• Carbon letters
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• v.28
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• pp.38-46
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• 2018

Modified pitch A (MPA) and modified pitch B (MPB) were prepared by oxidative polymerization and thermal polycondensation reaction with refined pitch as the raw material, respectively. The toluene soluble components (TS-1 and TS-2) were obtained by solvent extraction from MPA and MPB, separately. The Flynn-Wall-Ozawa method and Kissinger-Akahira-Sunose method were used to calculate the pyrolysis activation energy of TS. The Satava-Sestak method was used to investigate the pyrolysis kinetic parameters of TS. Moreover, the optical microstructure of the thermal conversion products (TS-1-P and TS-2-P) by calcination shows that TS-1-P has more contents of mosaic structure and lower contents of fine fiber structure than TS-2-P. The research result obtained by a combination of X-ray diffraction and the curve-fitting method revealed that the ratios of ordered carbon crystallite (Ig) in TS-1-P and TS-2-P were 0.3793 and 0.4417, respectively. The distributions of carbon crystallite on TS-1-P and TS-2-P were calculated by Raman spectrum and curve-fitting analysis. They show that the thermal conversion product of TS-2 has a better graphite crystallite structure than TS-1.

• Journal of the Korean Ceramic Society
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• v.29 no.5
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• pp.396-402
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• 1992

Carbon solid was prepared from dormant mesophase pitch (DMPP) without using a binder and its properties were characterized. DMPP powder was stabilized with air or nitric acid in pretreatment stage so that it might not soften in later heat ttreatment stage. Optimum sintering properties were obtained from carbon powder with 2.36∼2.38 of C/H atomic ratio and 1.27∼1.40 of C/O atomic ration in air stabilization. In nitric acid stabilization, optimum sintering properties were obtained when 20∼40 vol.% of nitric acid solution was used. Compressive strength increased up to 1200$^{\circ}C$ of heat treatment temperature, and the highest compressive strength and bulk density of carbon solid from DMPP were 3000 kgf/㎤, respectively. The optical properties of carbon solid obtained was fine mosaic structure. Carbon solid after graphitization showed the properties of hard carbon due to stabilization and its shore hardness was 120.

• ETRI Journal
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• v.35 no.2
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• pp.340-343
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• 2013

A novel bumping process using solder bump maker is developed for the maskless low-volume solder on pad (SoP) technology of fine-pitch flip chip bonding. The process includes two main steps: one is the aggregation of powdered solder on the metal pads on a substrate via an increase in temperature, and the other is the reflow of the deposited powder to form a low-volume SoP. Since the surface tension that exists when the solder is below its melting point is the major driving force of the solder deposit, only a small quantity of powdered solder adjacent to the pads can join the aggregation process to obtain a uniform, low-volume SoP array on the substrate, regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of $130{\mu}m$ is successfully formed.

• ETRI Journal
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• v.33 no.4
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• pp.637-640
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• 2011

A novel bumping material, which is composed of a resin and Sn3Ag0.5Cu (SAC305) solder power, has been developed for the maskless solder-on-pad technology of the fine-pitch flip-chip bonding. The functions of the resin are carrying solder powder and deoxidizing the oxide layer on the solder power for the bumping on the pad on the substrate. At the same time, it was designed to have minimal chemical reactions within the resin so that the cleaning process after the bumping on the pad can be achieved. With this material, the solder bump array was successfully formed with pitch of 150 ${\mu}m$ in one direction.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.83-90
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• 2017

In this paper, we evaluated the solderability of thin electroless nickel-electroless palladium-immersion gold (ENEPIG) plating layer for fine-pitch package applications. Firstly, the wetting behavior, interfacial reactions, and mechanical reliability of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy on a thin ENEPIG coated substrate were evaluated. In the wetting test, maximum wetting force increased with increasing immersion time, and the wetting force remained a constant value after 5 s immersion time. In the initial soldering reaction, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) and P-rich Ni layer formed at the SAC305/ENEPIG interface. After a prolonged reaction, the P-rich Ni layer was destroyed, and $(Cu,Ni)_3Sn$ IMC formed underneath the destroyed P-rich Ni layer. In the high-speed shear test, the percentage of brittle fracture increased with increasing shear speed.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.477-479
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• 2006

In this study, a stripe type counter electrode discharge cell for PDP was attempted to realize high luminance efficiency and low firing voltage for fine pitch discharge cells. The cells were prepared using electroplated Cu/Ni electrodes coated with glass dielectric layer. The discharge behaviors of such cells were observed. These results indicate that the counter electrode discharge cells have different discharge behavior compared with coplanar cells, which may affect the luminance efficiency of the panel.

• 한국기계연구소 소보
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• s.13
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• pp.15-25
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• 1984

The infrared spectra were determined to discover the characteristics and properties of poff-, PV-, and cc-samples, and studied influence on the formation of mesophase or liquid crystal. The experimental results were as follows; a) Samples with long aliphatic side chain appear cracking texture on temperature forming liquid crystal. b) The fine isotropic microstructure appears in a heterogeneous material containing sulfur, 7.18 w%. c) In the size of molecular weight the lighter than 500 form liquid crystal. d) When poff-sample was treated at $400^{\circ}C$ aliphatic hydrocabon compounds decrease, presented well-oriented bulk liquid crystal.

• Journal of Institute of Control, Robotics and Systems
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• v.6 no.2
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• pp.138-145
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• 2000

In this paper an initial alignment algorithm for a strapdown inertial navigation system is implemented using a RISC CPU board. The algorithm computes roll pitch and yaw angles of the direction cosine matrix utilizing measured components of the specific force and earth rate when the navigation system is stationary. The coarse alignment algorithm is performed first and then the fine alignment algorithm containing a 3rd-order gyrocompass loop follows. The experimental set consists of an IMU a CPU board and a monitoring system Experimental results show that the implemented algorithm can be utilized in navigation systems.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2004.03a
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• pp.839-847
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• 2004

In this study, the flow characteristics within supersonic cascades are numerically investigated by using Fine Turbo, a commercial CFD code. Cascade flows are computed for three different inlet conditions. : a uniform supersonic inlet condition, a linear nozzle and a converging-diverging nozzle located in front of cascades. The effect of inlet conditions is compared and flow characteristics including shock patterns and shock-boundary layer interaction are analyzed. Also the effect of design parameters such as pitch-chord ratio, blade angle and blade surface curvature on the flow within supersonic cascades are studied.

• Current Optics and Photonics
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• v.1 no.2
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• pp.143-149
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• 2017

LED arrays with pixel numbers of $3{\times}3$, $4{\times}4$, and $5{\times}5$ have been studied in this paper in order to enhance the optical output power and decrease heat dissipation of an AlGaInP-based light emitting diode display device (pixel size of $280{\times}280{\mu}m$) fabricated by micro-opto-electro-mechanical systems. Simulation results showed that the thermal resistances of the $3{\times}3$, $4{\times}4$, $5{\times}5$ arrays were $52^{\circ}C/W$, $69.7^{\circ}C/W$, and $84.3^{\circ}C/W$. The junction temperature was calculated by the peak wavelength shift method, which showed that the maximum value appears at the center pixel due to thermal crosstalk from neighboring pixels. The central temperature would be minimized with $40{\mu}m$ pixel pitch and $150{\mu}m$ substrate thickness as calculated by thermal modeling using finite element analysis. The modeling can be used to optimize parameters of highly integrated AlGaInP-based LED arrays fabricated by micro-opto-electro-mechanical systems technology.