• 마이크로전자및패키징학회지
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• 제24권2호
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• pp.11-15
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• 2017

실리콘 칩을 적층하는 3D 멀티 플립칩 패키지의 경우 방열문제가 대두됨에 따라 접착 접합부의 열전도도 향상이 요구되고 있다. 본 연구에서는 플립칩 본딩용 비전도성 접착제(NCP)에 있어서 알루미나 필러의 첨가가 NCP의 물성 및 열전도도에 미치는 영향을 조사하였다. 알루미나 필러는 미세피치 플립칩 접속을 위해 평균입도 400 nm의 미세분말을 사용하였다. 알루미나 필러 함량이 0~60 wt%까지 증가함에 따라 60 wt% 첨가 시 0.654 W/mK에 도달하였다. 이는 동일 첨가량 실리카의 0.501 W/mK보다는 높은 열전도도이지만, 동일 함량의 조대한 알루미나 분말을 첨가한 경우에 비해서는 낮은 열전도도로, 미세 플립칩 본딩을 위해 입도가 미세한 분말을 첨가하는 것은 열전도도에 있어서는 불리한 효과로 작용함을 알 수 있었다. NCP의 점도는 40 wt% 이상에서 급격히 증가하는 현상을 나타내었는데, 이는 미세 입도에 따른 필러 간 상호작용의 증가에 기인하는 것으로, 미세피치 플립칩 본딩을 위해 열전도도가 우수한 미세 알루미나 분말을 사용하기 위해서는 낮은 점도를 유지하면서 필러 첨가량을 증가시킬 수 있는 분산방안이 필요한 것으로 판단되었다.

• 보존과학연구
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• 통권25호
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• pp.171-195
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• 2004

This research presents an evaluation of the weathering and deterioration state of the Wanggung-ri five-storied stone pagoda in the Iksan (National Treasure No. 289) and suggests conservational schemes. A deterioration map of the pagoda was drawn from the aspects of petrological, physical, chemical, biological, structural and artificial weathering.The rock properties consisting of the pagoda were medium-grained biotite granite that had leucocratic phenocryst developed in parts. The body of each story suffered severely from the secondary contamination that turned the colors into light grey, pitch dark, yellowish brown, and reddish brown as well as granular decomposition, exfoliation and peel-off. The roof stones were heavy exfoliated or peeled off in most of the cases. In addition to the fine cracks, there were layered cracks on the corners. The roof stones of the3rd and 4th story in the north and west side had some stones fall-off, while those of the 2ndstory in the north side had steel reinforcement filled for a fixing purpose. Those of the 5th story showed big gaps that must have originated from cracks and were easily subject to granular decomposition and rainfall. The inside clay filler was missing in the lower part of the roof stones of the 4th and 5th story and the supporting stones, which were thus covered by light grey or pitch dark sediments. The contact area of the materials was about 70 % in the parts where there was a space due to the filler missing and washigher than 90 % in the lower parts of the pagoda. About 90 % or more of the roof stones surface of each story were covered by aerial plants that formed a thick biological mat. Thus it seemed necessary to come up with the conservational measures to remove the plans living on the surface of the stone materials, with the plans to prevent rain from falling inside, and with the water repellent and hardening treatments to postpone the surface weathering of the rock properties. All those measures and plans must be based on the results of long-term monitoring and thorough detail investigations.

• 마이크로전자및패키징학회지
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• 제22권1호
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• pp.43-49
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• 2015

전자 제품의 경박 단소화 및 고집적화가 이루어 지면서 반도체 칩뿐만 아니라 유기 기판도 고집적화가 요구되고 있다. 본 연구는 인쇄회로기판의 미세 피치 회로에 대한 고온고습 전압인가 시험을 실시하여 불량 메커니즘을 연구하였다. $130^{\circ}C/85%RH/3.3V$와 $135^{\circ}C/90%RH/3.3V$ 시험조건에서 고온고습 전압시험(Biased HAST)의 가속 계수는 2.079로 계산되었다. 불량 메커니즘 분석을 위하여 집속이온빔(FIB) 분석이 이용되었다. (+)전극에서는 콜로이드 형태의 $Cu_xO$와 $Cu(OH)_2$가 형성되었으며, (-)전극에서는 수지형태의 Cu가 관찰되었다. 이를 통해 $Cu^{2+}$ 이온과 전자($e^-$)가 결합한 수지상 Cu에 의해 절연파괴가 일어난다는 것을 확인하였다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.43-55
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology. Flip chip technology eliminates the need for wire bonding by redistributing the bond pads over the entire surface of the die. Instead of wires, the die is attached to the substrate utilizing a direct solder connection. Although several steps and processes are eliminated when utilizing flip chip technology, there are several new problems that must be overcome. The main issue is the mismatch in the coefficient of thermal expansion (CTE) of the silicon die and the substrate. This mismatch will cause premature solder Joint failure. This issue can be compensated for by the use of an underfill material between the die and the substrate. Underfill helps to extend the working life of the device by providing environmental protection and structural integrity. Flux residues may interfere with the flow of underfill encapsulants causing gross solder voids and premature failure of the solder connection. Furthermore, flux residues may chemically react with the underfill polymer causing a change in its mechanical and thermal properties. As flip chip packages decrease in size, cleaning becomes more challenging. While package size continues to decrease, the total number of 1/0 continue to increase. As the I/O increases, the array density of the package increases and as the array density increases, the pitch decreases. If the pitch is decreasing, the standoff is also decreasing. This paper will present the keys to successful flip chip cleaning processes. Process parameters such as time, temperature, solvency, and impingement energy required for successful cleaning will be addressed. Flip chip packages will be cleaned and subjected to JEDEC level 3 testing, followed by accelerated stress testing. The devices will then be analyzed using acoustic microscopy and the results and conclusions reported.

