• Journal of Welding and Joining
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• v.32 no.3
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• pp.19-26
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• 2014

Through Silicon Via (TSV) technology is the shortest interconnection technology which is compared with conventional wire bonding interconnection technology. Recently, this technology has been also noticed for the miniaturization of electronic devices, multi-functional and high performance. The short interconnection length of TSV achieve can implement a high density and power efficiency. Among the TSV technology, TSV filling process is important technology because the cost of TSV technology is depended on the filling process time and reliability. Various filling methods have been developed like as Cu electroplating method, molten solder insert method and Ti/W deposition method. In this paper, various TSV filling methods were introduced and each filling materials were discussed.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2002.10b
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• pp.333-334
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• 2002

Injection-compression molding parts are many cases with complicated boundary condition which is difficult to analysis of mold characteristics precisely. In this study, the effects of various process parameters such as multi-point gate location, initial charge volume, injection time and pressure have been investigated using finite element method to fomulate the melt front advancement during the mold filling process. A general governing equation for tracking the filling process during injection-compression molding is applied to volume of fluid method. To verify the results of present analysis, they are compared with those of the other paper. The results show a strong effect of processing conditions as a result of variations in the three-dimensional complex geometry model.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1999.05a
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• pp.56-59
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• 1999

In the present study, in order to investigate the effect of the corner filling in the drawing of the rectangular rod from a round bar, the drawing of the square rod from a round bar has been simulated by using rigid-plastic finite element method and artificial neural network has been introduced to reduce the number of simulation. The experimental investigation has been also implemented to verify the efficiency of the application of results of present and previous study. According to the results of present and pervious study, the combination of semi-die angle gives a great effect on the corner filling in case of the irregular shaped drawing process, but, in case of the regular shaped drawing process, the main process variable on the corner filling is reduction in area.

• Transactions of Materials Processing
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• v.10 no.5
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• pp.373-382
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• 2001

Die design by computer simulation has some advantages compared with the conventional method which has performed by designer's experiences and trials and errors. The die filling and solidification process of thixoforming process were simulated by MAGMAsoft/thixo module. Furthermore, the die design for thixoforming was performed with the various geometry shape. The effect of designed gate dimension on filling phenomenon was estimated by filling simulation. The calculated results was compared with experimental data. The free surface phenomenon obtained by experiment have good agreement with computer simulation results. The solidification effect much as prosity and shrinkage for designed semi-solid forging die had been predicted by computer simulation. The designed die for semi-solid forging had been applied to produce of the frame part which is used to airconditious system.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2010.11a
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• pp.353-358
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• 2010

High pressure gas is a widely used storage mode for hydrogen fuel. A typical hydrogen tank that is charged with hydrogen gas can function as a hydrogen supply source in a large number of applications. The filling process of a high-pressure hydrogen tank should be reasonably short. However, when the fill time is short, the maximum temperature in the tank increases. Therefore the process should be designed in such a way to avoid high temperatures in the tank because of safety reasons. The paper simulates the fast filling process of hydrogen tanks using Computational Fluid Dynamics method. The local temperature distribution in the tank is obtained. Results obtained are compared with available experimental data. Further work is going on to improve the accuracy of the calculations.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.28-31
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• 2001

Recently, in order to satisfy the consumer's demand the life cycle and the lead-time of a product is to be shortened. It is thus important to reduce the time and cost in manufacturing trial products. Several techniques have been developed and successfully commercialized in the market RPM(Rapid Prototyping and Manufacturing). However, most commercial systems currently use resins or waxes as the raw materials. So, the limited mechanical strength for functional testing is regarded as an obstacle towards broader application of rapid prototyping techniques. To overcome this problems, high-speed machining technology is being investigated worldwide for rapid manufacturing and even for direct rapid tooling application. In this paper, some fundamental experiments and analyses are carried out to obtain the filling time, materials, method, and process parameters for HisRP process. HisRP is a combination process using high-speed machining technology with automatic filling. In filling process, Bi58-Sn alloy is chosen because of the properties of los-melting point, low coefficient of thermal expansion and enviromental friendship. Also the use of filling wire is of advantage in term of simple and flexible mechanism. Then the rapid manufacturing product, for example a skull, is machined for aluminum material by HisRP process with an automatic set-up device of 4-faces machining.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.8 s.185
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• pp.195-202
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• 2006

High-speed machining (HSM) with excellent quality and dimensional accuracy has been widely used to create 3D structures of metal and plastics. However, the high-speed machining process is not suitable for the rapid realization of 3D thin-walled product because it consumes considerably long time in fixturing process of a work piece. In this paper, an effective rapid manufacturing process is proposed to fabricate 3D thin-walled products directly using HSM, phase change filling and ultrasonic welding. The filling process is useful to hold the thin-walled product during the machining step. The ultrasonic welding process is introduced to make one piece product from two piece parts that are machined by HSM and filling process. The proposed rapid manufacturing (RM) process has been shown that the RM process enables to fabricate the 3D thin-walled products using ABS plastics and aluminum metals from 3D CAD data to functional parts.

• Korean Chemical Engineering Research
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• v.54 no.6
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• pp.723-733
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• 2016

Intensive researches have been focused on the 3-dimensional packaging technology using through silicon via (TSV) to overcome the limitation in Cu interconnection scaling. Void-free filling of TSV by the Cu electrodeposition is required for the fabrication of reliable electronic devices. It is generally known that sufficient inhibition on the top and the sidewall of TSV, accompanying the selective Cu deposition on the bottom, enables the void-free bottom-up filling. Organic additives contained in the electrolyte locally determine the deposition rate of Cu inside the TSV. Investigation on the additive chemistry is essential for understanding the filling mechanisms of TSV based on the effects of additives in the Cu electrodeposition process. In this review, we introduce various filling mechanisms suggested by analyzing the additives effect, research on the three-additive system containing new levelers synthesized to increase efficiency of the filling process, and methods to improve the filling performance by modifying the functional groups of the additives or deposition mode.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.10a
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• pp.152-155
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• 2004

In the semi-solid die casting process, the important thing is the flow behaviors of semi-solid material. The flow patterns of semi-solid material can make the defects during die filling. To control of the flow patterns, is very important and difficult. In this paper, the flow behaviors of the semi-solid A356 alloy material during die filling at various die gate shapes has been observed with the grain size controlled material. The effects of the gate shape on the die filling characteristics were investigated. The filling tests in each plunger strokes were experimented, also simulated on the semi-solid material die casting process by MAGMAsofi. According to the filling tests and computer simulation, the effect of the gate shape on liquid segregation had been investigated.

• Korean Journal of Materials Research
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• v.26 no.8
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• pp.427-429
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• 2016

A multi-step deposition process for the gap-filling of submicrometer trenches using dimethyldimethoxysilane (DMDMOS), $(CH_3)_2Si(OCH_3)_2$, and $C_xH_yO_z$ by plasma enhanced chemical vapor deposition (PECVD) is presented. The multi-step process consisted of pre-treatment, deposition, and post-treatment in each deposition step. We obtained low-k films with superior gap-filling properties on the trench patterns without voids or delamination. The newly developed technique for the gap-filling of submicrometer features will have a great impact on inter metal dielectric (IMD) and shallow trench isolation (STI) processes for the next generation of microelectronic devices. Moreover, this bottom up gap-fill mode is expected to be universally for other chemical vapor deposition systems.