• Korean Journal of Materials Research
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• v.22 no.9
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• pp.454-458
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• 2012

Various adhesive materials are used in flip chip packaging for electrical interconnection and structural reinforcement. In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed for the utilization of low thermal resistance substrate films, such as PEN(polyethylene naphthalate) and PET(polyethylene terephthalate). In this study, the effects of anhydride and dihydrazide hardeners on the low-temperature snap cure behavior of epoxy based non-conductive pastes(NCPs) were investigated to reduce flip chip bonding temperature. Dynamic DSC(differential scanning calorimetry) and isothermal DEA(dielectric analysis) results showed that the curing rate of MHHPA(hexahydro-4-methylphthalic anhydride) at $160^{\circ}C$ was faster than that of ADH(adipic dihydrazide) when considering the onset and peak curing temperatures. In a die shear test performed after flip chip bonding, however, ADH-containing formulations indicated faster trends in reaching saturated bond strength values due to the post curing effect. More enhanced HAST(highly accelerated stress test) reliability could be achieved in an assembly having a higher initial bond strength and, thus, MHHPA is considered to be a more effective hardener than ADH for low temperature snap cure NCPs.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.4 no.3
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• pp.139-144
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• 2003

A flat type micro gas sensor was fabricated on the p-type silicon wafer with low stress Si$_3$N$_4$, whose thickness is 2 ${\mu}{\textrm}{m}$, using MEMS technology. WO$_3$ thin film as a sensing material for detection of NO$_2$ gas was deposited using a tungsten target by sputtering method, followed by thermal oxidation at several temperatures (40$0^{\circ}C$-$600^{\circ}C$) for one hour. NO$_2$ sensitivities were investigated for the WO$_3$ thin films with different annealing temperatures. The highest sensitivity was obtained for the samples annealed at $600^{\circ}C$ when it was operated at 20$0^{\circ}C$. The results of XRD analysis showed the annealed samples had polycrystalline phase mixed with triclinic and orthorhombic structures. The sample exhibits higher sensitivity when the system has less triclinic structure. The sensitivities, $R_{gas}/R_{air},$ operating at 20$0^{\circ}C$ to 5 ppm NO$_2$ of the sample annealed at $600^{\circ}C$ were approximately 90.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.4
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• pp.409-416
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• 2012

Recently, surface modification technology is of importance to improve the wear resistance and the corrosive resistance for high accurate mechanical parts such as LM guide, Ball Screw and Roller Bearing etc., Those has generally featured on rolling contact mechanism to improve not only the wear and the friction, but also the accuracy and the corrosion performances. For surface modifications of high accurate mechanical parts, normally thermal spray, PVD, CVD and E.P. processes have been used with many materials such as DLC, raydent, W, Ni, Ti etc. Diamondlike carbon (DLC) films possess a combination of attractive properties and have been largely employed to modify the tribological behaviors such as friction, wear, corrosion, fretting fatigue, biocompatibility, etc. However, for rolling contact mechanism mechanical parts DLC films are needed to study for commercial benefit. Rolling contact mechanism has features on effects of cyclic motions and stresses, and also not simply sliding motions. The papers focused on the performance test of wear and corrosive resistance according to Me-DLC film thickness. And also, its thickness effect of wear analysis was carried out through the simulation of the maximum shear stress under the rolling contact surface. As the results, Me-DLC films have more potential to improve the wear resistance for high precision mechanical parts than raydent films.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.622-622
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• 2013

Piezoelectric energy harvesting (PEH) device refers to a power device for acquiring mechanical energy from the environment surrounding us which would otherwise be wasted and for converting it into usable electrical energy. While much work has been done on developing ZnO nanogenerator (NG) with nanowire arrays, there are some issues of not only scaling up its output power but also optimizing structure for operating feasibly in various conditions. Efficiency of NG is highly dependent on fixed orientation. But in many cases, it is not easy to predict where the pressure and vibration may come from. Furthermore, the direction of the applied mechanical stress is usually non-stationary and can be random in various practical applications. Therefore an omnidirectional PEH is needed.In this work, we investigate an omnidirectional PEH device consisting ZnO nanowires. We deposited spiral patterned ZnO seed layer on Kapton film. We deposited thin Cr layer on the ZnO seed layer using DC-sputter to form a passivation layer to retard un-expected growth of ZnO nanowires. We grew ZnO nanowires along the spiral arms using hydrothermal method. ZnO nanowires have been selectively grown from the ZnO sidewall without Cr layer and have the average length of$5{\mu}m$ and the average diameter of 40nm. We reduced the defect in the as-grown ZnO nanowires by O2 plasma using asher and by thermal treatment using RTA. Consequently, each nanowire has different directions to each other. This isotropic design can lead to the omnidirectional power generation. The morphology of NG is characterized with FESEM. Maximum output power of the device is measured by using a picoammeter and a nanovoltmeter.

