• 제목/요약/키워드: Fillers

검색결과 701건 처리시간 0.027초

목질계 충전제 사용에 따른 도공지 원지의 색상 보완 (Color Supplementation of Base Paper for Coating after Wooden Fillers Addition)

  • 윤명숙;유현진;정철헌;박종문
    • 펄프종이기술
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    • 제44권1호
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    • pp.24-30
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    • 2012
  • This study was carried out in order to analyze a repletion possibility about color change of base paper after elevated heat exposure when wooden fillers were added. Fillers may reduce production cost because its price is usually inexpensive than pulp with higher bulkiness. Wooden fillers have lower density than inorganic fillers, so they may increase bulk more than inorganic fillers. Never the less wooden fillers have disadvantage of yellow color by heat exposure, so the addition level should be carefully controlled. Brightness and whiteness changes after elevated heat exposure depending on coating weight were analyzed. With wooden fillers addition, breaking length and surface strength decreased but bulkiness increased. As the exposure time of elevated heat increased the coating paper with wooden fillers addition had higher brightness and whiteness values than those of inorganic fillers.

Fillers in the Hong Kong Corpus of Spoken English (HKCSE)

  • Seto, Andy
    • 아시아태평양코퍼스연구
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    • 제2권1호
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    • pp.13-22
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    • 2021
  • The present study employed an analytical framework that is characterised by a synthesis of quantitative and qualitative analyses with a specially designed computer software SpeechActConc to examine speech acts in business communication. The naturally occurring data from the audio recordings and the prosodic transcriptions of the business sub-corpora of the HKCSE (prosodic) are manually annotated with a speech act taxonomy for finding out the frequency of fillers, the co-occurring patterns of fillers with other speech acts, and the linguistic realisations of fillers. The discoursal function of fillers to sustain the discourse or to hold the floor has diverse linguistic realisations, ranging from a sound (e.g. 'uhuh') and a word (e.g. 'well') to sounds (e.g. 'um er') and words, namely phrase ('sort of') and clause (e.g. 'you know'). Some are even combinations of sound(s) and word(s) (e.g. 'and um', 'yes er um', 'sort of erm'). Among the top five frequent linguistic realisations of fillers, 'er' and 'um' are the most common ones found in all the six genres with relatively higher percentages of occurrence. The remaining more frequent realisations consist of clause ('you know'), word ('yeah') and sound ('erm'). These common forms are syntactically simpler than the less frequent realisations found in the genres. The co-occurring patterns of fillers and other speech acts are diverse. The more common co-occurring speech acts with fillers include informing and answering. The findings show that fillers are not only frequently used by speakers in spontaneous conversation but also mostly represented in sounds or non-linguistic realisations.

목질계 제지용 충전제 개발을 위한 기초연구(II) - 목질계 충전제가 종이 물성에 미치는 영향 연구 - (Fundamental Study on Developing Lignocellulosic Fillers for Papermaking(II) - Effect of lignocellulosic fillers on paper properties -)

  • 김철환;이지영;이영록;정호경;백경길;이희진;곽혜정;강하륜;김성호
    • 펄프종이기술
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    • 제41권2호
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    • pp.1-6
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    • 2009
  • The purpose of this study was to investigate effects of lignocellulosic fillers made of wood powder and inorganic fillers, such as GCC and PCC, on physical properties of papers. Mechanical treatment and chemical treatment were carried out subsequently for generating lignocellulosic fillers, and then inorganic filler and wood powder were mixed together, and then mechanically treated for making lignocellulosic fillers covered with inorganic fillers. Consequently the particle size of lignocellulosic fillers was higher than that of inorganic fillers, which led to lumen loading and simultaneously surface coverage of fine inorganic fillers. Lignocellulosic fillers contributed to the increase of both bulk and opacity of handsheets dramatically, but some of properties including tensile strength, brightness and roughness decreased compared to inorganic fillers.

충전제 투입위치 이원화에 의한 고충전지 제조 (I) - 고농도 지료 충전이 종이물성과 공정에 미치는 영향 - (Production of High Loaded Paper by Dual Flow Additions of Fillers (I) -Effects of Filler Addition at Thick Stock on Paper Properties and Papermaking Process -)

  • 조병욱;김혁중;원종명
    • 펄프종이기술
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    • 제43권4호
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    • pp.23-30
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    • 2011
  • Fillers have been used for papermaking in order to enhance the optical properties, to improve sheet formation, printability and dimensional stability and to reduce the furnish cost. However, filler particles in paper interfere with fiber-fiber bonding, resulting in decreased paper strength. In order to increase filler content in paper without sacrificing too much paper strength, dual addition technology of fillers was investigated. As a first step, the effects of thick stock addition of fillers on paper properties and papermaking process were elucidated. It was shown that thick stock addition of fillers could increase paper strength at a given filler content. No significant adverse effects on formation, drainage and filler retention were observed. However, bulk of paper was reduced with thick stock addition of fillers, which shall be resolved with regulating other factors such as the mixing ratio of pulps and type of fillers.