• 대한본초학회지
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• 제26권1호
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• pp.1-6
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• 2011

Objectives : Due to morphological similarity, many substitutes and counterfeits have been used as Moktong for thousands of years. This study was designed to determine discriminative criteria for identifying medicinal herbs used as Moktong. Methods : Akebia quinata, A. trifoliata, Clematis armandii, and Aristolochia manshuriensis were collected in various regions. Samples were authenticated and examined by observation and microscopy with paraffin embedding and triple staining using the modified Ju staining method. Results : Three different types of features to establish discriminative criteria for four kinds of Moktong were identified. Botanical features include differences in phyllotaxy, leaf shape, and caulescent. External morphological features were arrangement and size of fine holes(xylem), and overall shape of the section. Internal morphological features include the number of medullary rays, shape of the pitch, type of tissues rounding pitch, appearance of annual rings, shape and amount of crystals(calcium-oxalate), and the appearance of cork cambium. Further details(e.g. identification keys) are in the article. Conclusions : These criteria could provide an effective method for identifying numerous kinds of Moktong distributed in markets throughout northeast Asian nations.

• Journal of Astronomy and Space Sciences
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• 제19권4호
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• pp.351-366
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• 2002

본 연구에서는 저가의 INS와 GPS 정보를 합성하여 고기동 환경에서 항체의 위치와 자세정보를 연속적으로 제공할 수 있는 약결합 방식의 통합 알고리즘을 구현하였고, 4S-Van에 장착된 이미지 센서의 위치와 자세결정 방법에 사용하였다. (D)GPS/INS 통합을 실시하기 전 IMU의 초기 정렬과정에서 방위각은 두 대의 GPS를 통해 결정하였으며 칼만 필터를 이용한 정밀정렬을 수행하였다. 통합 알고리즘의 성능평가를 위해 차량 테스트와 시뮬레이션 테스트를 병행하였다. 통합 결과 차량 시험을 기준으로 나타난 위치 오차는 직선도로에서 l0cm 내외의 정확도를 보이며 자세오차의 경우 시뮬레이션을 기준으로 롤각은 $0^{\circ}.01$, 피치각은 $0^{\circ}.03$, 요각은 $0^{\circ}.1$ 내외의 정확도를 보였다. 구현된 (D)GPS/INS 알고리즘은 기하보정 방법을 통해 이미지센서의 위치와 자세정보 제공자로서 활용될 수 있다. 따라서 4S-Van에 장착된 이미지 센서의 영상획득 시각에 대한 기하학적인 정보를 통해 지상의 건물이나 도로 시설물 등에 대한 3차원 공간 자료 구축이 가능하다고 보며, 구축된 정보를 통해 기존의 수치지도 갱신, 도로 시설물 관리, 비디오 GIS 데이터 베이스 구축 등에 대한 공간 자료 연계 및 응용에 활용할 계획이다.

• Design & Manufacturing
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• 제17권3호
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• pp.48-54
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• 2023

In this study, an injection mold with ultra-small surface properties was manufactured using nanosecond laser processing. A superhydrophobic characteristic analysis was performed on the PET specimen manufactured through this. To this end, a hydrophobic pattern was defined using the Cassie-Baxter model. The defined features were selected with a spot diameter of 25um and pitch spacing of 30um and 35um. As a result of the basic experiment, it was confirmed that the fine pattern shape had an aspect ratio of 1:1 when the pitch interval was 35um and 20 iterations. Through the determined processing conditions, a hydrophobic pattern was implemented on the core surface of KP4. A specimen with a hydrophobic pattern was produced through injection molding. The height of the molded hydrophobic pattern is 20 ㎛ less than the depth of the core and the contact angle measurement results are 92.1°. This is a contact angle smaller than the superhydrophobic criterion. Molding analysis was performed to analyze the cause of this, and it was analyzed that the molding was not molded due to the lack of pressure in the injection machine.

