• Korean Journal of Food Science and Technology
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• v.43 no.1
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• pp.30-38
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• 2011

Effects of depolymerization treatments of a carbohydrase mixture (CM), ultrasound, and irradiation on the physical properties of defatted mustard meal-based edible films (DMM films) were investigated. DMM hydrocolloids were added to CM (0.42% (w/w solution)), treated by ultrasound (500-700 W, 10-30 min) or ${\gamma}$-ray (40-100 kGy) to prepare film-forming solutions. Films were formed by drying. The CM treatment at 0.42% (w/w), pH 5.5, and 40-$50^{\circ}C$ with a 0.5 hr incubation time resulted in the highest colloidal stability in the film-forming solution. The depolymerization treatments did not dramatically change the water vapor permeability of the films. The solubility of the film decreased up to 53.1% by the CM treatment. The ultrasound treatment (700 W-30 min) decreased tensile strength and elongation. The ultrasound treatment (600 W-20 min) resulted in more compact and uniform structures of the films. Flavor profiles were differentiated by the power level and the time of the ultrasound treatment.

• Corrosion Science and Technology
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• v.5 no.2
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• pp.62-68
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• 2006

Solvent free high solid coatings are increasingly used as they posses number of advantages such as, lower cost per unit film thickness, better performance and eco-friendliness. In the present study polymeric film-forming materials such as aniline-novolac (ANS), cresol-novolac (CNS) and acrylic copolymer blended cresol-novolac (ACNS) coating materials have been prepared. The corrosion resistance properties of the prepared high solid coating materials have been evaluated through potential-time, potentiodynamic polarization and electrochemical impedance studies (EIS). Among the three coating systems, cresol-novolac polymer coated substrates offer better corrosion resistance property and the order of the performance was found as CNS > ACNS > ANS. We can recommend these systems for use in automobile applications.

• Transactions of Materials Processing
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• v.12 no.1
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• pp.11-17
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• 2003

For metal forming analysis, upper-bound solution is a practical method because the solution is overestimated. However it is not easy to determine the stresses on dies by using upper-bound solution. In this study, new scheme to calculate the stresses on dies based on upper bound solution is proposed. In the velocity fields, imaginary velocity is adapted to analyze the normal pressure on die surfaces. To verify the proposed scheme. plane strain drawing has been considered. The stresses on dies obtained by the proposed scheme are compared with the results of rigid plastic FEM and the experimental results. In the experiments, pressure film is used to measure the normal pressure on dies.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.63-70
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• 2011

Anorthite forming glass frits in amounts up to 25 vol% of the silver powder were added to improve the adhesion between the conductor pattern formed by thick film photoimageable process and the low temperature co-fired ceramics (LTCC) substrate. The sheet resistance of the conductor pattern was raised from 0.13 ${\Omega}/{\square}$ to 2.25 ${\Omega}/{\square}$ as the volume percentage of glass frit increased up to 25 vol%. The adhesion strength was improved with this glass frit increase, but it decreased when the glass content exceeded 20 vol% which are possibly attributed to the liquid pool effect and the reduced fracture toughness in the interface between conductor and LTCC layer. The shrinkage of the width of the conductor pattern decreased with the addition of glass contents.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.597-600
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• 2006

The silver gate and source/drain electrodes for an a-Si thin film transistor were fabricated by the selective electroless plating (SELP) process. Relevant physical properties including taper angle, uniformity and resistivity are investigated. The Ag layer was about 150nm to 250nm thick, the resistivity less than $3{\times}10^{-6}$ Ohm-cm and the taper angle 45'-60' and the nonuniformity less than 10% on G2 substrates. The transfer characteristics with the Ag gate, and source/drain electrodes respectively possessed good field effect mobility similar to conventionally fabricated a-Si TFTs. This process provided low resistivity, low cost and ease of processing.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 1998.10a
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• pp.272-277
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• 1998

Chemical-Mechanical Polishing (CMP) refers to a material removal process done by rubbing a work piece against a polishing pad under load in the presence of chemically active, abrasive containing slurry. CMP process is a combination of chemical dissolution and mechanical action. The mechanical action of CMP involves tribology. The liquid slurry is trapped between the wafer(work piece) and pad(tooling) forming a lubricating film. For the first step to understand material removal rate of the CMP process, the lubricational analyses were done with commercial 100mm diameter silicon wafers to get nominal clearance of the slurry film, roll and pitch angle at the steady state. For this purpose, we calculate slurry pressure, resultant forces and moments at the steady state in the range of typical industrial polishing conditions.

• Tribology and Lubricants
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• v.15 no.1
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• pp.90-97
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• 1999

Chemical-Mechanical Polishing (CMP) refers to a material removal process done by rubbing a work piece against a polishing pad under load in the presence of chemically active, abrasive containing slurry. CU process is a combination of chemical dissolution and mechanical action. The mechanical action of CMP involves tribology. The liquid slurry is trapped between the wafer (work piece) and pad (tooling) forming a lubricating film. For the first step to understand material removal rate of the CMP process, the lubricational analyses were done with commercial 100mm diameter silicon wafers to get nominal clearance of the slurry film, roll and pitch angle at the steady state. For this purpose, we calculate slurry pressure, resultant forces and moments at the steady state in the range of typical industrial polishing conditions.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.5
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• pp.526-529
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• 2004

The nematic liquid crysta](NLC) aligning capabilities using a-C:H thin film deposited at the three kinds of rf bias condition were investigated. A high pretilt angle of NLC on low substrate rf bias applied a-C:H thin films was observed and the low pretilt angle of the NLC on high substrate rf bias applied a-C:H thin films was observed. Consequently, the high NLC pretilt angle and the good aligning capabilities of LC alignment by the IB alignment method on the a-C:H thin film deposited at 1 W rf bias condition can be achieved. It is considered that pretilt angle of the NLC may be attributed to substrate rf bias condition and IB energy time. Therefore, LC alignment is affected by topographical structure forming strong IB energy.

• Proceedings of the Korean Vacuum Society Conference
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• 2008.02a
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• pp.343-343
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• 2008

• 방재와보험
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• s.36
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• pp.31-33
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• 1988

1960년대까지는 저팽창단백포가 유류화재의 진압에 주로 사용되었으니 불소화합물 계면활성제로부터 유출된 합성 AFFF를 개발하면서 해수로도 이의 사용이 가능하고 지역 및 유출화재 예방에서 AFFF 특유의 초기진압효과 및 대형화재를 방지한다는 장점 때문에 널리 사용되고 있으며, 석유화학산업의 저장탱크지역 및 공정지역에서 AFFF와 FPF가 주로 사용되며 부두시설(Oilrig, Marine Tanker, 해상 / 해변터미널)에는 AFFF의 사용이 지배적이다. 현재 사용되고 있는 foam으로는 단백포(Protein: PF), 불화단백포(Fluoroprotein: FPF), 막형성 불화단백포(Film Forming Fluoroprotein Foam: FFFP), 고팽창폼(High Expansion Foam), 수성막 형성폼(Aqueous Film Foaming Foam: AFFF), 알콜폼(Alcohol Resistant Foam: ATD) 등이 있으니 본고에서는 AFFF 중심으로 소개한다.