• Title/Summary/Keyword: Finite substrate

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A study on the Fabrication and characterization of temperature Sensor using surface acoustic wave (표면 탄성파를 이용한 온도센서의 제작 및 특성에 대한 연구)

  • Park Jae-Hong;Kim Jae-Hwan
    • Journal of the Korean Society for Precision Engineering
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    • v.23 no.4 s.181
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    • pp.139-145
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    • 2006
  • This paper presents the design and manufacturing of a sensor using SAW and delay line in order to measure temperature. SAW sensors having single and double electrodes are manufactured on the $128^{\circ}YX-LiNbO_3$ substrate, and its process is addressed. Before manufacturing, the device is simulated using a commercial finite element program. The frequency responses of the saw sensor on the temperature change is measured. Since the center frequency on the temperature change from $-30^{\circ}C$ to $80^{\circ}C$ is linearly changed, the saw sensor is applicable to measure the temperature change or strain variation.

Finite Element Analysis for Shot Blasting Process Optimization of Stainless Steel (유한요소해석을 이용한 스테인리스 스틸의 쇼트 블라스팅 공정 최적화)

  • Song, Seung Youp;Park, Junyoung;Kim, Jun-Sik
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.12 no.1
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    • pp.22-27
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    • 2013
  • A shot blasting process is to improve the surface quality of stainless steels. The process is similar to a well-known shot peening that is used to strengthen the surface via the residual stress. In the shot blasting process, it is important to decide many parameters, such as the size, incident angle and velocity of shot balls, to effectively get rid of the iron oxide on the surface of stainless steels. In this study, the simulation of the shot blasting process is carried out by a finite element software, which can help to find out the optimal design parameters to cause the delamination of the iron oxide from the stainless steel substrate. The results obtained are also compared to those of the discrete element method to verify them.

A Study on the Design of Wideband Antenn as using U-Slot Patches (U-Slot 패치를 이용한 광대역 안테나의 설계에 관한 연구)

  • Kim Won-Bae
    • The Transactions of the Korean Institute of Electrical Engineers D
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    • v.54 no.3
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    • pp.180-185
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    • 2005
  • Microstrip antennas generally have a lot of advantages that are thin profile, lightweight, low cost, and conformability to a shaped surface application with integrated circuitry. In addition to military applications, they have become attractive candidates in a variety of commercial applications such as mobile satellite communications, the direct broadcast system (DBS), global positioning system (GPS), and remote sensing. Recently, many of the researches have been achieved for improving the impedance bandwidth of microstrip antennas. The basic form of the microstrip antenna, consisting of a conducting patch printed on a grounded substrate, has an impedance bandwidth of $1\~2\%$. For improvement of narrow bandwidth of microstrip patch, we were designed U-slot microstrip patch antenna in this paper. This antenna had wide bandwidth for all personal communication services (PCS) and IMT-2000. For the design of U-slot microstrip patch antenna using a finite difference time domain(FDTD) method. This numerical method could get the frequency property of U-slot patch antenna and the electromagnetic fields of slots.

Contact Damage and Fracture of Poreclain/Glass-Infiltrated Alumina Layer Structure for Dental Application (치아 응용을 위한 /유리침윤 알루미나 이중 층상구조의 접촉손상 및 파괴)

  • 정연길;여정구;최성설
    • Journal of the Korean Ceramic Society
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    • v.35 no.12
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    • pp.1257-1265
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    • 1998
  • Hertzian contact tests were used to investigate the evolution of fracturedamage in the coating layer as functions of contact load and coating thickness by studying crack patterns in porcelain on glass-infiltrated alumina bilayer system conceived to simulate the crown structure of a tooth. Cone cracks initiated at the coating top surface without delamination at interface and crack propagation to substrate. Preferentially the cracks made multi-cracks at the coating top surface rather than proceeding to interface. The cracks were highly stabilized with wide ranges between the loads to initiate first cracking and to cause final failure im-plying damage-tolerant capability. Finite element modelling was used to evaluate the stress distribution. Maximum tensile stress were responsible for the cracking at the coating layer and had a profound influence on the crack pattern and fracture damage in the layered structure materials.

