• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.19 no.7
• /
• pp.81-88
• /
• 2020

The geometry and the defect of the groove of the part provoke a sudden change of stress in a local region. The objective of this paper is to investigate the effects of the geometry and the imperfection of a small groove on stress distributions in the vicinity of the joined region for the ABS part with a thin wall using a three-dimensional finite element analysis (FEA). Several types of groove are designed to improve joining characteristics in the vicinity joined region. The imperfection model of the small-sized groove is obtained from observation of deposition characteristics of a fused deposition modeling process. Local stress distributions in the vicinity of the joined region are predicted by the FE model with refined meshes. The influence of the angle and the imperfection of the groove on appearance regions of the maximum stress and distributions of the defined principal stress for different loading conditions is examined using the results of FEAs. Finally, a proper design of the groove is proposed to improve joining characteristics between the substrate and the ABS part.

• Journal of Surface Science and Engineering
• /
• v.41 no.6
• /
• pp.255-263
• /
• 2008

Generally, deposition mechanism of diamond particle is mainly embedding effect in the kinetic spray process. Accordingly, in spite of high cost, helium gas was employed as process gas to get high diamond fraction in the composite coating. In this study, the deposition behavior of bronze/diamond by kinetic spray process was compared using different process gas (helium and nitrogen). Bare (mean size of $5{\mu}m$, $20{\mu}m$) and nickel coated diamond (mean size of $26{\mu}m$) were deposited on Al 6061-T6 substrate with fixed process temperature and pressure. For comparison with experimental results, plastic deformation behavior of nickel layer was simulated by finite element analysis (using ABAQUS/Explicit 6.7-2). The size, broken ratio, and fraction of diamond in the composite coating were analyzed through scanning electron microscopy and image analysis method. The uniform distribution and deposition efficiency of diamond particles in the coating layer could be achieved by tailoring the physical properties of the feedstock.

• Journal of Surface Science and Engineering
• /
• v.42 no.3
• /
• pp.133-138
• /
• 2009

Effects of bipolar pulse driving frequency between 50 kHz and 250 kHz on the discharge shapes were analyzed by measuring plasma characteristics by OES (Optical Emission Spectroscopy) and Langmuir probe. Plasma characteristics were modeled by a simple electric field analysis and fluid plasma modeling. Discharge shapes by a continuous dc and bipolar pulsed dc were different as a dome-type and a vertical column-type at the cathode. From OES, the intensity of 811.5 nm wavelength, the one of the main peaks of Ar, decreased to about 43% from a continuous dc to 100 kHz. For increasing from 100 kHz to 250 kHz, the intensity of 811.5 nm wavelength also decreased by 46%. The electron density decreased by 74% and the electron temperature increased by 36% at the specific position due to the smaller and denser discharge shape for increasing pulse frequency. Through the numerical analysis, the negative glow shape of a continuous dc were similar to the electric potential distribution by FEM (Finite Element Method). For the bipolar pulsed dc, we found that the electron temperature increased to maximum 10 eV due to the voltage spikes by the fast electron acceleration generated in pre-sheath. This may induce the electrons and ions from plasma to increase the energetic substrate bombardment for the dense thin film growth.

• Current Optics and Photonics
• /
• v.1 no.2
• /
• pp.143-149
• /
• 2017

LED arrays with pixel numbers of $3{\times}3$, $4{\times}4$, and $5{\times}5$ have been studied in this paper in order to enhance the optical output power and decrease heat dissipation of an AlGaInP-based light emitting diode display device (pixel size of $280{\times}280{\mu}m$) fabricated by micro-opto-electro-mechanical systems. Simulation results showed that the thermal resistances of the $3{\times}3$, $4{\times}4$, $5{\times}5$ arrays were $52^{\circ}C/W$, $69.7^{\circ}C/W$, and $84.3^{\circ}C/W$. The junction temperature was calculated by the peak wavelength shift method, which showed that the maximum value appears at the center pixel due to thermal crosstalk from neighboring pixels. The central temperature would be minimized with $40{\mu}m$ pixel pitch and $150{\mu}m$ substrate thickness as calculated by thermal modeling using finite element analysis. The modeling can be used to optimize parameters of highly integrated AlGaInP-based LED arrays fabricated by micro-opto-electro-mechanical systems technology.

