• Journal of Powder Materials
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• v.9 no.2
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• pp.124-132
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• 2002

Nano Cu powders, synthesized by Pulsed Wire Evaporation (PWE) method, have been compacted by Magnetic Pulsed Cojpaction(MPC) method. The microstructure and mechanical properties were analyzed. The optimal condition for proper mechanical properties with nanostructure was found. Both pure nano Cu powders and passivated nano Cu powders were compacted, and the effect of passivated layer on the mechanical properties was investigated. The compacts by MPC, which had ultra-fine and uniform nanostructure, showed higher density of 95% of theoretical density than that of static compaction. The pur and passivated Cu compacted at $300^{\circ}C$ exhibited maximum hardnesses of 248 and 260 Hv, respectively. The wear resistance of those compacts corresponded to the hardness.

• Journal of the Korean Physical Society
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• v.80
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• pp.117-122
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• 2022

The Belle II detector at the SuperKEKB e⁺e^- collider in Japan is designed for precise measurements of weak interaction parameters and new physics beyond the Standard Model; therefore, it requires very high instantaneous luminosity. To handle such high luminosity, the level-1 trigger system in the Belle II experiment is designed to efficiently trigger events of interest with the highest efficiency. Among many sub-detectors, track reconstruction of charged particles is performed using information collected from the central drift chamber. Therefore, the central drift chamber-based trigger plays a central role in distinguishing specific types of physics based on fast track reconstruction. To improve the longitudinal position resolution of a track vertex and for the fine-tuning of trigger signal timing, the time of the collision, which we call event time, is necessary. We developed an event time finding algorithm using the wire hit time information obtained from the central drift chamber and validated our algorithm through Monte Carlo simulation.

• Journal of Environmental Health Sciences
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• v.28 no.2
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• pp.117-129
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• 2002

Concentration of welding fumes and their components is known to be hazardous to welder and adjacent worker. To determine the generation rates of metals in fumes, $CO_2$ flux cored arc welding on stainless steel was performed in well designed fume collection chamber. Variables were different products of flux cored wire(2 domestic products and 4 foreign products) and input energy(low-, optimal- , high input energy). Mass of welding fumes was determined by gravimetric method(NIOSH 0500 method), and 17 metals were analysed by inductively coupled plasm-atomic emission spectroscopy(NIOSH 7300 method). Flux cored wire tube and flux were analysed by scanning electron microscopy to determine their metal composition. 17 metals were classified by their generation rates. Generation rates of iron, manganese, potassium and sodium were all above 50mg/min at optimal input energy level. Generation rates of chromium and amorphous silica were 25~50mg/min. At 1~25mg/min level, nickel, titanium, molybdenum, and aluminum were included. Copper, zinc, calcium, lead, magnesium, lithium, and cobalt were generated below 1 mg/min. Generation rates of metal components in fumes were influenced by input energy, types of flux cored wire. Flux cored wire was consisted of outer shell tube and inner flux. Iron, chromium, and nickel were the major components of outer tube. Flux contained iron, chromium, nickel, potassium, sodium, silica, and manganese. The use of flux cored wire can increase the hazards by increasing the amounts of fumes formed relative to that of solid wire. The reason might be the direct transfer of elements from the flux, since the flux is fine power. Ratio of metals to the fume of flux cored wire was lower than that of solid wire because non-metal components of flux were transferred. Total metal content of fumes in flux cored arc welding was 47.4(24.3~57.2) percent that is much lower than that of solid wire, 75.9 percent. We found that generation rates of iron, manganese, chromium and nickel, all well known to cause work related disease to welder, increased more rapidly with increasing input energy than those of fumes. To reduce worker exposure to fumes and hazardous component at source, further research is needed to develop new welding filler materials that decrease both the amount of fumes and hazardous components.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10b
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• pp.167-174
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• 2003

Microforming technology becomes crucial in variety of industries as up-to-date machinery products and parts are miniaturized Therefore research on micro forming processes are actively conducted because of its high productivity, high precision and efficienct material usage. Since friction during microforming has greater influence than macroforming, hydrostatic pressing is much more efficient. In this paper minimization of bur during fine sheet shear forming and hydrostatic process of multi-filament extrusion to obtain fine wire of micro-order have been conducted.

• Proceedings of the CALSEC Conference
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• 2001.08a
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• pp.105-109
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• 2001

성형의 종류 ◈금속 성형 ㆍ 스탬핑(Stamping) ㆍ 정밀 블랭킹(Fine Blanking) ㆍ 딥 드로잉(Deep Drawing) ㆍ 다이캐스팅(Die Casting) ㆍ 인베스트먼트 주조(Investment Casting) ㆍ 분말 야금(Power Metallurgy) ㆍ 인발(Wire Drawing) ㆍ 압출(Extrusion) ㆍ 단조(Forging) ㆍ ㆍ코이닝(Coining) ㆍ... ◈비금속 성형 ㆍ 사출(Injection) ㆍ 압축(Compression) ㆍ 블로우 성형(Blow Molding) ㆍ 진공 성형(Vacuum Molding) ㆍ 발포 성형(Foam Molding) ㆍ 피복(Encapsulation) ㆍ 회전식(Rotational) ㆍ 주조(Casting) ㆍ 적층(Laminating) ㆍ 압출(Extrusion) ㆍ...(중략)

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.357-360
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• 2002