Enhancement of Dielectric Properties of Polyamide Enamel Insulation in High Voltage Apparatuses Used in Medical Electronics by Adding Nano Composites of SiO2 and Al2O3 Fillers

  • Biju, A.C.;Victoire, T. Aruldoss Albert;Selvaraj, D. Edison
    • Journal of Electrical Engineering and Technology
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    • 제10권4호
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    • pp.1712-1719
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    • 2015
  • In recent days, there was a significant development on the electrical, thermal, mechanical, physical, chemical, magnetic and optical properties of the polyamide enamel, varnish and other insulating materials by the addition of nano fillers to it. Enamel was used in High Voltage Apparatuses used in Medical Electronics as insulation. Insulating materials determine the life time of the electrical apparatuses. The life time of the insulating materials was improved by the addition of nano fillers to it. Hence the life time of the electrical apparatuses was improved by the mixing of nano fillers to the enamel. In this research, the basic dielectric properties of the enamel and enamel mixed with nano composites of silica and alumina were analyzed and compared with each other. The addition of nano fillers has improved the quality factor and capacitance of the enamel. It was also observed that the addition of nano fillers has reduced the dissipation factor and dielectric losses of the enamel. Heat produced by the dielectric losses was also reduced by adding nano fillers to it.

목질계 제지용 충전제 개발을 위한 기초연구(I) (Fundamental Study on Developing Lignocellulosic Fillers for Papermaking(I))

  • 신태기;김철환;정호경;서정민;이영록
    • 펄프종이기술
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    • 제40권2호
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    • pp.8-15
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    • 2008
  • Wastewoods (logging residues) generated in Korea were used to make lignocellulosic fillers for papermaking. Lignocellulosic fillers could play great roles to increase retention efficiency and thus decrease turbidity of white water in papermaking process. In addition, lignocellulosic fillers could be used to improve physical properties of paper through their high affinity to cellulosic fibers, leading to the less use of chemical additives like retention aids. Wastewoods including Pinus densiflora and Quercus variabilis were chemically and mechanically treated for making fine particles passing through 100 mesh wire. The newly generated fillers showed larger particle size distribution than ground calcium carbonates but similar distribution to talc. In particular, pretreatment by hot water was more effective to generate smaller particle size than by alkali treatment. Lignocellulosic particles mixed with ground calcium carbonates under intense hybridizing condition greatly contributed to surface coverage of organic fillers in addition to filling to lumen and pits.

전처리 목질계 충전제를 이용한 KOCC 수초지의 탈수속도와 물성 변화 (Study on Drainage and Physical Properties of KOCC Handsheet Containing Pretreated Wooden Fillers)

  • 채희재;박종문
    • 펄프종이기술
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    • 제43권3호
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    • pp.21-29
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    • 2011
  • Recently, the use of recycled fibers was increased in order to replace the virgin pulp for low production cost and forest conservation. However, the recycled fibers decreases drainage rate, papermaking efficiency and product quality by short fibers and low wettability because of hornification. To overcome the limitation of low drainage rate, the technology of organic fillers were applied. Wooden fillers gave high bulk and stiffness of paper, but they reduced the strength of paper. In order to improve strength properties 4 types of strength additives were added and analyzed. Cationic starch, branched strength additive, linear wet strength additive, and linear dry strength additive were used. The drainage rate and paper properties such as bulk, air permeability and tensile strength were measured. As results of analysis, addition of branch type of strength agent such as C-starch was effective than linear type of strength agent in the drainage rate. Nevertheless there was no effect on the drainage rate by adding the pretreated wooden fillers. By adding the pretreated wooden fillers, bulk, air permeability and tensile strength of handsheets were improved with low dosage than non-pretreated fillers.

A Composite Dermal Filler Comprising Cross-Linked Hyaluronic Acid and Human Collagen for Tissue Reconstruction

  • Kim, Z-Hun;Lee, Yongjun;Kim, Sun-Mi;Kim, Hojin;Yun, Chang-Koo;Choi, Yong-Soo
    • Journal of Microbiology and Biotechnology
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    • 제25권3호
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    • pp.399-406
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    • 2015
  • In this study, we developed a composite filler comprising cross-linked hyaluronic acid (HA) and human collagen (COL) derived from the human umbilical cord with the aim of improving its biocompatibility and longevity compared with commercially available fillers. After HA/COL composite fillers were made in two different ratios (10:1 and 5:1), the physical properties of the fillers were evaluated. The interior morphologies and in vivo weight change of these hydrogels were also characterized at 1-16 weeks after injection into mice. To evaluate their biocompatibility and durability in vivo, we injected the composite fillers into nude mice subcutaneously. The variations of injected gel weight were measured and compared with the commercial dermal fillers (Restylane and TheraFill). The composites showed improved or similar physical properties (complex viscosity of 19-22 × 105 cP, and injection force of 10-12 N) over the commercial dermal fillers. Sixteen weeks following the injection, the ratio of remaining composite filler weight to initial weight (75.5 ± 16.9%; 10:1) was shown to be greater than that of the commercial fillers (43.2 ± 8.1%, Restylane; 12.3 ± 5.3%, TheraFill). In addition, immunohistochemical analysis with angiogenesis-related markers such as isolectin and vWF revealed newly formed blood vessels and cellular influx into the composite filler, which were not observed in the other fillers. These results clearly suggest that the HA/COL composite filler is a superior candidate for soft tissue reconstruction. The filler we developed may be a suitable candidate as an injectable dermal filler for tissue augmentation in humans.

Reliability Enhancement of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates by Non-Conducting Filler Additions

  • Paik, Kyung-Wook;Yim, Myung-Jin
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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    • pp.9-15
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    • 2000
  • Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

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Reliability Enhancement of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates by Non-Conducting Filler Additions

  • Paik, Kyung-Wook;Yim, Myung-Jin
    • 마이크로전자및패키징학회지
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    • 제7권1호
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    • pp.41-49
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    • 2000
  • Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

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