• Journal of the Korean Society for Railway
• /
• v.19 no.4
• /
• pp.468-479
• /
• 2016

In order to supply power to online monitoring systems that are attached to high voltage catenary or overhead wires, a wireless power transfer system is required that is able to transmit power over the insulation gap. Such wireless power transfer systems have transmitter and receiver coils that have diameters of over 10cm. This paper focused on an investigation of the sources of loss in the coils when the coils are fabricated using printed circuit board technology. Using finite element simulation results, it has been shown that the dielectric loss in the substrate was the dominant source of the total loss. It has been demonstrated that the selection of a proper dielectric material was the most critical factor in reducing the loss. For further reduction of the loss, the distributed tuning capacitor method and the slotting of the inter-turn spaces have been proposed. For the evaluation of the proposed methods, four coils have been fabricated and their equivalent series resistances and quality factors were measured. Measured quality factors were greater than 300, which means that these devices will be helpful in achieving high coil-to-coil efficiency.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.20 no.12
• /
• pp.113-122
• /
• 2021

Complicated residual stress distributions occur in the vicinity of a deposited region via directed energy deposition (DED) process owing to the rapid heating and cooling cycle of the deposited region and the substrate. The residual stress can cause defects and premature failure in the vicinity of the deposited region. Several heat treatment technologies have been extensively researched and applied on the part deposited by the DED process to relieve the residual stress. The aim of this study was to investigate the residual stress characteristics of a specimen fabricated by DED and a quenching process using thermomechanical analyses. A coupled thermomechanical analysis technique was adopted to predict the residual stress distribution in the vicinity of the deposited region subsequent to the quenching step. The results of the finite element (FE) analyses for the deposition and the cooling measures show that the residual stress in the vicinity of the deposited region significantly increases after the completion of the elastic recovery. The results of the FE analyses for the heating and quenching stages further indicate that the residual stress in the vicinity of the deposited region remarkably increases at the initial stage of quenching. In addition, it is observed that the residual stress for quenching is lesser than that after the elastic recovery, irrespective of the deposited material.

• Current Photovoltaic Research
• /
• v.6 no.4
• /
• pp.102-108
• /
• 2018

A glass-texturing technique was developed for photovoltaic (PV) module cover glass; periodic honeycomb textures were formed by using a conventional lithography technique and diluted hydrogen fluoride etching solutions. The etching conditions were optimized for three different types of textured structures. In contrast to a flat glass substrate, the textured glasses were structured with etched average surface angles of $31-57^{\circ}$, and large aspect ratios of 0.17-0.47; by using a finite difference time-domain simulation, we show that these textured surfaces increase the amount of scattered light and reduce reflectance on the glass surface. In addition, the optical transmittance of the textured glass was markedly improved by up to 95% for wavelengths ranging from 400 to 1100 nm. Furthermore, applying the textured structures to the cover glass of the PV module with heterojunction with intrinsic thin-layer crystalline silicon solar cells resulted in improvements in the short-circuit current density and module efficiency from 39 to $40.2mA/cm^2$ and from 21.65% to 22.41%, respectively. Considering these results, the proposed method has the potential to further strengthen the industrial and technical competitiveness of crystalline silicon solar cells.

• Journal of the Microelectronics and Packaging Society
• /
• v.30 no.4
• /
• pp.50-60
• /
• 2023

Ball Grid Array (BGA) is a widely used package type due to its high pin density and good heat dissipation. In BGA, solder balls play an important role in electrically connecting the package to the PCB. Therefore, understanding the inelastic deformation of solder balls under various mechanical loads is essential for the robust design of semiconductor packages. In this study, the geometrical effect on the inelastic deformation and fracture of solder balls were analyzed by finite element analysis. The results showed that fracture occurred in both tilted and hourglass shapes under shear loading, and no fracture occurred in all cases under compressive loading. However, when bending was applied, only the tilted shape failed. When shear and bending loads were combined with compression, the stress triaxiality was maintained at a value less than zero and failure was suppressed. Furthermore, a comparison using the Lagrangian-Green strain tensor of the critical element showed that even under the same loading conditions, there was a significant difference in deformation depending on the shape of the solder ball.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.02a
• /
• pp.176-177
• /
• 2013

