• Journal of Surface Science and Engineering
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• v.52 no.2
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• pp.53-57
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• 2019

Stability and activity of boron doped diamond (BDD) electrode are key factors for water treatment. In this study, BDD electrodes were prepared on various substrates such as Nb, Si, Ti, and $TiN_x/Ti$ by hot filament chemical vapor deposition (HFCVD) method. BDD/Ti film showed the delamination between BDD and Ti substrate due to the formation of TiC layer caused by diffusion of carbon. On the other hand, $BDD/TiN_x/Ti$ showed remarkably improved stability, compared to BDD/Ti. It was confirmed that $TiN_x$ intermediate layer act as barrier layer for diffusion of carbon. High potential window of 2.8 eV was maintained on the $BDD/TiN_x/Ti$ electrode and, better wastewater treatment capability and longer electrode working life than BDD/Nb, BDD/Si and BDD/Ti were obtained.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.77-81
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• 2020

Commercialization of flexible OLED displays, such as rollable and foldable displays, has attracted tremendous interest in next-generation display markets. However, during bending deformation, cracking and delamination of thin films in the flexible display panels are the critical bottleneck for the commercialization. Therefore, measuring mechanical properties of the fragile thin films in the flexible display panels is essential to prevent mechanical failures of the devices. In this study, tensile properties of the metal and ceramic nano-thin films were quantitatively measured by using a direct tensile testing method on the water surface. Elastic modulus, tensile strength, and elongation of the sputtered Mo, MoTi thin films, and PECVD deposited SiN_x thin films were successfully measured. As a result, the tensile properties were varied depending on the deposition conditions and the film thickness. The measured tensile property values can be applied to stress analysis modeling for mechanically robust flexible displays.

• Structural Engineering and Mechanics
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• v.30 no.6
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• pp.713-732
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• 2008

Serviceability and durability of the concrete members can be seriously affected by the corrosion of steel rebar. Carbonation front and or chloride ingress can destroy the passive film on rebar and may set the corrosion (oxidation process). Depending on the level of oxidation (expansive corrosion products/rust) damage to the cover concrete takes place in the form of expansion, cracking and spalling or delamination. This makes the concrete unable to develop forces through bond and also become unprotected against further degradation from corrosion; and thus marks the end of service life for corrosion-affected structures. This paper presents an analytical model that predicts the weight loss of steel rebar and the corresponding time from onset of corrosion for the known corrosion rate and thus can be used for the determination of time to cover cracking in corrosion affected RC member. This model uses fully the thick-walled cylinder approach. The gradual crack propagation in radial directions (from inside) is considered when the circumferential tensile stresses at the inner surface of intact concrete have reached the tensile strength of concrete. The analysis is done separately with and without considering the stiffness of reinforcing steel and rust combine along with the assumption of zero residual strength of cracked concrete. The model accounts for the time required for corrosion products to fill a porous zone before they start inducing expansive pressure on the concrete surrounding the steel rebar. The capability of the model to produce the experimental trends is demonstrated by comparing the model's predictions with the results of experimental data published in the literature. The effect of considering the corroded reinforcing steel bar stiffness is demonstrated. A sensitivity analysis has also been carried out to show the influence of the various parameters. It has been found that material properties and their inter-relations significantly influence weight loss of rebar. Time to cover cracking from onset of corrosion for the same weight loss is influenced by corrosion rate and state of oxidation of corrosion product formed. Time to cover cracking from onset of corrosion is useful in making certain decisions pertaining to inspection, repair, rehabilitation, replacement and demolition of RC member/structure in corrosive environment.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.61-66
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• 2010

Cu-Cu thermo-compression bonding process was successfully developed as functions of the deposited Cu thickness and $Ar+H_2$ forming gas annealing conditions before and after bonding step in order to find the low temperature bonding conditions of 3-D integrated technology where the interfacial toughness was measured by 4-point bending test. Pre-annealing with $Ar+H_2$ gas at $300^{\circ}C$ is effective to achieve enough interfacial adhesion energy irrespective of Cu film thickness. Successful Cu-Cu bonding process achieved in this study results in delamination at $Ta/SiO_2$ interface rather than Cu/Cu interface.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.36 no.9
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• pp.841-850
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• 2008

Strength and failure of composite-to-aluminum rivetted, bonded, and rivet/bonding hybrid single-lap joints were investigated by experiment. A total of 82 joint specimens were tested with 3 different overlap lengths and 2 types of stacking sequence. FM73m adhesive film and NAS9308-4-03 rivet were used for hybrid joints. While failure loads of the bonded and hybrid joints increased as the overlap length increased, failure loads of the rivetted joints were not affected by the overlap length. Effect of the stacking sequence was not remarkable in the simple bonded or rivetted joints. Failure loads of the hybrid joints, however, showed the maximum of 30% difference depending on the stacking sequence. Major failure mode of the bonded and hybrid joints was the delamination of the composite adherend and failure mode of riveted joints was the rivet failure with local bearing.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.2
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• pp.1-11
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• 2014