• Membrane and Water Treatment
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• v.9 no.1
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• pp.43-51
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• 2018

Hollow fiber (HF) membranes are gaining wide interest over flat membranes due to their compaction and high area to surface volume ratio. This work addresses the fabrication of HF from polysulfone (PS) and polyethersulfone (PES) using N-methylpyrrolidone (NMP) as solvent in addition to other additives to achieve desired characteristics. The semi-pilot spinning system includes jacketed vessel, four spinneret block, coagulation and washing baths in addition to dryer and winder. Different parameters affecting dry-wet spinning phase inversion process were investigated. Dope compositions of PES, NMP and polyvinyl pyrrolidone (PVP) of varying molecular weights as additive were addressed. Some critical parameters of importance were also investigated. Those include dope flow rate, air gap, coagulation & washing baths and drying temperatures. The measured dope viscosity was in the range from 1.7 to 36.5 Pa.s. Air gap distance was adjusted from 20 to 45 cm and coagulation bath temperature from 20 to $46^{\circ}C$. The HF membranes were characterized by scanning electron microscope (SEM), atomic force microscope (AFM) and mechanical properties. Results indicated prevalence of finger like structure and average surface roughness from about 29 to 78.3 nm. Profile of stress strain characteristics revealed suitability of the fibers for downstream interventions for fabrication of thin film composite membrane. Different empirical correlations were formulated which enable deeper understanding of the interaction of the above mentioned variables. Data of pure water permeability (PWP) confirmed that the fabricated samples fall within the microfiltration (MF)-ultrafiltration (UF) range of membrane separation.

• 한국태양에너지학회:학술대회논문집
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• 2009.04a
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• pp.230-234
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• 2009

It is significant technique to increase competitiveness that solar cells have a high energy conversion efficiency and cost effectiveness. When making high efficiency crystalline Si solar cells, evaporated Ti/Pd/Ag contact system is widely used in order to reduce the electrical resistance of the contact fingers. However, the evaporation process is no applicable to mass production because high vacuum is needed. Furthermore, those metals are too expensive to be applied for terrestrial applications. Ni/Cu/Ag contact system of silicon solar cells offers a relatively inexpensive method of making electrical contact. Ni silicide formation is one of the indispensable techniques for Ni/Cu/Ag contact sytem. Ni was electroless plated on the front grid pattern, After Ni electroless plating, the cells were annealed by RTP(Rapid Thermal Process). Ni silicide(NiSi) has certain advantages over Ti silicide($TiSi_2$), lower temperature anneal, one step anneal, low resistivity, low silicon consumption, low film stress, absence of reaction between the annealing ambient. Ni/Cu/Ag metallization scheme is an important process in the direction of cost reduction for solar cells of high efficiency. In this article we shall report an investigation of rapid thermal silicidation of nickel on silngle crystalline silicon wafers in the annealing range of $350-390^{\circ}C$. The samples annealed at temperatures from 350 to $390^{\circ}C$ have been analyzed by SEM(Scanning Electron Microscopy).

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.3.2-3.2
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• 2011

In recent years, inkjet printing technology has received significant attention as a micro/nanofabrication technique for flexible printing of electronic circuits and solar cells, as well for biomaterial patterning. It eliminates the need for physical masks, causes fewer environment problems, lowers fabrication costs, and offers good layer-to-layer registration. To fulfill the requirements for use in the above applications, however, the inkjet system must meet certain criteria such as high frequency jetting, uniform droplet size, high density nozzle array, etc. Existing inkjet devices are either based on thermal bubbles or piezoelectric pumping; they have several drawbacks for flexible printing. For instance, thermal bubble jetting has limitations in terms of size and density of the nozzle array as well as the ejection frequency. Piezoelectric based devices suffer from poor pumping energy in addition to inadequate ejection frequency. Recently, an electrohydrodynamic (EHD) printing technique has been suggested and proposed as an alternative to thermal bubble or piezoelectric devices. In EHD jetting, a liquid (ink) is pumped through a nozzle and a strong electric field is applied between the nozzle and an extractor plate, which induce charges at the surfaces of the liquid meniscus. This electric field creates an electric stress that stretches the meniscus in the direction of the electric field. Once the electric field force is larger than the surface tension force, a liquid droplet is formed. An EHD inkjet head can produce droplets smaller than the size of the nozzle that produce them. Furthermore, the EHD nano-inkjet can eject high viscosity liquid through the nozzle forming tiny structures. These unique features distinguish EHD printing from conventional methods for sub-micron resolution printing. In this presentation, I will introduce the recent research results regarding the EHD nano-inkjet and the printing system, which has been applied to solar cell or thin film transistor applications.