Nowadays, the improvement and development of Multi-media, information and communication technology are rapidly processed. And many products, for example, digital camera, digital camcorder, and PDA, are used for them. They need large data storage capacity and small size, light storage system. Due to that, many studies and researches in data storage system have been carried out. Especially, micro drive system was presented by IBM.(1) However, its system is expensive and uneasy to be portable. In ODD technologies, 1 inch drive system is not yet or in processing status.(2) If to be possible and to be come up, it is cheap than HDD system and easy to transfer information. In this paper, a miniaturized actuator(about linch) is designed and tested for ODD system. Specially, it is adapted for NFR(Near-field Recoding) system using SIL(Solid Immersion Lens). It is the dual-servo actuator which consists of a coarse actuator and fine actuator. Its actuating force generation method is VCM(Voice Ceil Motor). The fine actuator has 4-wire suspensions and bobbin wrapped by coil and includes focusing motion as well as tracking motion. The coarse actuator has an actuating coil and V-grooved guide mechanism. Also, the characteristics of the designed actuator is estimated by sine-swept mode and LDV(Laser Doppler Vibro-meter).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.474-475
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• 2007

Wire electrical explosion(WEE) has been used for the production of fine metal particles. In WEE, electrical powder was stored and compressed into capacitor and released to produce fine particles through evaporation and condensation. In this study, the effect of applied voltage on the size of copper powders was investigated. High tension was added up to the explosion device by dividing 4 steps. At voltages lower than 5.2 kV, the fraction of powders finer than $44{\mu}m$ was almost negligible. The effectiveness of explosion increased sharply with increased voltage over 5.8 kV. At the highest voltage of 6.4 kV, more than 80% of explosion products were finer than $44{\mu}m$.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.43-55
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology. Flip chip technology eliminates the need for wire bonding by redistributing the bond pads over the entire surface of the die. Instead of wires, the die is attached to the substrate utilizing a direct solder connection. Although several steps and processes are eliminated when utilizing flip chip technology, there are several new problems that must be overcome. The main issue is the mismatch in the coefficient of thermal expansion (CTE) of the silicon die and the substrate. This mismatch will cause premature solder Joint failure. This issue can be compensated for by the use of an underfill material between the die and the substrate. Underfill helps to extend the working life of the device by providing environmental protection and structural integrity. Flux residues may interfere with the flow of underfill encapsulants causing gross solder voids and premature failure of the solder connection. Furthermore, flux residues may chemically react with the underfill polymer causing a change in its mechanical and thermal properties. As flip chip packages decrease in size, cleaning becomes more challenging. While package size continues to decrease, the total number of 1/0 continue to increase. As the I/O increases, the array density of the package increases and as the array density increases, the pitch decreases. If the pitch is decreasing, the standoff is also decreasing. This paper will present the keys to successful flip chip cleaning processes. Process parameters such as time, temperature, solvency, and impingement energy required for successful cleaning will be addressed. Flip chip packages will be cleaned and subjected to JEDEC level 3 testing, followed by accelerated stress testing. The devices will then be analyzed using acoustic microscopy and the results and conclusions reported.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.36 no.3
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• pp.15-34
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• 2004

Diverse benefits such as reduction of fresh water consumption and effluent discharge, efficient use of raw materials and energy savings can be obtained by papermaking system closure. Closure of papermaking processes, however, causes many problems including reduction of the efficiency of additives, decrease of retention and dewatering, felt plugging, poor Paper quality, generation of slime and odor, poor vacuum efficiency, etc, and it has been recognized that accumulation of Inorganic and organic substances in the process white water is the prime cause of these problems. Therefore, technological developments for preventing accumulation of these detrimental substances are urgently required for Implementing papermaking system closure. Understanding of the accumulation phenomena of the inorganic and organic substances in the papermaking process white water is prerequisite for papermaking system closure. In this study a process simulation method was used to analyze the accumulation phenomena of anionic starch In the process white water as the closure level of a fine paper making process is increased. A pilot paper machine was used as a model process. Starch adsorption and desorption models were developed based on the concept of starch adsorption ratio, which was not considered in previous studies. Steady state simulation studies were carried out based on this model using a commercial simulator. In steady state simulation, the variation of dissolved starch concentration in each process unit was monitored as a function of white water usage for wire shower. The result of the steady state simulation showed that dissolved starch concentration and its increase ratio in Process units increased as white water usage ratio for wire shower increased.

• Particle and aerosol research
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• v.14 no.4
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• pp.89-95
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• 2018

People's environmental concerns for fine particles in Korea lead to the strong necessity of improving the performance of environmental control systems. Wet electrostatic precipitators (ESPs) are considered as one of the alternatives to overcome the limit of previous dry ESPs, the re-entrainment of collected particles during rapping and back corona problem for high electrical resistivity dusts etc. In this study, a wire-cylindrical ESP with a thin water film has been developed. Particle collection characteristics were compared in the ESP with operations of water film on and off. Particle collection efficiencies at various applied voltages as well as voltage-current curves were almost the same in the ESP with and without a water film. Particle collection performance for PM1.0, PM2.5 and PM10 in the wet ESP with a water film was constantly maintained with operation time even in the high dust loading environment. This results indicate that a uniform water film in our wet ESP was successfully formed with a very thin layer without any dry spot and therefore could continuously clean the collected particles on the inner wall of the ESP without any performance degradation.