• 한국안전학회지
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• 제32권2호
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• pp.34-37
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• 2017

In recent emerging industry, Display field becomes bigger and bigger, and also semiconductor technology becomes high density integration. In Flat Panel Display, there is an issue that electrostatic phenomenon results in fine dust adsorption as electrostatic capacity increases due to bigger size. Destruction of high integrated circuit and pattern deterioration occur in semiconductor and this causes the problem of weakening of thermal resistance. In order to solve this sort of electrostatic failure in this process, Soft X-ray ionizer is mainly used. Soft X-ray Ionizer does not only generate electrical noise and minute particle but also is efficient to remove electrostatic as it has a wide range of ionization. X-ray Generating efficiency has an effect on soft X-ray Ionizer affects neutralizing performance. There exist variable factors such as type of anode, thickness, tube voltage etc., and it takes a lot of time and financial resource to find optimal performance by manufacturing with actual X-ray tube source. MCNPX (Monte Carlo N-Particle Extended) is used for simulation to solve this kind of problem, and optimum efficiency of X-ray generation is anticipated. In this study, X-ray generation efficiency was measured according to target material thickness using MCNPX under the conditions that tube voltage is 5 keV, 10 keV, 15 keV and the target Material is Tungsten(W), Gold(Au), Silver(Ag). At the result, Gold(Au) shows optimum efficiency. In Tube voltage 5 keV, optimal target thickness is $0.05{\mu}m$ and Largest energy of Light flux appears $2.22{\times}10^8$ x-ray flux. In Tube voltage 10 keV, optimal target Thickness is $0.18{\mu}m$ and Largest energy of Light flux appears $1.97{\times}10^9$ x-ray flux. In Tube voltage 15 keV, optimal target Thickness is $0.29{\mu}m$ and Largest energy of Light flux appears $4.59{\times}10^9$ x-ray flux.

• Journal of Electrical Engineering and Technology
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• 제13권4호
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• pp.1638-1643
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• 2018

Multi-layer ceramic capacitors as decoupling capacitor were fabricated by dielectric composition with a high dielectric constant. The fabricated decoupling capacitors were embedded in the PCB of the 10G RF transceiver module and evaluated for the characteristics of electrical noise by the level of AC input voltage. In order to further improve the electrical properties of the $BaTiO_3$ based composite, glass frit, MgO, $Y_2O_3$, $Mn_3O$, $V_2O_5$, $BaCO_3$, $SiO_2$, and $Al_2O_3$ were used as additives. The electrical properties of the composites were determined by various amounts of additives and optimum sintering temperature. As a result of the optimized composite, it was possible to obtain a density of $5.77g/cm^3$, a dielectric constant of 1994, and an insulation resistance of $2.91{\times}10^{12}{\Omega}$ at an additive content of 5wt% and a sintering temperature of $1250^{\circ}C$. After forming a $2.5{\mu}m$ green sheet using the doctor blade method, a total of 77 layers were laminated and sintered at $1180^{\circ}C$. A decoupling capacitor with a size of $0.6mm(W){\times}0.3mm(L){\times}0.3mm(T)$ (width, length and thickness, respectively) and a capacitance of 100 nF was embedded using a PCB process for the 10G RF Transceiver modules. In the range of AC input voltage 400mmV @ 500kHz to 2200mV @ 900kHz, the embedded 10G RF Transceiver modules evaluated that it has better electrical performance than the non-embedded modules.

• 한국건설순환자원학회논문집
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• 제11권2호
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• pp.97-104
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• 2023

본 연구에서는 순환잔골재 사용량 증대를 목적으로 순환잔골재만 혼입한 고강도 모르타르를 제조하고 이의 물성을 분석하여, 순환잔골재의 구조용 골재로서의 활용가능성을 파악하고자 하였다. 시멘트, 실리카퓸 및 고로슬래그 미분말을 함유한 물결합 재비 0.2 시멘트 모르타르에, 나노실리카를 추가로 혼입하고 이의 치환율을 변화시켜, 나노실리카 혼입량 변화가 순환잔골재 모르타르의 물성 변화에 미치는 영향을 분석하였다. 시험체 제작 시 결합재 내부에서의 나노실리카 분산도 향상을 위해, 초음파 처리한 수분산된 나노실리카 수용액을 활용하였고, 나노실리카의 혼입률은 1 %까지 변화시켜 모르타르 플로우, 공극률 및 압축강도의 변화를 평가하였다. 실험 결과에 따르면, 나노실리카의 혼입률이 증가할수록 모르타르 플로우는 감소하였으며, 나노실리카 혼입률 0.75 %까지는 혼입율을 높일수록 공극률은 감소하고 압축강도는 증가하였으나, 치환율 1 %에서는 공극률의 상승 및 압축강도의 저하가 관찰되어, 나노실리카 혼입률 0.75 %가 성능 최적화를 위해 가장 적절한 혼입 비율인 것을 확인할 수 있었다.