Surface plasmon polaritons (SPPs) have attracted the attention of scientists and engineers involved in a wide area of research, microscopy, diagnostics and sensing. SPPs are waves that propagate along the surface of a conductor, usually metals. These are essentially light waves that are trapped on the surface because of their interaction with the free electrons of conductor. In this interaction, the free electrons respond collectively by oscillating in resonance with the light wave. The resonant interaction between the surface charge oscillation and the electromagnetic field of the light constitutes the SPPs and gives rise to its unique properties. In this papers, we studied theoretical and experimental extraordinary transmittance (T) and reflectance (R) of 2 dimensional metal hole array (2D-MHA) on GaAs in consideration of the diffraction orders. The 2d-MHAs was fabricated using ultra-violet photolithography, electron-beam evaporation and standard lift-off process with pitches ranging from 1.8 to $3.2{\mu}m$ and diameter of half of pitch, and was deposited 5-nm thick layer of titanium (Ti) as an adhesion layer and 50-nm thick layer of gold (Au) on the semiinsulating GaAs substrate. We employed both the commercial software (CST Microwave Studio: Computer Simulation Technology GmbH, Darmstadt, Germany) based on a finite integration technique (FIT) and a rigorous coupled wave analysis (RCWA) to calculate transmittance and reflectance. The transmittance was measured at a normal incident, and the reflectance was measured at variable incident angle of range between $30^{\circ}{\sim}80^{\circ}$ with a Nicolet Fourier transmission infrared (FTIR) spectrometer with a KBr beam splitter and a MCT detector. For MHAs of pitch (P), the peaks ${\lambda}$ max in the normal incidence transmittance spectra can be indentified approximately from SP dispersion relation, that is frequency-dependent SP wave vector (ksp). Shown in Fig. 1 is the transmission of P=2.2 um sample at normal incidence. We attribute the observation to be a result of FTIR system may be able to collect the transmitted light with higher diffraction order than 0th order. This is confirmed by calculations: for the MHAs, diffraction efficiency in (0, 0) diffracted orders is lower than in the (${\pm}x$, ${\pm}y$) diffracted orders. To further investigate the result, we calculated the angular dependent transmission of P=2.2 um sample (Fig. 2). The incident angle varies from 30o to 70o with a 10o increment. We also found the splitting character on reflectance measurement. The splitting effect is considered a results of SPPs assisted diffraction process by oblique incidence.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.02a
• /
• pp.334-334
• /
• 2013

In the past decade, the infrared detectors based on intersubband transition in quantum dots (QDs) have attracted much attention due to lower dark currents and increased lifetimes, which are in turn due a three-dimensional confinement and a reduction of scattering, respectively. In parallel, focal plane array development for infrared imaging has proceeded from the first to third generations (linear arrays, 2D arrays for staring systems, and large format with enhanced capabilities, respectively). For a step further towards the next generation of FPAs, it is envisioned that a two-dimensional metal hole array (2D-MHA) structures will improve the FPA structure by enhancing the coupling to photodetectors via local field engineering, and will enable wavelength filtering. In regard to the improved performance at certain wavelengths, it is worth pointing out the structural difference between previous 2D-MHA integrated front-illuminated single pixel devices and back-illuminated devices. Apart from the pixel linear dimension, it is a distinct difference that there is a metal cladding (composed of a number of metals for ohmic contact and the read-out integrated circuit hybridization) in the FPA between the heavily doped gallium arsenide used as the contact layer and the ROIC; on the contrary, the front-illuminated single pixel device consists of two heavily doped contact layers separated by the QD-absorber on a semi-infinite GaAs substrate. This paper is focused on analyzing the impact of a two dimensional metal hole array structure integrated to the back-illuminated quantum dots-in-a-well (DWELL) infrared photodetectors. The metal hole array consisting of subwavelength-circular holes penetrating gold layer (2DAu-CHA) provides the enhanced responsivity of DWELL infrared photodetector at certain wavelengths. The performance of 2D-Au-CHA is investigated by calculating the absorption of active layer in the DWELL structure using a finite integration technique. Simulation results show the enhanced electric fields (thereby increasing the absorption in the active layer) resulting from a surface plasmon, a guided mode, and Fabry-Perot resonances. Simulation method accomplished in this paper provides a generalized approach to optimize the design of any type of couplers integrated to infrared photodetectors.