Flexible transparent conductive electrodes (TCEs) have recently attracted a great deal of attention owing to rapid advances in flexible electronic devices, such as flexible displays, flexible photovoltanics, and e-papers. As the performance and reliability of flexible electronics are critically affected by the quality of TCE films, it is imperative to develop TCE films with low resistivity and high transparency as well as high flexibility. Indium tin oxide (ITO) has been the most dominant transparent conducting material due to its high optical transparency and electrical conductivity. However, ITO is susceptible to cracking and delamination when it is bent or deformed. Therefore, various types of flexible TCEs, such as carbon nanotube, conducting polymers, graphene, metal mesh, Ag nanowires (NWs), and metal mesh have been extensively investigated. Among several options to replace ITO film, Ag NWs and metal mesh have been suggested as the promising candidate for flexible TCEs. In this paper, we focused on Ag NWs and metal mesh, and summarized the current development status of Ag NWs and metal mesh. The several critical issues such as high contact resistance and haze are discussed, and newly developed technologies to resolve these issues are also presented. In particular, the flexibility and durability of Ag NWs and metal mesh was compared with ITO electrode.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.397-397
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• 2007

Diamondlike carbon (DLC) coatings were deposited on alumina ceramic seals using a plasma immersion ion deposition technique (PIID). Then they were subjected to tribological tests using a pin-on-disc tribometer under a high load (1.3 GPa) and under elevated temperatures up to 400C. Coefficients of friction (COFs) were recorded and compared with that of the untreated alumina while the wear tracks were analyzed using SEM with EDS to characterize the DLC films. To enhance the DLC adhesion to the substrate, various interlayers including Si and Cr were deposited using the PIID process or an ion beam assisted deposition (IBAD) method. It was observed that the DLC coating, if adhering well to the substrate, reduced the COFs significantly, from 0.4-0.8 for the uncoated alumina to about 0.05-0.1, within the tested temperature range. The adhesion was determined by the interlayer type and possibly by the application method. Cr interlayer did not perform as well as the Si interlayer. This could also be due to the fact that the Cr interlayer and the subsequent DLC coating had to be done in two different processing systems, while both the Si interlayer and the subsequent DLC film were deposited in one system without breaking the chamber. The coating failure mode was found to be delamination between the Cr and the alumina substrate. In contrast, the Si interlayer with proper DLC deposition procedures resulted in very good adhesion and hence excellent tribological performance. Further study may lead to future DLC applications of ceramic seals.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.79-80
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• 2007

Copper has been used as an interconnect material in the fabrication of semiconductor devices, because of its higher electrical conductivity and superior electro-migration resistance. Chemical mechanical polishing (CMP) technique is required to planarize the overburden Cu film in an interconnect process. Various problems such as dishing, erosion, and delamination are caused by the high pressure and chemical effects in the Cu CMP process. But these problems have to be solved for the fabrication of the next generation semiconductor devices. Therefore, new process which is electro-chemical mechanical planarization/polishing (ECMP) or electro-chemical mechanical planarization was introduced to solve the. technical difficulties and problems in CMP process. In the ECMP process, Cu ions are dissolved electrochemically by the applying an anodic potential energy on the Cu surface in an electrolyte. And then, Cu complex layer are mechanically removed by the mechanical effects between pad and abrasive. This paper focuses on the manufacturing of ECMP system and its process. ECMP equipment which has better performance and stability was manufactured for the planarization process.

• Composites Research
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• v.20 no.6
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• pp.8-14
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• 2007

Debonding failure characteristics of the composite skin-stiffener specimens were experimentally investigated. The influences of bonding methods, types of stiffener shape and various secondary bonding parameters were evaluated. Present test results combined with the previous test results[1] showed that the failure displacement of the skin-stiffener specimens well evaluates the skin-stiffener debonding failure strength of the composite stiffened panels. The specimens with an open type stiffener had lower bending stiffness and larger failure displacement than those with a closed type stiffener. Secondary bonding and co-curing with adhesive had better failure strength than co-curing without adhesive film. Secondary bonded specimens failed by adhesive failure and co-cured specimens failed by delamination failure. As the bondline thickness was thinner, the skin-stiffener specimens had higher failure strength. The fillets had no influence on failure strength of the specimens. The influence of the surface roughness was shown according to types of stiffener shape.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.3
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• pp.87-90
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• 2024

Currently, when oxides are used as insulators in hybrid bonding for 3D integration, they are prone to delamination due to their surface characteristics, and the RC delay value due to the resistance of the metal and the capacitance of the insulator increases as the wiring of the semiconductor chip becomes longer. To solve these problems, we studied the optimization of the conditions of the polymer insulator bonding method for hybrid bonding. To check the possibility of the de-wetting method, we coated a polymer film on the existing micro pillar and conducted hot-press bonding to remove the polymer between the metals. Through this study, it is expected that the introduction of polymers as insulators in hybrid bonding and fine-pitch metal bonding will improve signal transmission speed by reducing RC delay. It is also expected to be commercialized in the future to increase the number of I/O terminals by applying it to hybrid bonding.