• Journal of the Korean Society of Industry Convergence
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• v.25 no.4_2
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• pp.687-697
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• 2022

An automated system is needed for the effectiveness of non-destructive testing. In order to utilize the radiographic testing data accumulated in the film, the types of welding defects were classified into 9 and the shape of defects were analyzed. Data was preprocessed to use deep learning with high performance in image classification, and a combination of one-stage/two-stage method and convolutional neural networks/Transformer backbone was compared to confirm a model suitable for welding defect detection. The combination of two-stage, which can learn step-by-step, and deep-layered CNN backbone, showed the best performance with mean average precision 0.868.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.3
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• pp.175-184
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• 2001

In this study, the improved throughput and stability in device fabrication could be obtained by applying CMP process to STi structue in 0.18 um semiconductor device. To employ the CMP process in STI structure, the Reverse Moat Process used to be added after STI Fill, as a result, the process became more complex and the defect were seriously increased than they had been,. Removal rate of each thin film in STI CMP was not uniform, so, the device must have been affected. That is, in case of excessive CMP, the damage on the active area was occurred, and in the case of insufficient CMP nitride remaining was happened on that area. Both of them deteriorated device characteristics. As a solution to these problems, the development of slurry having high removal rate and high oxide to nitride selectivity has been studied. The process using this slurry afford low defect levels, improved yield, and a simplified process flow. In this study, we evaluated the 'High Selectivity Slurry' to do a global planarization without reverse moat step, and also we evaluated EPD(Eend Point Detection) system with which 'in-situ end point detection' is possible.

• The Journal of the Korea institute of electronic communication sciences
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• v.17 no.6
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• pp.1075-1080
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• 2022

Recently, the effort is continuously applied in machine learning and deep learning algorithm which is represented as artificial intelligence algorithm in the varies field such as prediction, classification and clustering. In this paper, we propose detection algorithm for un-peeling status of PCB protection film by using Dectron2. We use 42 images of data as training and 19 images of data as testing based on 61 images which was taken under the condition of a critical reflection angel of 42.8°. As a result, we get 16 images that was detected and 3 images that was not detected among 19 images of testing data.

• Proceedings of the Korea Multimedia Society Conference
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• 2001.11a
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• pp.210-214
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• 2001

PCB관련 제품의 최종 제작단계에서 defect 검사 과정은 제품의 질을 유지하기 위해 필수적인 단계이다. PCB 자동화 검사 시스템은 사람에 의해 이루어지는 품질검사에서 발견되는 비용을 절감하고, 신뢰성있는 제작 프로세스를 유지하기 위해 적극적으로 개발되고 있다. 이 논문에서는 PCB 필름의 defect를 검사하기 위하여 적응적 템플렛 기반 검사 방법을 제시하고자 한다. 고정된 템플릿은 구현하기 편리하고 속도면에서 이점을 발휘할 수 있으나, 강력한 센서의 선택에 제약이 있을 환경 하에서 100%에 근접하는 오류검출률 defect detection rate이 요구되는 고정된 템플릿을 제작하는 것에 문제가 있을 수 있다. 여기서는 템플릿 모델에 유연성을 부여하기 위하여 템플릿의 이미지를 목표 이미지들의 상태에 따라 템플릿을 적응적으로 구축하여 검사과정에 동적으로 적용하는 기법을 개발하고자 한다.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2000.04a
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• pp.585-590
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• 2000

Recently, It is gradually raised necessity that thickness of thin film is measured accuracy and managed in industrial circles and medical world. Ultrasonic Signal processing method is likely to become a very powerful method for NDE method of detection of microdefects and thickness measurement of thin film below the limit of Ultrasonic distance resolution in the opaque materials, provides useful information that cannot be obtained by a conventional measuring system. In the present research, considering a thin film below the limit of ultrasonic distance resolution sandwiched between three substances as acoustical analysis model, demonstrated the usefulness of ultrasonic Signal processing technique using information of ultrasonic frequency for NDE of measurements of thin film thickness, sound velocity, and step height, regardless of interference phenomenon. Numeral information was deduced and quantified effective information from the image. Also, pattern recognition of a defected input image was performed by neural network algorithm. Input pattern of various numeral was composed combinationally, and then, it was studied by neural network. Furthermore, possibility of pattern recognition was confirmed on artifical defected input data formed by simulation. Finally, application on unknown input pattern was also examined.

