to thickness. This article reviews progress in recent technologies for flexible memory and flexible electronics with inorganic silicon materials, including transfer printing technology, wavy or serpentine interconnection structure for reducing strain, and wafer thinning technology.

• 마이크로전자및패키징학회지
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• 제23권2호
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• pp.19-28
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• 2016

This paper presents an overview of selected advanced measurement technologies for the mechanical properties of polymers used for flexible and stretchable electronic packaging. Over the years, a variety of flexible and stretchable electronics have been developed due to their potential applications for next generation IT industry. To achieve more flexible and wearable devices for practical applications, the usage of polymeric components has been increased significantly. Therefore, accurate measurement of mechanical properties of the polymers is necessary in order to design mechanically reliable devices. However, the measurement has been challenging due to the soft nature and thin applications of polymers. Here, we describe novel measurement technologies of mechanical properties of polymers for flexible and stretchable electronics.

• Journal of Welding and Joining
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• 제31권3호
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• pp.84-88
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• 2013

These days embedded technology may be the most significant development in the electronics industry. The study focused on the development of active device embedding using flexible printed circuit in view of process and materials. The authors fabricated 30um thickness Si chip without any crack, chipping defects with a dicing before grinding process. In order to embed chips into flexible PCB, the chip pads on a chip are connected to bonding pad on flexible PCB using an ACF film. After packaging, all sample were tested by the O/S test and carried out the reliability test. All samples passed environmental reliability test. In the future, this technology will be applied to the wearable electronics and flexible display in the variety of electronics product.