• Journal of the Korean Society for Precision Engineering
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• v.25 no.5
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• pp.96-102
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• 2008

Manufacturing of printed electronics using printing technology has begun to get into the hot issue in many ways due to the low cost effectiveness to existing semi-conductor process. This technology, with low cost and high productivity, can make it possible to produce printed electronics such as TFT, solar cell, RFID Tag, printed battery, and so on. In this study, apparatus of gravure-offset printing are developed for fine line-width/gap printing and the results obtained from the apparatus shows that it is possible to make around 20 micro-meter line-width/gap printing patterns. The roll-to-roll printing system for fine line-width printing based on primary experiment is presented. The printing results obtained from the system shows around 30 micro-meter line-width/gap printing patterns.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.583-584
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• 2006

Printing technology has begun to get into the spotlight in many ways due to the low cost effectiveness to existent semi-conductor process. It also has very useful application areas, not only paper printing but also patterning for LCD color tilter, Photovoltaic patterning, RFID antenna, OLED, and so on. In this study, an apparatus of gravure offset printing was developed for fine line width printing. The pattern was composed of $20{\mu}m$ size of continuous lines of which pitch size was $40{\mu}m$. The printed pattern shows that it is possible to make around $20{\mu}m$ line-width printing pattern. The roll-to-roll printing system for fine line-width printing based on primary experiment is presented. For testing of multi-layer printing, the system was designed to be capable of printing two different materials from each printing unit using gravure-offset printing method and have a function of alignment of two printed materials.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.650-650
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• 2013

Although imprinted nanopatterns of organic polymer can be modified by the heat treatment [1], it generally requires high process temperatures and is material-dependent since the heat-induced mass loss of the organic polymer is greatly affected by its chemical characteristics. When oxygen is added during the annealing process, one can reduce the process temperature as well as the dependence of the materials. With the oxygen, line width reduction of a polymer (SU-8) patterns could be accomplished at temperature of as low as $250^{\circ}C$ which was not possible in the heat only process. This oxidative line width reduction can be dramatically promoted with the introduction of oxygen plasma. The oxygen plasma, with its highly-reactive oxygen species, vigorously etches away the organic materials, proven to be extremely effective line with reduction method. It is, however, very hard to control the extent and homogeneity of the etching, particularly of very fine patterns. Here, we report an effective and reliable line width reduction method of imprinted nanopatterns by combined plasma and heat treatment. The merits of this process include the reduction of process temperature, time and material-dependence.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.342-345
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• 2002

As the size of chip components and module decreases, new patteming method for fine line and geometry is needed. So far, in LTCC(Low Temperature Cofired Ceramic) process, screen printing method has been used generally. But screen printing method has some disadvantages as follows. First, the geometry including line, vias, etc. smaller than $100{\mu}m$ can't be evaluated easily. Second, the patterned dimension is different from designed value, which makes distortion in charactersitics of not only chip components but also modules. Thick film lithography has advantages of thick film screen printing process, low cost and thin film process, fine line feasibility. Using this method, the line with $30{\mu}m$ width and the geometry with expected dimension can be evaluated. In this study, the fine line with $35{\mu}m$ line/space is formed and the embedded capacitor with very small tolerance is developed using thick film lithography.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.461-466
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• 2007

There has been a great interest in printing technology as a low cost and mass production method for the application of printed electronics such as printed TFT, solar cell, RFID Tag, printed battery, and so on. In this study, apparatuses of gravure-offset printing are developed for fine line-width/gap printing and examining pattern distortion occurred in gravure-offset printing process. The fine line-width/gap pattern shows that it is possible to make around 20 micro-meter line-width/gap printing patterns. Pattern distortion is modeled, and the amount and shape of the distortion are calculated by using commercial FEM code. The roll-to-roll printing system under development consists of unwinder/rewinder, two printing units, one coating unit, drying units, guiding unit, vision system, and other auxiliary devices. For multi-layer printing, the system is designed to be capable of printing two different materials.