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FRP or steel plate-to-concrete bonded joints: Effect of test methods on experimental bond strength

  • Chen, J.F.;Yang, Z.J.;Holt, G.D.
    • Steel and Composite Structures
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    • v.1 no.2
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    • pp.231-244
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    • 2001
  • The strengthening of reinforced concrete structures using externally bonded steel or advanced fibre reinforced plastic (FRP) composites is becoming increasingly common. A key factor affecting the behaviour and reliability of such strengthened structures is the bond strength between the steel or FRP plate and the concrete substrate. Several different experimental set-ups have previously been used to determine bond strength. This paper presents a careful finite element analysis of the stress distributions in these test set-ups. Results show that stress distributions can be significantly different for different set-ups, for similar materials and geometry.

Simultaneous Switching Noise Reduction Technique in Multi-Layer Boards using Conductive Dielectric Substrate (전도성 유전기판을 이용한 다층기판에서의 Simultaneous Switching Noise 감소 기법)

  • 김성진;전철규;이해영
    • Journal of the Microelectronics and Packaging Society
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    • v.6 no.4
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    • pp.9-14
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    • 1999
  • In this paper, we proposed a simultaneous switching noise (SSN) reduction technique in multi-layer boards (MLB) for high-speed digital applications and analyzed it using the Finite Difference Time Domain (FDTD) method. The new structure using conductive dielectric substrates is effective for the reduction of SSN couplings and resonances. The uniform insertion of the conducive layer reduced the SSN coupling and resonance by 85% and the partial insertion only around the edges reduced by 55% respectively.

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Alleviating Deformation of MEMS Structure in Surface Micromachining (표면미세가공시 발생하는 MEMS 구조물의 변형 억제)

  • Hong Seok-Kwan;Kweon Soon-Cheol;Jeon Byung-Hee;Shin Hyung-Jae
    • Journal of the Korean Society for Precision Engineering
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    • v.23 no.8 s.185
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    • pp.163-170
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    • 2006
  • By removing sacrificial layer through ashing process, movable MEMS structure on substrate can be fabricated in surface micromachining. However, MEMS structure includes, during the ashing process, the warping or buckling effects due to stress gradient along the vertical direction of thin film. In this study, we presented method for counteracting the unwanted deflection of MEMS structure and designed using character of deposit process to overcome limited design conditions. Unit cell patterns were designed with character of deposit shape, and their final shapes were adopted using Finite Element Method. Finally, RF MEMS switch was fabricated by surface micro machining as test vehicles. We checked out that alleviation effect for deformation of switch improved by 35%.

Prediction of Thermal Expansion Coefficients using the Second Phase Fraction and Void of Al-AlN Composites Manufactured by Gas Reaction Method (가스반응법으로 제작된 Al-ALN 복합재의 제 2상 분율과 기공에 따른 열팽창계수 예측)

  • Yoon, Juil
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.18 no.4
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    • pp.41-47
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    • 2019
  • The advent of highly integrated, high-power electronics requires low a coefficient of thermal expansion performance to prevent delamination between the heat dissipation material and substrate. This paper reports a preliminary study on the manufacturing technology of gas reaction control composite material, focusing on the prediction of the thermal expansion coefficients of Al-AlN composite materials. We obtained numerical equivalent property values by using finite element analysis and compared the values with theoretical formulas. Al-AlN should become the optimal composite material when the proportion of the reinforcing phase is approximately 0.45.

Stability analysis of Au/YBCO film (Au/YBCO 박막의 안정성 해석)

  • 김진석;설승윤
    • Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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    • 2002.02a
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    • pp.245-248
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    • 2002
  • One dimensional conduction equation is solved by finite difference method, to analyse the stability of Au/YBCO film deposited on a sapphire substrate. Jolue heat is included in the case of current sharing state. The analysis shows the quench and recovery of superconductor depending on the amount of thermal disturbance release on the center surface of superconductor. The critical disturbance energies for different filling factor and operating current are calculated.

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A Study on the Thermal Behaviour of Layered Solids in Sliding Contacts (얇은 layer가 존재하는 접촉표면의 열적거동에 대한 연구)

  • 안효석
    • Tribology and Lubricants
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    • v.5 no.2
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    • pp.42-47
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    • 1989
  • The thermal behaviour of layerd solids, typified in practice by surface coated materials, is evaluated for the specific case of a fast moving heat source. This is intended to represent the particular instance of solids in sliding contact and the consequences of friction. The finite difference method has been utilised to establish the temperature distributions at the surface and also the sub-surface region for coating materials which are either less conductive or more conductive than the substrate to which they are attached. The effects of variation in layer thickness, and also the load, speed and friction coefficient, are evaluated.