• Title/Summary/Keyword: Fine abrasive process

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The Internal Finishing Characteristics of Pipe Polished by Slurry Circulation Magnetic Abrasive Machining (슬러리순환 자기연마법에 의한 파이프 내면의 연마특성)

  • Rho, T.W.;Park, W.K.;You, W.S.;Seo, Y.I.;Choi, H.;Lee, J.C.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2002.10a
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    • pp.198-201
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    • 2002
  • An internal finishing process by the application of magnetic abrasive machining has been developed as a new technology to obtain a fine inner surface of pipe. In this paper, a slurry circulation system was designed and manufactured. Its finishing characteristics was experimently investigated by various effective factors such as dry, water flow, oil flow with a slurry. From the experimental results, it was found that the materal removal and surface roughness were good in oil flow with slurry. The slurry circulation system is effective on the internal finishing of non-ferromagnetic pipe(SUS304).

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Characteristics of 2-Step CMP (Chemical Mechanical Polishing) Process using Reused Slurry (재활용 슬러리를 사용한 2단계 CMP 특성)

  • Lee, Kyoung-Jin;Seo, Yong-Jin;Choi, Woon-Shik;Kim, Ki-Wook;Kim, Sang-Yong;Lee, Woo-Sun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.11a
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    • pp.39-42
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    • 2002
  • Recently, CMP (chemical mechanical polishing) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, COO (cost of ownership) and COC (cost of consumables) were relatively increased because of expensive slurry. In this paper, we have studied the possibility of recycle of reused silica slurry in order to reduce the costs of CMP slurry. The post-CMP thickness and within-wafer non-uniformity(WIWNU) were measured as a function of different slurry composition. As a experimental result, the performance of reused slurry with annealed silica abrasive of 2 wt% contents was showed high removal rate and low non-uniformity. Therefore, we propose two-step CMP process as follows In the first-step CMP, we can polish the thick and rough film surface using remaked slurry, and then, in the second-step CMP, we can polish the thin film and fine pattern using original slurry. In summary, we can expect the saving of high costs of slurry.

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Characteristics of 2-Step CMP (Chemical Mechanical Polishing) Process using Reused Slurry by Adding of Silica Abrasives (실리카 연마제가 첨가된 재활용 슬러리를 사용한 2단계 CMP 특성)

  • 서용진;이경진;최운식;김상용;박진성;이우선
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.16 no.9
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    • pp.759-764
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    • 2003
  • Recently, CMP (chemical mechanical polishing) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, COO (cost of ownership) and COC (cost of consumables) were relatively increased because of expensive slurry. In this paper, we have studied the possibility of recycle of roused silica slurry in order to reduce the costs of CMP slurry. The post-CMP thickness and within-wafer non-uniformity (WIWNU) wore measured as a function of different slurry composition. As an experimental result, the performance of reused slurry with annealed silica abrasive of 2 wt% contents was showed high removal rate and low non-uniformity. Therefore, we propose two-step CMP process as follows , In tile first-step CMP, we can polish the thick and rough film surface using remaked slurry, and then, in the second-step CMP, we can polish the thin film and fine pattern using original slurry. In summary, we can expect the saying of high costs of slurry.

Characteristics of aspheric lens processing using ultra-precision moulds processing system (초정밀 금형가공기를 이용한 비구면 렌즈 가공특성 연구)

  • Baek, Seung-Yub;Lee, Ha-Sung;Kang, Dong-Myeong
    • Design & Manufacturing
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    • v.1 no.1
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    • pp.7-11
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    • 2007
  • The fabrication of precision optical components by deterministic CNC grinding is an area of great current interest. Replacement of the traditional, craftsman driven, optical fabrication process is essential to reduce costs and increase process flexibility and reliability. Moreover, CNC grinding is well suited to the fabrication of complex shapes such as aspheres, making it possible to design optical systems with fewer components and reduced weight. Current technology is capable of producing surfaces with less than 2 microns peak to valley error, 50 nm rms surface roughness, and less than 1 micron subsurface damage. Bound abrasive tools, in which the abrasive particles are fixed in a second (matrix) material, play an important part in achieving this performance. In this paper, the factors affecting the ultra-fine surface roughness and profile accuracy of machined surfaces of aspheric parts has been analyzed experimentally and theoretically and on ultra-precision aspheric grinding system and precise adjusting mechanism have been designed and manufactured. In the paper we report the results of experiments and modeling performed to examine the effects of machinability, occurring during grinding of optical surfaces, on the tool surface profile. Profiles of machined surface were measured by using SEM. In order to optimize grinding conditions of aspheric lens processing, we performed experiments by design of experiments.