• 한국태양에너지학회:학술대회논문집
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• 2011.04a
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• pp.293-298
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• 2011

The most widely used method to form an electrode in industrial solar cells are screen printing. Screen printing is characterized by a relatively simple and well-known production sequence with high throughput rates. However the method is difficult to implement a fine line width of high-efficiency solar cells can not be made. The open circuit voltage(Voc) and the short circuit current density(Jsc) and fill factor(FF) need to be further improved to increase the efficiency of silicon solar cells. In this study, gravure offset printing method using the multicrystalline-silicon solar cells were fabricated. Gravure off-set printing method which can print the fine line width of finger electrode can have the ability reduce the shaded area and increase the Jsc. Moreover it can make a high aspect ratio thereby series resistance is reduced and FF is increased. Approximately $50{\mu}m$ line width with $35{\mu}m$ height was achieved. The efficiency of gravure off set was 0.7% higher compare to that of scree printing method.

• Journal of the Korean Ceramic Society
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• v.44 no.3 s.298
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• pp.157-161
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• 2007

Line width under $100\;{\mu}m$ with good resolution is difficult to achieve using conventional thick-film process utilizing screen printing method. However combined with lithography technology finer line and space for miniaturization and highly integrated package is achievable. In this study, photosensitive Ag paste of optimum formulation used for thick film lithography technology was fabricated by various Ag powder, glass powder and additives. As the result, line width of $30\;{\mu}m$ with good definition and reduced mismatch during co-firing with LTCC substrate was acquired. Formulated Ag paste was used to pattern embedded fine line inductor with over 90% yield.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.251.1-251.1
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• 2013

Combination of oxidative vacuum annealing and oxygen plasma treatment can serve as a simple and efficient method of line-width modification of imprinted nanopatterns. Since the vacuum annealing and oxygen plasma could lead mass loss of polymeric materials, either one of the process can yield a narrowed patterns. However, the vacuum annealing process usually demands quite high temperatures (${\geq}300^{\circ}C$) and extended annealing time to get appreciable line-width reduction. Although the plasma treatment may be considered as an effective low temperature rapid process for the line-width reduction, it is also suffering for the lowered controllability on application to very fine patterns. We have found that the vacuum annealing temperature can be lowered by introducing the oxygen in the vacuum process and that the combination of oxygen plasma treatment with the vacuum annealing could yield the best result in the line-with reduction of the imprinted polymeric nanopatterns. Well-defined line width reduction by more than 50% was successfully demonstrated at relatively low temperatures. Furthermore, it was verified that this process was applicable to the nanopatterns of different shapes and materials.

• Korean Journal of Materials Research
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• v.29 no.1
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• pp.37-42
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• 2019

This study investigates Ag coated $Cu_2O$ nanoparticles that are produced with a changing molar ratio of Ag and $Cu_2O$. The results of XRD analysis reveal that each nanoparticle has a diffraction pattern peculiar to Ag and $Cu_2O$ determination, and SEM image analysis confirms that Ag is partially coated on the surface of $Cu_2O$ nanoparticles. The conductive paste with Ag coated $Cu_2O$ nanoparticles approaches the specific resistance of $6.4{\Omega}{\cdot}cm$ for silver paste(SP) as $(Ag)/(Cu_2O)$ the molar ratio increases. The paste(containing 70 % content and average a 100 nm particle size for the silver nanoparticles) for commercial use for mounting with a fine line width of $100{\mu}m$ or less has a surface resistance of 5 to $20{\mu}{\Omega}{\cdot}cm$, while in this research an Ag coated $Cu_2O$ paste has a larger surface resistance, which is disadvantageous. Its performance deteriorates as a material required for application of a fine line width electrode for a touch panel. A touch panel module that utilizes a nano imprinting technique of $10{\mu}m$ or less is expected to be used as an electrode material for electric and electronic parts where large precision(mounting with fine line width) is not required.

• Journal of the Korean Ceramic Society
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• v.41 no.4
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• pp.313-322
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• 2004

Thick film photolithography is a new technology in that the lithography process such as exposure and development is applied to the conventional thick film process including screen-printing. In this research, low-temperature cofireable silver paste, which enabled the formation of thick film fine-line using photolithographic technology, was developed. The optimum composition for fine-line forming was studied by adjusting the amounts of silver powder, polymer and monomer, and the additional amount of photoinitiator, and then the effect of processing parameter such as exposing dose on the formation of fine-line was also tested. As the result, it was found that the ratio of polymer to monomer, silver powder loading, and the amount of photoinitiator were the main factors affecting the resolution of fine-line. The developed photosensitive silver paste was printed on low-temperature cofireable green sheet, then dried, exposed, developed in aqueous process, laminated, and fired. Results showed that the thick film fine-line under 20$\mu\textrm{m}$ width could be obtained after cofiring.