• Title/Summary/Keyword: Fine-wire

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The Study on Testability of high Speed and High Integrated Multichip Module (고속, 고집적 Multichip Module의 시험성 확보에 관한 고찰)

  • 김승곤
    • Journal of the Microelectronics and Packaging Society
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    • v.5 no.2
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    • pp.21-26
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    • 1998
  • 대용량, 고속데이터 처리가 요구되는 System 개발은 이들의 복잡하고 고기능의 회 로 구현이 가능하냐에 달려 있고 또한 이들고기능 요구를 가장 잘 만족할수 있는 패키지는 MCM 이라 할 수있다. 시스템의 고속화, 소형화는 회로의 복잡성을 요구하는 있는 이를 패 키지로 구현하는 MCM은 시험성 확보에 심각한 문제점으로 나타나고 있다. 본 논문에서는 고밀도 구조의 MCM 기판에 대한 Interconnetion Line 시험검증을 위한 Flying Prober의 적 용 및 모듈 패키징 공정에 대한 조립성 검증을 위한 BST에 대해 설명한다. 연구에 사용된 MCM 모듈은 MCM-D 공정으로 제작되었으며 31um 신호선폭, 50um Via Hole Dia. 5신호 선층 5절연층 및 455 Net의 기판으로절연층은 Dow chemical의 BCB-4024/4026을 적용하였 다. 조립은 3 ASIC, 24소자 실장 및 2000 Wire Bonding으로 이루어지며 패키지는 방열특성 을 고려한 BGA(491 I /O,50mil pitch)를 개발하여 사용하였다. MCM 기판의미세패턴으로 구성된 Interconnection Line에 대해 Fine Ptich Probing이 가능한 Flying Prober를 사용하 여 평가하였으며 BST를 이용하여 실장소자의 KGD평가 및 능동, 수동소자가 실장된 MCM Package의 조립시험성을 확보할수 있었다.

Design of High-Speed VOQ Management Scheme for High Performance Cell/Packet Switch (고성능 셀/패킷 스위치를 위한 고속 VOQ 관리기 설계)

  • 정갑중;이범철
    • Proceedings of the IEEK Conference
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    • 2001.06b
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    • pp.369-372
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    • 2001
  • This paper presents the design of high-speed virtual output queue(VOQ) management scheme for high performance cell/packet switch, which has a serial cross bar structure. The proposed VOQ management scheme has been designed for wire-speed routing with a pipelined buffer management. It provides the tolerance of requests and grants data transmission latency between the VOQ manager and central arbiter using a new request control method that is based on a high-speed shifter. The designed VOQ manager has been implemented in a field programmable gate array chip with a 77MHz operating frequency, a 900-pin fine ball grid array package, and 16$\times$16 switch size.

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Study on the Characteristics of Western Rocker Style in Mid 20th Century (20세기 중기 서양 흔들의자의 양식적 특징)

  • Lim, Seung-Taek
    • Journal of the Korea Furniture Society
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    • v.23 no.3
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    • pp.271-289
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    • 2012
  • This study analyzes the Western rocking chair style of the middle of the 20th century (1945~1970), and investigates academically characteristics from formative and practical points of view. The purpose of this study is to provide basic information on the design and production of the modern Korean rocking chair. In the 20th century, the production of the Western rocking chair displayed principles of both functionalism and optimism. These rocking chairs are constructed of various industrial materials including reinforced plastics, moulded plywood, aluminium, and steel as well as wood. Furthermore, a rocking chair suitable to the human body is made by industrial growth and innovative fabrication techniques such as designer's plastic from military in the First and Second World Wars. In those days, there are many different types of rocker style - traditional, plastics, structural, moulded plywood & bending, metal tubular, and wire mesh. More specifically, through economic prosperity and plastic development, the rocking chair is able to have light and bright colors, which shows sensible formality of the modern and structure.