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A Study on the Ultra Precision Polishing Method of Aluminum Surface Using MR Fluids (MR fluid를 이용한 알루미늄 표면의 초정밀 연마 방법)

  • Lim, Dong-Wook;Kim, Byung-Chan;Hong, Kwang-Pyo;Cho, Myung-Woo
    • Design & Manufacturing
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    • v.11 no.2
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    • pp.20-24
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    • 2017
  • Recent industrial developments are constantly advancing, and rapid technological development is demanding high technology level in related fields. The need for polishing is increasing even more to improve quality. In order to improve the surface quality, the final finishing process or polishing process is a very important part. Research on super precise polishing method using MR fluid is actively being carried out in domestic and foreign countries. Fine magnetic abrasive grains are aligned in the direction of a magnetic force line formed by a magnetic field and serve as a brush to polish a metal surface. This method has the advantage that the shape of the tool is not fixed and is not affected by the shape of the workpiece or the machining area. We will design the electromagnets for the MR polish polishing system and apply the magnetic field analysis using the magnetic field analysis program (ANSYS). The data obtained through this process suggests an efficient method to increase the magnetic flux density important for polishing. We will investigate the influence of the Al6061-T6 specimen on the surface of the MR polishing machine based on the optimized design.

Study on the growth of 4H-SiC single crystal with high purity SiC fine powder (고순도 SiC 미분말을 적용한 4H-SiC 단결정 성장에 관한 연구)

  • Shin, Dong-Geun;Kim, Byung-Sook;Son, Hae-Rok;Kim, Moo-Seong
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.29 no.6
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    • pp.383-388
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    • 2019
  • High purity SiC fine powder with metal impurity contents of less than 1 ppm was synthesized by improved carbothermal reduction process, and the synthesized powder was used for SiC single crystal growth in RF heating PVT device at temperature above 2,100℃. In-situ x-ray image analyzer was used to observe the sublimation of the powder and single crystal growth behavior during the growth process. SiC powder was used as a source of single crystal growth, exhausted from the outside of the graphite crucible at the growth temperature and left graphite residues. During the growth, the flow of raw materials was concentrated in the middle and influenced the growth behavior of SiC single crystals. This is due to the difference in temperature distribution inside the crucible due to the fine powder. After the single crystal growth was completed, the single crystal ingot was cut into a 1 mm thick single crystal substrate and finely polished using a diamond abrasive slurry. A dark yellow 4H-SiC was observed overall of single crystal substrate, and the polycrystals generated in the outer part may be caused by the incorporation of impurities such as the bubble layer mixed in the process of attaching the seed crystal to the seed holder.

A Study on the Optimization of MR Fluid Polishing Conditions for Cover Glass Edge (MR Fluid Polishing을 이용한 커버글래스 측면 연마 조건 최적화에 관한 기초 연구)

  • Chung, Jae-Hwa;Kim, Byung-Chan;Hong, Kwang-Pyo;Cho, Myeong-Woo
    • Design & Manufacturing
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    • v.11 no.2
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    • pp.42-45
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    • 2017
  • Currently, the mobile device is required to be miniaturized and lightweight according to the needs of the consumer. For this purpose, each part is produced and assembled in units of modules. Accordingly, the display part is also composed of a cover glass, a touch screen, And it costs a large amount to replace the whole when it is damaged. Therefore, we propose a method to improve the durability of display part using ANOVA (Analysis of Variance) and MR fluid polishing. Before MR fluid polishing process, surface treatment was performed to obtain a polishable surface. A series of experiments were carried out to very fine surface roughness and to secure durability of cover glass. Polishing depth, feed rate, and abrasive size were selected to examine the MR fluid polishing results.

