• 동력기계공학회지
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• 제9권1호
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• pp.57-63
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• 2005

In the calendar and the advertising catalog, the surface is usually coated by coating polypropylene film. The delamination failure of coating film depends on surface roughness and quality of the substrate paper. In this paper, the mechanisms of delamination failure between the coating film and the paper is investigated by using the root cause analysis as one of techniques of reliability evaluation. The papers used in failure analysis are three kind products made by two domestic and one foreign companies. It found that the main causes of delamination failure between the coating film and the paper were the creation of microvoids caused by shape of filler and their growth caused by contraction of paper.

• Tribology and Lubricants
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• 제33권6호
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• pp.282-287
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• 2017

SU-8 is an epoxy-type photoresist widely used for the fabrication of high-aspect-ratio (HAR) micro-structures in micro-electro-mechanical systems (MEMS). To fabricate highly integrated structures, chemical mechanical polishing (CMP) has emerged as the preferred manufacturing process for planarizing the MEMS structure. In SU-8 CMP, an oxidizer decomposes organic impurities and particles in the CMP slurry remove the chemically reacted surface of SU-8. To fabricate HAR microstructures using the CMP process, the adhesion between SU-8 and substrate material is important to avoid the delamination of the SU-8 film caused by the mechanical-dominant material removal characteristic. In this study, the friction force during the CMP process is measured with a CMP monitoring system to detect the delamination phenomenon and investigate the delamination of the SU-8 film from the silicon substrate under various pressure conditions. The increase in applied pressure causes an increase in the frictional force and wafer-edge stress concentration. The frictional force measurement shows that the friction force changes according to the delamination phenomenon of the SU-8 film, and that it is possible to monitor the delamination phenomenon during the SU-8 CMP process. The delamination at a high applied pressure is explained by the effect of stress distribution and pad deformation. Consequently, it is necessary to control the pressure of polishing, which can avoid the delamination in SU-8 CMP.

• 한국신뢰성학회:학술대회논문집
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• 한국신뢰성학회 2005년도 학술발표대회 논문집
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• pp.199-208
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• 2005

In the calendar and the advertising catalog, the surface Is usually coated by coating polypropylene film. The delamination failure of coating film depends on surface roughness and quality of the substrate paper. In this paper, the mechanisms of delamination failure between the coating film and the paper is investigated by using the root cause analysis as one of techniques of reliability evaluation. The papers used in failure analysis are three kind products made by two domestic and one foreign companies. It found that the main causes of delamination failure between the coating film and the paper were the creation of microvoids caused by shape of filler and their growth caused by contraction of paper.

• 한국세라믹학회지
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• 제43권4호
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• pp.253-258
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• 2006

In the lamination process of multi-layer ceramic modules, the occurrence of delamination comes into repeatedly. To completely improve the lamination process of LTCC sheets, a binder film was introduced between the layers. The binder film did not originate the delamination until the thickness under $40{\mu}m$. After lamination, the thickness of the binder film was determined by the infilteraion of binder by the pressure, and after the bake-out, was dependent on the decomposition of binder resin. Any detectable defect was not observed in the multilayer structure with Ag inner electrodes.

• Transactions on Electrical and Electronic Materials
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• 제6권4호
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• pp.135-139
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• 2005

In this paper, negative SU-8 photoresist processed at low temperature is characterized in terms of delamination. Based on a $3^3$ factorial designed experiment, 27 samples are fabricated, and the degree of delamination is measured for each. In addition, nine samples are fabricated for the purpose of verification. Employing the. neural network modeling technique, a process model is established, and response surfaces are generated to investigate degree of delamination associated with three process parameters: post exposure bake (PEB) temperature, PEB time, and exposure energy. From the response surfaces generated, two significant parameters associated with delamination are identified, and their effects on delamination are analyzed. Higher PEB temperature at a fixed PEB time results in a greater degree of delamination. In addition, a higher dose of exposure energy lowers the temperature at which the delamination begins and also results in a larger degree of delamination. These results identify acceptable ranges of the three process variables to avoid delamination of SU-8 film, which in turn might lead to potential defects in MEMS device fabrication.

• 한국레이저가공학회지
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• 제16권2호
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• pp.7-11
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• 2013

Recently advanced laser processing is widely introduced to improve the efficiency of micro part production and to reduce the rate of inferior goods. In this paper the trend of delamination of single layer with both thin copper and polyimide according to the variation of copper thickness was investigated using the coupled thermal-structural analysis of ANSYS. From these analyses results, some conclusions were obtained. Firstly, the maximum temperature was increasing with respect to decrease of copper thickness. Secondly the maximum strain which was in general estimation the main effect of the delamination was observed in case of the copper thickness of $5{\mu}m$. Finally the trend of the delamination was decreasing with increasing the thickness of copper layer.