• Journal of the Korean Society for Nondestructive Testing
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• v.19 no.5
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• pp.369-377
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• 1999

Recently, it is gradually raised necessity that thickness of thin film is measured accuracy and managed in industrial circles and medical world. Ultrasonic signal processing method is likely to become a very powerful method for NDE method of detection of microdefects and thickness measurement of thin film below the limit of ultrasonic distance resolution in the opaque materials, provides useful information that cannot be obtained by a conventional measuring system. In the present research. considering a thin film below the limit of ultrasonic distance resolution sandwiched between three substances as acoustical analysis model, demonstrated the usefulness of ultrasonic signal processing technique using information of ultrasonic frequency for NDE of measurements of thin film thickness. Accordingly, for the detection of delamination between the junction condition of boundary microdefect of thin film sandwiched between three substances the results from digital image processing.

• Journal of Advanced Information Technology and Convergence
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• v.10 no.2
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• pp.153-166
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• 2020

DDI(Display Driver IC) are used to drive numerous pixels that make up display. For stable driving of DDI, it is necessary to attach a protective film to shield electromagnetic waves. When the protective film is attached, defects often occur if the film is inclined or the center point is not aligned. In order to minimize such defects, an algorithm for correcting the center point and the inclined angle using camera image information is required. This technology detects the corner coordinates of the protective film by image processing in order to correct the positional defects where the protective film is attached. Corner point coordinates are detected using an algorithm, and center point position finds and correction values are calculated using the detected coordinates. LUT (Lookup Table) is used to quickly find out whether the angle is inclined or not. These algorithms were described by Verilog HDL. The method using the existing software requires a memory to store the entire image after processing one image. Since the method proposed in this paper is a method of scanning by adding a line buffer in one scan, it is possible to scan even if only a part of the image is saved after processing one image. Compared to those written in software language, the execution time is shortened, the speed is very fast, and the error is relatively small.

• Journal of Korea Multimedia Society
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• v.10 no.10
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• pp.1271-1283
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• 2007

To detect defect of FPD(flat panel displays) is very difficult due to uneven illumination on FPD panel image. This paper presents a method to detect various types of defects using the approximated image of the uneven illumination by B-spline. To construct a approximated surface, corresponding to uneven illumination background intensity, while reducing random noises and small defect signal, only the lowest smooth subband is used by wavelet decomposition, resulting in reducing the computation time of taking B-spline approximation and enhancing detection accuracy. The approximated image in lowest LL subband is expanded as the same size as original one by wavelet reconstruction, and the difference between original image and reconstructed one becomes a flat image of compensating the uneven illumination background. A simple binary thresholding is then used to separate the defective regions from the subtracted image. Finally, blob analysis as post-processing is carried out to get rid of false defects. For applying in-line system, the wavelet transform by lifting based fast algorithm is implemented to deal with a huge size data such as film and the processing time is highly reduced.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.57 no.7
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• pp.1295-1297
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• 2008

Large-sized flat-panel displays are widely used for PC monitors and TV displays. In this paper, frequency domain pre-filter algorithms are presented for detection of defects in large-sized Thin Film Transistor-Liquid Crystal Display(TFT-LCD) panel surfaces. Frequency analysis with 1-D, 2-D FFT methods for extract the periodic patterns of lattice structures in TFT-LCD is performed. To remove this patterns, frequency domain band-stop filters were used for eliminating specific frequency components. In order to acquire only defected images, 2-D inverse FFT methods to inverse transform of frequency domain images were used.

• Journal of the Korean Society for Precision Engineering
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• v.13 no.2
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• pp.68-75
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• 1996

More accurate inspection method for facilities of nuclear power plants is required to guarantee the continuous and stable energy supply. The portion of inspection for pipes and pressure vessels is relatively big in the power plants. Conventional inspection methods using ultrasonic wave, x-ray and eddy current for nondestructive testing in nuclear power plants have been performed as the method of contact with objects to be inspected. With this reason these methods have been taken relatively much time, money and manpower. And the area to be inspected is limited by the location of probe or film. These difficulties make the inspection into a time-consuming work. We propose an optical defect detection method using phase shifting realtime holographic interferometry. This method has an advantage that the inspection can be performed at a time for relatively wide area illuminated by the laser beam, a coherent light source and can help an inspector recognize not only defects but also the high stressed areas. In this paper we show that the quantitative measurement using holographic interferometry and image processing for defect in pressure vessels is possible.