Effects of the Surface Roughness of a Graphite Substrate on the Interlayer Surface Roughness of Deposited SiC Layer (SiC 증착층 계면의 표면조도에 미치는 흑연 기판의 표면조도 영향)

  • Park, Ji Yeon;Jeong, Myung Hoon;Kim, Daejong;Kim, Weon-Ju
    • Journal of the Korean Ceramic Society
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    • v.50 no.2
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    • pp.122-126
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    • 2013
  • The surface roughness of the inner and outer surfaces of a tube is an important requirement for nuclear fuel cladding. When an inner SiC clad tube, which is considered as an advanced Pressurized Water Cooled Reactor (PWR) clad with a three-layered structure, is fabricated by Chemical Vapor Deposition (CVD), the surface roughness of the substrate, graphite, is an important process parameter. The surface character of the graphite substrate could directly affect the roughness of the inner surface of SiC deposits, which is in contact with a substrate. To evaluate the effects of the surface roughness changes of a substrate, SiC deposits were fabricated using different types of graphite substrates prepared by the following four polishing paths and heat-treatment for purification: (1) polishing with #220 abrasive paper (PP) without heat treatment (HT), (2) polishing with #220 PP with HT, (3) #2400 PP without HT, (4) polishing with #2400 PP with HT. The average surface roughnesses (Ra) of each deposited SiC layer are 4.273, 6.599, 3.069, and $6.401{\mu}m$, respectively. In the low pressure SiC CVD process with a graphite substrate, the removal of graphite particles on the graphite surface during the purification and the temperature increasing process for CVD seemed to affect the surface roughness of SiC deposits. For the lower surface roughness of the as-deposited interlayer of SiC on the graphite substrate, the fine controlled processing with the completed removal of rough scratches and cleaning at each polishing and heat treating step was important.

Heat and Wear Resistance Characterization of SiCp Reinforced Al Matrix Composites (SiCp입자강화 Al 복합재료의 내열 및 마모특성)

  • Kim, Sug-Won;Kim, Wan-Ki;Woo, Kee-Do;Ahn, Haeng-Keun
    • Journal of Korea Foundry Society
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    • v.20 no.6
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    • pp.377-385
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    • 2000
  • Al matrix composites as the most promising MMCs can be expected to be excellent engineering materials in the nearest future. So as to improve material properties of composite, many manufacturing processes have been developed. Among them, squeeze casting process which offers fine microstructure and near-net-shape is one of the most successful MMCs manufacturing processes. But, in case of with subsieve size particles (under 44 ${\mu}m$), it is very difficult to homogeneously distribute particles in matrix of Al matrix composite by various casting processes, including squeeze casting used so far. Duplex process which was developed in previous study was used to distribute the particle of subsieve size more homogeneously in matrix of Al matrix composite. Microstructures, wear and heat resistance characterization of Al-Si-Cu-Mg-(Ni)/SiCp manufactured by duplex process were examined to clarify the effect of manufacturing conditions, particle size of reinforcement and alloying elements. Al matrix composites reinforced with SiCp(10 ${\mu}m$) have the lowest wear amount among composites reinforced with 3 ${\mu}m$, 5 ${\mu}m$ and 10 ${\mu}m$ SiCp. The wear amount of Al matrix composites with 10 wt.% SiCp(3, 5, 10 ${\mu}m$) was decreased according to the increase of the sliding speed because abrasive wear takes place at high sliding speed of 4m/s and worn debris with block type occurs at low sliding speed of 1m/s. As for heat resistance, it is made clear that remarkable heat resistance property can be obtained by addition of Ni element in Al matrix composites.

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Development of a Pilot-Scale Soil Washing Process (파일롯 규모의 토양세척장치 개발)

  • 장윤영;신정엽;황경엽
    • Journal of Korea Soil Environment Society
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    • v.3 no.3
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    • pp.55-62
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    • 1998
  • Soils contaminated with hydrocarbons and residual metals can be effectively treated by soil washing. In developing the soil washing process several major effects for separating contaminants from coarse soils progressively improved upon combinations of mining and chemical processing approaches. The pilot-scale soils washing process consists of the four major parts : 1) abrasive scouring, 2) scrubbing action using a washwater that is sometimes augmented by surfactants or other agents, 3) rinsing, and 4) regenerating the contaminated washwater. The plant was designed based upon the treatment capacity > 5 ton/hr on site. The lumpy contaminated soil fractions first experience deagglomeration and desliming passing through a rolling mill pipe. In the second unit the attrition scrubbing module equipped with paddles uses high-energy to remove contaminants from the soils. And a final rinsing system is assembled to separate the washwater containing the contaminants and very fine soils from the washed coarse soils. For recycling the contaminated washwater passes through a washwater clarifier specifically designed for flocculation, sedimentation and gravity separation of fine as well as flotation and separation of oils from the washwater. In order to more rapidly assess the applicability of soil washing at a potential site while minimizing the expense of mobilization and operation, a mobile-type soil washing process which is self-contained upon a trailer will be further developed.

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