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Morphology, Phase Contents, and Chemical Composition of Nanopowders Produced by the Electrical Explosion of Tin-Lead Alloy Wires

  • Kwon, Young-Soon;P. Ilyin, Alexander;V. Tichonov, Dmitrii
    • Journal of Powder Materials
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    • v.10 no.3
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    • pp.157-160
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    • 2003
  • Phase contents and elemental composition of ultradispersed powders obtained by the electrical explosion of tin-leadalloy powders are investigated. It is demonstrated that during the explosion and subsequent cooling, surface layers of powder particles are enriched in lead compared to the initial alloy. The thermal stability of powders oxidizing in air is also investigated.

Detecting Characteristics of Catalytic Combustible Gas Sensor (접촉연소식 가스 센서의 검지특성)

  • 박찬원;원창섭;유영한;안형근;한득영
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.13 no.10
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    • pp.865-870
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    • 2000
  • In this paper, catalytic combustible gas sensor was fabricated and tested under flammable gases such as CH$_4$and $C_4$H$_{10}$by using Pt coil as a heater and/or temperature sensing element. Fine $Al_2$O$_3$powder was used for a bead and Pt, Pd noble metal powder for a catalyst. Resistance variation of Pt wire was traced by the changes of the gas concentrations in a chamber. Output voltage was then monitored to obtain the gas concentration from the resistance variation. In this experiment, MgO was used to protect cracks in the based and TiO$_2$to increase the sensitivity of the sensors. Water glass was also added to enhance the selectivity to the combustible gases.s.

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Electromagnetic Characteristics of Superconducting Ceramics for Electrical Power Devices (전력기기 적용을 위한 초전도 세라믹의 전기자기적 특성)

  • Lee, Sang-Heon
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.60 no.2
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    • pp.349-351
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    • 2011
  • The formation of oxide superconducting phase fabrication of superconducting wire materials and fabrication of precise superconducting material were studied for developing superconductor application technique. The $ZrO_2$ addition reduced the particle size $BaZrO_3$ trapped in the matrix after the sintering growth. The added $ZrO_2$ was converted to fine particles of $BaZrO_3$ which is the conventional sintering temperature for YBaCuO, $Y_2Ba_1Cu_1O_5$ and CuO are formed as by products of the reaction between $ZrO_2$ and YBaCuO phase. The formation of highly $BaZrO_3$ particle appears to be responsible for the refinement of $BaZrO_3$ phase after the citric acid sintering process.

Zone-melting of EPD $YBa_2Cu_3O_x$ Thick Film under Low Oxygen Partial Pressure

  • Soh, Dea-Wha;Fan, Zhanguo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.11a
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    • pp.263-266
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    • 2003
  • The fine $YBa_2Cu_3O_x$ powder ($0.2{\sim}1.0\;{\mu}m$) is produced by sol-gel method, and electrophoresis deposition is used for the preparation of $YBa_2Cu_3O_x$ thick films which are deposited on Ag wire. The oriented $YBa_2Cu_3O_x$ was tried to be prepared by the zone-melting method under low oxygen partial pressure. The orientation and the phase composition were examined by the X-ray diffraction and the superconductivities were measured by 4 line method. The critical current densities are still quite low, which may be due to unsuitable technical parameters for zone-melting of $YBa_2Cu_3O_x$ thick films. Therefore the heat treatment condition and controlling of low oxygen partial pressure should be improved in the future experiment.

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The development of the Ionizer using clean room (청정환경용 정전기 제거장치 개발)

  • Jeong, Jong-Hyeog;Woo, Dong Sik
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.19 no.1
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    • pp.603-608
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    • 2018
  • Although the voltage-applied discharge method is most widely used in the semiconductor and display industries, periodic management costs are incurred because the method causes defects due to the absorption of ambient fine dust and causes emitter tip contamination due to the discharge. The emitter tip contamination problem is caused by the accumulation of fine particles in ambient air due to the corona discharge of the ionizer. Fuzzy ball generation accelerates the wear of the emitter tip and deteriorates the performance of the ionizer. Although a mechanical cleaning method using a manual brush or an automatic brush is effective for contaminant removal, it requires management of additional mechanical parts by the user. In some cases, contaminants accumulated in the emitter may be transferred to the wafer or product. In order to solve this problem, we developed an ionizer for a clean environment that can remove the pencil-type emitter tip and directly ionize the surrounding gas molecules using the tungsten wire located inside the ion tank. As a result of testing and certification by the Korea Institute of Machinery and Materials, the average concentration was $0.7572particles/ft^3$, the decay time was less than two seconds, and the ion valance was 7.6 V, which is satisfactory.