• Journal of Astronomy and Space Sciences
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• 제31권2호
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• pp.177-186
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• 2014

The Immersion Grating Infrared Spectrometer (IGRINS) is a near-infrared wide-band high-resolution spectrograph jointly developed by the Korea Astronomy and Space Science Institute and the University of Texas at Austin. IGRINS employs three HAWAII-2RG Focal Plane Array (H2RG FPA) detectors. We present the design and fabrication of the detector mount for the H2RG detector. The detector mount consists of a detector housing, an ASIC housing, a Field Flattener Lens (FFL) mount, and a support base frame. The detector and the ASIC housing should be kept at 65 K and the support base frame at 130 K. Therefore they are thermally isolated by the support made of GFRP material. The detector mount is designed so that it has features of fine adjusting the position of the detector surface in the optical axis and of fine adjusting yaw and pitch angles in order to utilize as an optical system alignment compensator. We optimized the structural stability and thermal characteristics of the mount design using computer-aided 3D modeling and finite element analysis. Based on the structural and thermal analysis, the designed detector mount meets an optical stability tolerance and system thermal requirements. Actual detector mount fabricated based on the design has been installed into the IGRINS cryostat and successfully passed a vacuum test and a cold test.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2002년도 International Meeting on Information Display
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• pp.1053-1055
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• 2002

Recently CRT is getting large-sized, Flatness and High Fine Pitched in the meantime the raw material for shadow mask is in rapid progress of thinness, Low Thermal Expansion and high strength.Until now we have used AK(Aluminum Killed) & Invar(Fe-Ni alloy) materials for main raw material of shadow mask component. However recently Nb and Co addition and Nb+Co addition, which has advantage of Low Thermal Expansion and High Strength. has been developed as well as applying in mass production as CRT's trend has become more flat and fine pitch. Among of them, Co addition has been mass production as forming type (Flat CRT) with the beneficial effect of low thermal expansion & high strength for the first time. Since then Nb+Co addition has been used in mass production by the request of much higher strength of shadow mask component. In case of Nb addition, It's thermal expansion coefficient is a little lower than normal Invar and a little higher than Co addition, meanwhile Its Mechanical property is almost similar to Co Addition. The used samples of this experiment are 36%Ni + Fe, 32%Ni + 5%Co + Fe, 32%Ni + 5%Co + 0.3%Nb + Fe, 32%Ni + 0.3%Nb + Fe with heat treatment temperature of 600$^{\circ}C$, 650$^{\circ}C$, 700$^{\circ}C$, 750$^{\circ}C$, 800$^{\circ}C$, 850$^{\circ}C$, 900$^{\circ}C$ respectively under the condition of 15min holding time. After heat treatment, we have observed the change of mechanical property with addition of small elements through mechanical property investigation and metal structure observation as well as transition of thermal expansion coefficient by measuring of thermal expansion coefficient at 850$^{\circ}C$. In conclusion, 5%Co addition indicates that its thermal expansion coefficient is very similar under the condition of at 850$^{\circ}C$ for 15min 's heat treatment. From the experimental result it is suggested that Co addition is mostly suitable for Doming property and Nb addition is mostly suitable for Drop property.

• 한국정밀공학회지
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• 제22권5호
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• pp.103-112
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• 2005

This paper presents one-axis high precision scanning system and illustrates the design of modified $X-Y-{\theta}$ stage as a tracker using VCM and commercialized air bearings for it. The scanning system for 100nm resolution is composed of the 3-axis stage and one axis long stroke linear motor stage as a follower. In this study a previous proposed and presented structure of VCM for the fine stage is modified. The tracker has 3 DOF($X-Y-{\theta}$ motions by four VCM actuators which are located on the same plane. So 4 actuating forces are suggested and designed to create least pitch and roll motions. This article will show about the design especially about optimal design. The design focus of this fine stage is to have high acceleration to accomplish high throughput. The optimal design of maximizing acceleration is performed in restrained size. The most sensitive constraint of this optimal design is heat dissipation of coil. There are 5 design variables. Because the relationship between design variables and system parameters are quite complicated, it is very difficult to set design variables manually. Due to it, computer based optimal design procedure using MATLAB is used. Then, this paper also describes the procedures of selecting design variables for the optimal design and a mathematical formulation of the optimization problem. Based on the solution of the optimization problem, the final design of the stage is also presented. The results can be verified by MAXWELL. The designed stage has the acceleration of about 5 $m/s^{2}$ with 40kg total mass including wafer chuck and interferometer mirror. And the temperature of coil is increased $50^{\circ}C$. In addition, the tracker is controlled by high precision controller system with HP interferometer for it and linear scaler for the follower. At that time, the scanning system has high precision resolution about 5nm and scanning resolution about 40nm in 25mm/s constant speed