• Journal of the Korean Wood Science and Technology
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• v.17 no.1
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• pp.3-11
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• 1989

This study was carried out to investigate the physical and mechanical properties. durability of adhesive bond and paint film for the basic data which were required to determine the suitability as a raw material for furniture the laminated veneer lumber (LVL) with pitch pine (Pinus rigida Mill). The results obtained were as follows; 1) The proper pressing time for making the LVL was over 45 second per milimeter of LVL thickness. 2) The bending strength of the LVL was lower than that of the solid wood but the compressive strength of the LVL was similar to that of the solid wood. The strength increased with the decrease of veneer thickness. 3) The impact bending absorbed energy of the LVL was 0 to 0.3 kg.m/$cm^2$ in the direction of parallel to the grain. The energy of the LVL was lower than that of the solid wood (0.68 kg.m/$cm^2$). 4) In warm water soaking and cold-dry tests, delamination of adhered layers surface crack, swelling, and color change were not found when the hot pressing time was over 45 second per milimeter of LVL thickness. As a result of soak under vacuum test shrinkage in the direction of parallel to the grain was about -1.0 percent and. was about 3.0 percent in the direction of the perpendicular to the grain. 6) The film cacks on the LVL's surface after the wet and cold-dry test were not found at all. 7) In the use of the LVL for interior decoration it was considered that the surface of the LVL be overlaid crossly with fancy veneers of birch and paulownia, etc. This cross overlayirg methods have resulted in few cracks on the fancy veneer.

• Applied Chemistry for Engineering
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• v.24 no.5
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• pp.499-506
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• 2013

As the usuage of tempered glass for touch panel increased rapidly with the development of industry, the amount of UV curable coating solution used to protect glass surfaces during a tempered glass manufacturing process increased as well. The UV curable coating has advantages compared to thermal curing such as shortened curing time and non-solvent. Appropriated polymer and monomer were used as an acid polymer to grant an alkali peeling ability. The monomers were 2-hydroxyl methylacrylate, 1,6-hexanediol diacrylate and dipentaerythritol hexaacrylate which have acryl groups of 1, 2, and 6, respectively. The combination of three different types of photoinhibitors were used and bisphenol A epoxy diacrylate was used as an oligomer. In this study, experiments were carried out by controlling the amount of photoinitiator, oligomer, and additive while maintaining the constant content of the acid polymer and the acrylic monomer. The changes in physical properties according to the additive content were investigated. It was found that the combination of photoinitiators was necessary to achieve the hardness above 4H and it was possible to control the delamination type of the coating film from a sheet to pieces by the addition of TPO as an initiator. The increase in oligomer contents increased the hardness and adhesiveness alongside dissection time. Talc content of 20 wt% showed the best results.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.4
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• pp.105-111
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• 2023

Electronic devices have been evolved to be mechanically flexible that can be endured repetitive deformation. This evolution emphasizes the importance of long-term reliability in metal wiring connecting electronic components, especially under bending fatigue in compressed environments. This study investigated methods to enhance adhesion between copper (Cu) and polyimide (PI) substrates, aiming to improve the reliability of copper wiring under such conditions. We applied oxygen plasma treatment and introduced a chromium (Cr) adhesion layer to the polyimide substrate. Our findings revealed that these adhesion enhancement methods significantly affect compression fatigue behavior. Notably, the chromium adhesion layer, while showing weaker fatigue characteristics at 1.5% strain, demonstrated superior performance at 2.0% strain with no delamination, outperforming other methods. These results offer valuable insights for improving the reliability of flexible electronic devices, including reducing crack occurrence and enhancing fatigue resistance in their typical usage environments.