• 대한기계학회논문집A
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• 제34권3호
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• pp.375-382
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• 2010

본 논문에서는 In-Mold Labeling(IML) 공정을 이용한 제품생산 과정에서 발생하는 잔류응력과 열변형을 예측할 수 있는 해석모델을 개발하였다. IML 은 선 공정된 필름을 금형에 넣은 후 수지를 사출하여 제품을 생산하는 방법으로, 일반적인 사출성형 공정방법에 비해 뛰어난 색감을 구현할 수 있을뿐 아니라, 반영구적 보존 등의 다양한 장점을 얻을 수 있다. 반면, IML 공정을 이용한 제품 생산의 경우 필름박리 등의 다양한 불량 현상이 발생하기도 하는데, 이 중 필름박리 현상의 주요한 원인 중 한가지로 지목되는 열 변형 현상을 수치해석을 통해 예측하고, 실제 실험결과와 비교하여 연구의 신뢰성을 검증하였다. 이는 IML 공정을 통해 생산되는 제품의 초기설계 단계로부터 필름박리 및 열 변형을 예측하는데 활용될 수 있을 것으로 기대된다.

• 비파괴검사학회지
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• 제19권5호
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• pp.369-377
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• 1999

본 연구는 다중박막(multi-layer) 구조 모델에 대한 초음파신호처리 적용으로 접합경계면의 결함검출에 관한 연구이다. 이를 위해서 먼저 반도체 검사법에 의하여 박리(delamination). 다이 균열(die crack) 기포(void)의 유무를 확인할 수 있었고, 각 접합계면에서의 단위 cm당 결함 오차율을 모집군 25%이하에서 0.003%까지 측정 가능하였다. 또한 초음파 화상처리를 이용하여 결함 판독 프로그램을 위한 각 패키지별 화상을 8단계에서 16단계까지 데이터 베이스화할 수 있었고, 최종 결과 화면에서는 결함정도를 확률로 표현 가능하도록 하였으며 기포의 가능성도 추론해 볼 수 있다. 그리고, 박리검사 프로그램(delamination inspection program)에 의하여 결함의 크기와 결함의 원인을 16단계로 추론하고. S.A.T 장치에 귀환(feedback)시킬 수 있는 매개변수를 찾을 수 있었다. 특히, 반도체 결함추출 알고리즘 개발로 반도체 결함검사자동화의 기틀을 마련하였고, 향후 결함을 세분화하고 다양한 반도체 패키지별로 데이터베이스를 구축한다면, 온라인 상태에서 보다 많은 검사를 수행 할 수 있는 인공지능형 자동검사 시스템 구현이 가능할 수 있도록 하였다.

• 한국재료학회지
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• 제34권3호
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• pp.125-137
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• 2024

Composite laminates are used in a wide range of applications including defense, automotive, aviation and aerospace, marine, wind energy, and recreational sporting goods. These composite beams still exhibit problems such as buckling, local deformations, and interlaminar delamination. To overcome these drawbacks, a novel viscoelastic autoclave bonding with tapered epoxy reinforcement polyurethane films is proposed. In existing laminates, compression face wrinkling and interlaminar delamination is caused in the sandwich beam. The unique viscoelastic autoclave spunbond interlayer bonding is designed to prevent face wrinkling and absorb and distribute stresses induced by external loads, thereby eliminating interlaminar delamination in the sandwich beam. Also, the existing special reinforcement causes stress concentrations, and the core is not effectively connected, which directly affects the stiffness of the beam. To address this, a novel tapered epoxy polyurethane reinforcement adhesive film is proposed, whose reinforcement thickness gradually tapers as it enters the core material. This minimizes stress concentrations at the interface, preventing excessive adhesive squeeze-out during the bonding process, and improves the stiffness of the beam. Results indicate the proposed model avoids the formation of micro cracks, interlaminar delamination, buckling, and local deformations, and effectively improves the stiffness of the beam.

• 반도체디스플레이기술학회지
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• 제18권1호
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• pp.25-31
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• 2019

In this study, a new adhesion evaluating equipment and data processing methods were developed to overcome some limitations of existing evaluating equipment. Nano-diamond coated tool is a specimen of experiment. When applying frictional force and shear force on the specimen by a rotating polishing pad, delamination occurs at a moment. During each experiment, the vibration, load, and torque is obtained by accelerometer, loadcell and torque s+ kpensor. Frictional force and coefficient of friction are obtained by calculating torque and load. Based on FFT transformation, acceleration is processed and analyzed. As a result, the moment of delamination and the load at that time can be detected by the new developed equipment and measurement system. Finally, we call this load as an Adhesion force.