A Hermenutic Study of Material Language in Contemporary Metal-craft - Centerd on June Schwarcz′s Color works - (현대금속공예에 있어서 물질언어의 해석학적 분석연구 -June Schwarcz′s 색채 구조물을 중심으로 -)

  • 임옥수
    • Archives of design research
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    • v.14 no.3
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    • pp.197-210
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    • 2001
  • There are symbolicity and special meaning in the materials which are supposed to be used metalcraft from ancient to present. These are basical resources of hermeneutics and play a role as moaning elements. Generally, the precious Cold and Silver are mainly to be used with precious stone. But recently, ordinary materials like glass iron aluminum has begun to be used with them. Several artists are intentionally using them, and special skills which could be revealed by only the matherials are developing by them. In these skill, there are original material's texture and character of matter are looking like other matter. Well, special skills are adapted in these matters to magnify the possibility of expression, the originally codified meaning resources are disturbed. For example, The metal craft artist June Schwarcz is using the skills of electroforming, copper foiling, enameling, wire brush patina, fine wires fusing, etc. He is doing abstract forming and making various textures. And his works are very big size, and done by the skills of painting and sculpture. The outer form is very structural, special touches of the artists are heterogeneously mixed with the symbolic abstract expressionism color field. Further, there are mixed with Primitive original life atmosphere, Medieval ornamental aspect, Minimal, and Chaotic aspects. The meaning particles of these aspects are directly/indirectly joined but special skills and basic material languages are mixed together, the originally codified material language are disturbed. These disturbed material languages are becoming optically special effect and be illusion. It is making expressing way of tile metalcraft more fertile and be infinite.

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Experimental investigation of Scalability of DDR DRAM packages

  • Crisp, R.
    • Journal of the Microelectronics and Packaging Society
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    • v.17 no.4
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    • pp.73-76
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    • 2010
  • A two-facet approach was used to investigate the parametric performance of functional high-speed DDR3 (Double Data Rate) DRAM (Dynamic Random Access Memory) die placed in different types of BGA (Ball Grid Array) packages: wire-bonded BGA (FBGA, Fine Ball Grid Array), flip-chip (FCBGA) and lead-bonded $microBGA^{(R)}$. In the first section, packaged live DDR3 die were tested using automatic test equipment using high-resolution shmoo plots. It was found that the best timing and voltage margin was obtained using the lead-bonded microBGA, followed by the wire-bonded FBGA with the FCBGA exhibiting the worst performance of the three types tested. In particular the flip-chip packaged devices exhibited reduced operating voltage margin. In the second part of this work a test system was designed and constructed to mimic the electrical environment of the data bus in a PC's CPU-Memory subsystem that used a single DIMM (Dual In Line Memory Module) socket in point-to-point and point-to-two-point configurations. The emulation system was used to examine signal integrity for system-level operation at speeds in excess of 6 Gb/pin/sec in order to assess the frequency extensibility of the signal-carrying path of the microBGA considered for future high-speed DRAM packaging. The analyzed signal path was driven from either end of the data bus by a GaAs laser driver capable of operation beyond 10 GHz. Eye diagrams were measured using a high speed sampling oscilloscope with a pulse generator providing a pseudo-random bit sequence stimulus for the laser drivers. The memory controller was emulated using a circuit implemented on a BGA interposer employing the laser driver while the active DRAM was modeled using the same type of laser driver mounted to the DIMM module. A custom silicon loading die was designed and fabricated and placed into the microBGA packages that were attached to an instrumented DIMM module. It was found that 6.6 Gb/sec/pin operation appears feasible in both point to point and point to two point configurations when the input capacitance is limited to 2pF.