• Journal of the Institute of Electronics Engineers of Korea TC
• /
• v.46 no.2
• /
• pp.114-125
• /
• 2009

Effect of a finite square substrate plane on the radiation characteristics of a microstrip patch antenna is investigated. Effect of a finite square substrate plane on the resonance frequency and bandwidth is very small, while that on the radiation pattern is very large. The gain of front radiation and the direction of the maximum gain vary almost periodically with the length of a square substrate plane. The length of a square substrate plane for the maximum gam and the minimum gain of front radiation decrease as the electrical thickness of a substrate increases. The variation of the gain of front radiation with the length of a square substrate plane increases as the electrical thickness of a substrate increases. The variation of the radiation pattern with the length of a square substrate plane is almost determined by the electrical thickness of a substrate.

• Journal of the Institute of Electronics Engineers of Korea TC
• /
• v.46 no.6
• /
• pp.118-127
• /
• 2009

Effect of a finite square substrate plane on the radiation characteristics of a microstrip patch antenna is investigated. Excellent agreements between the simulation and measured results on the radiation characteristics of patch antennas for various square substrate thicknesses and sizes are obtained. The effect of a square substrate plane on the resonant frequency and bandwidth is small, while that on the radiation pattern is large. As the substrate thickness increases, the variations of the gain of the broadside radiation, the direction of the maximum radiation, and the radiation pattern increase for the variation of a substrate size. The maximum gain difference between the broadside radiation and back radiation and the large gain of broadside radiation are obtained when the length of a side of a square substrate plane is $0.8\;{\lambda}_0$.

• Journal of Electrical Engineering and Technology
• /
• v.10 no.4
• /
• pp.1738-1745
• /
• 2015

Radiation characteristics of a probe-fed rectangular microstrip patch antenna printed on a finite grounded high permittivity substrate are investigated systematically for various square grounded dielectric substrate sizes with several thicknesses and dielectric constants by experiment and full wave simulation. The effect of the substrate size on the radiation characteristics of a rectangular patch antenna is mainly determined by the effective dielectric constant of surface waves on a grounded dielectric substrate. As the effective dielectric constant of surface waves increases, the substrate sizes for the maximum broadside gain and the required onset for a large magnitude of squint angle decrease, while the variations of the broadside gain, the front-to-back ratio, and the magnitude of squint angle versus the substrate size increase due to the increase of the power of the surface wave.

• The Transactions of the Korean Institute of Electrical Engineers C
• /
• v.50 no.5
• /
• pp.243-248
• /
• 2001

In this paper, we present theoretical and experimental study on the viscous damping of the on-substrate torsional micromirrors, oscillating near the silicon substrates. In this theoretical study, we develop theoretical models and test structures for the viscous damping of the on-substrate torsional micromirrors. From a finite element analysis, we estimate the theoretical damping coefficients of the torsional micromirrors. From a finite element analysis, we estimate the theoretical damping coefficients of the torsional micromirrors, fabricated by the surface-micromaching process. From the electrostatic test of the fabricated devices, frequency-dependent rotationalvelocity of the micromirrors has been measured at the atmospheric pressure using devices, frequency-dependent rotational velocity of the micromirrors has been measured at the atmospheric pressure using the Mach-Zehnder interferometer system. Experimental damping coefficients have been extracted from the least square fit of the measured rotational velocity within the filter bandwidth of 150 kHz. We have compared the theoretical values and the experimental results on the dynamic performance of the micromirrors. The theoretical analysis overstimates the resonant frequency in the amount of 15%, while underestimating the viscous damping in the factors of 10%.