• Polymer(Korea)
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• v.31 no.6
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• pp.526-531
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• 2007

This paper reports the first results of a series of planarization film study for the stainless steel (SS) substrates for flexible displays. Diglycidyl ether of bisphenol A (DGEBA) and octa(dimethylsiloxypropylglycidylether) silsesquioxane (OG) were chosen for the organic and the hybrid epoxies respectively and diaminodiphenylmethane (DDM) was used as a curing agent at 1:2 stoichiometric ratio. These materials were spin-coated on SS substrates and thermal-cured. TGA study indicated that both the pristine and the cured OG were more thermally stable than DGEBA. AFM study showed that the smooth surfaces of $1{\sim}2\;nm$ roughness can be prepared for both DGEBA and OG when the films were thick ($>\;1\;{\mu}$). The electrical properties such as dielectric constant, capacitance and the leakage current with respect to the applied voltage were all stable even after the stress of $100\;V/100^{\circ}C$ was applied for $0{\sim}10000$ seconds indicating that the insulating properties of DGEBA and OG films were very reliable.

• Transactions of Materials Processing
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• v.7 no.4
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• pp.333-339
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• 1998

Hot torsion tests were conducted to investigate the high temperature deformation behavior of $Al_{85}Ni_{10}Y_5$ alloy extrudates fabricated with amorphous ribbons. The powder metallurgy routes, hot pressing and hot extrusion were used to fabricate the extrudates. Thermal properties of amorphous ribbons with different thickness as a function of aging temperature were studied by thin film x-ray dif-fraction (XRD) and differential scanning calorimetry(DSC). The Al phase crystallite firstly formed in the amorphous ribbons and its crystallization temperature($T_x$)Was ~210${\circ}C$ During the processings of consolidation and extrusion, nano-grained structure(~100 nm) was formed in the Al85Ni10Y5 alloy extrudates. The as-extrudated Al85Ni10Y5 alloy and the $Al_{85}Ni_{10}Y_5$ alloy annealed at 250${\circ}C$ for 1 hour showed a flow curve of DRV(dynamic recovery) during hot deformation at 400-550${\circ}C$. On the other hand, the $Al_{85}Ni_{10}Y_5$ alloy annealed at 400${\circ}C$ for 1 hour showed a flow curve of DRX(dynamic recrys-tallization) during hot deformation at 450-500${\circ}C$. Also the flow stress and flow strain of the $Al_{85}Ni_{10}Y_5$ alloy extrudate annealed at 400${\circ}C$ were higher than those at 250${\circ}C$.

• Journal of the Korean Magnetics Society
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• v.14 no.5
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• pp.163-168
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• 2004

We prepared ultra thin film structure of Si(100)/ $SiO_2$(200 nm)/Ta(5 nm)/Ni$_{80}$Fe$_{20/(l～15 nm)}$Ta(5 nm) using an inductively coupled plasma(ICP) helicon sputter. Magnetic properties and cross-sectional microstructures were investigated with a superconduction quantum interference device(SQUID) and a transmission electron microscope(TEM), respectively. We report that NiFe films of sub-3 nm thickness show the B$_{bulk}$ = 0 and B$_{surf}$=-3 ${\times}$ 10$^{-7}$(J/$m^2$). Moreover, Curie temperature may be lowered by decreasing thickness. Coercivity become larger as temperature decreased with 0.5 nm - thick Ta/NiFe interface intermixing. Our result implies that effective magnetic properties of magnetoelastic anisotropy, saturation magnetization, and coercivity may change abruptly in nano-thick films. Thus we should consider those abrupt changes in designing nano-devices such as MRAM applications.