• Korean Journal of Materials Research
• /
• v.22 no.9
• /
• pp.482-488
• /
• 2012

To fabricate a precise micro metal mold, the electrochemical etching process has been researched. We investigated the electrochemical etching process numerically and experimentally to determine the etching tendency of the process, focusing on the current density, which is a major parameter of the process. The finite element method, a kind of numerical analysis, was used to determine the current density distribution on the workpiece. Stainless steel(SS304) substrate with various sized square and circular array patterns as an anode and copper(Cu) plate as a cathode were used for the electrochemical experiments. A mixture of $H_2SO_4$, $H_3PO_4$, and DIW was used as an electrolyte. In this paper, comparison of the results from the experiment and the numerical simulation is presented, including the current density distribution and line profile from the simulation, and the etching profile and surface morphology from the experiment. Etching profile and surface morphology were characterized using a 3D-profiler and FE-SEM measurement. From a comparison of the data, it was confirmed that the current density distribution and the line profile of the simulation were similar to the surface morphology and the etching profile of the experiment, respectively. The current density is more concentrated at the vertex of the square pattern and circumference of the circular pattern. And, the depth of the etched area is proportional to the current density.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2012.05a
• /
• pp.81.2-81.2
• /
• 2012

To fabricate a metal mold for injection molding, hot-embossing and imprinting process, mechanical machining, electro discharge machining (EDM), electrochemical machining (ECM), laser process and wet etching ($FeCl_3$ process) have been widely used. However it is hard to get precise structure with these processes. Electrochemical etching has been also employed to fabricate a micro structure in metal mold. A through mask electrochemical micro machining (TMEMM) is one of the electrochemical etching processes which can obtain finely precise structure. In this process, many parameters such as current density, process time, temperature of electrolyte and distance between electrodes should be controlled. Therefore, it is difficult to predict the result because it has low reliability and reproducibility. To improve it, we investigated this process numerically and experimentally. To search the relation between processing parameters and the results, we used finite element simulation and the commercial finite element method (FEM) software ANSYS was used to analyze the electric field. In this study, it was supposed that the anodic dissolution process is predicted depending on the current density which is one of major parameters with finite element method. In experiment, we used stainless steel (SS304) substrate with various sized square and circular array patterns as an anode and copper (Cu) plate as a cathode. A mixture of $H_2SO_4$, $H_3PO_4$ and DIW was used as an electrolyte. After electrochemical etching process, we compared the results of experiment and simulation. As a result, we got the current distribution in the electrolyte and line profile of current density of the patterns from simulation. And etching profile and surface morphologies were characterized by 3D-profiler(${\mu}$-surf, Nanofocus, Germany) and FE-SEM(S-4800, Hitachi, Japan) measurement. From comparison of these data, it was confirmed that current distribution and line profile of the patterns from simulation are similar to surface morphology and etching profile of the sample from the process, respectively. Then we concluded that current density is more concentrated at the edge of pattern and the depth of etched area is proportional to current density.

• Journal of Sensor Science and Technology
• /
• v.8 no.2
• /
• pp.115-123
• /
• 1999

A micro-gas sensor with heater and sensing electrode on the same plane was fabricated on phosphosilicate glass(PSG, 800nm)/$Si_3N_4$ (150nm) dielectric membrane. PSG film was provided by atmospheric pressure chemical vapor deposition(APCVD), and $Si_3N_4$ film by low pressure chemical vapor deposition (LPCVD). Total area of the fabricated device was $3.78{\times}3.78mm^2$. The area of diaphragm was $1.5{\times}1.5mm^2$, and that of the sensing layer was $0.24{\times}0.24mm^2$. Finite-element simulation was employed to estimate temperature distribution for a square-shaped diaphragm. The power consumption of Pt heater was about 85mW at $350^{\circ}C$. Tin thin films were deposited on the silicon substrate by thermal evaporation at room temperature and $232^{\circ}C$, and tin oxide films($SnO_2$) were prepared by thermal oxidation of the metallic tin films at $650^{\circ}C$ for 3 hours in oxygen ambient. The film analyses were carried out by SEM and XRD techniques. Effects of humidity and ambient temperature on the resistance of the sensing layer were found to be negligible. The fabricated micro-gas sensor exhibited high sensitivity to butane gas.