• Nuclear Engineering and Technology
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• v.50 no.1
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• pp.116-125
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• 2018

Modified 9Cr-1Mo ferritic steel is a preferred material for steam generators in nuclear power plants for their creep strength and good corrosion resistance. Austenitic stainless steels, such as type 316LN, are used in the high temperature segments such as reactor pressure vessels and primary piping systems. So, the dissimilar joints between these materials are inevitable. In this investigation, dissimilar joints were fabricated by the Shielded Metal Arc Welding (SMAW) process with Inconel 82/182 filler metals. The notch tensile properties and Charpy V-notch impact toughness properties of various regions of dissimilar metal weld joints (DMWJs) were evaluated as per the standards. The microhardness distribution across the DMWJs was recorded. Microstructural features of different regions were characterized by optical and scanning electron microscopy. Inhomogeneous notch tensile properties were observed across the DMWJs. Impact toughness values of various regions of the DMWJs were slightly higher than the prescribed value. Formation of a carbon-enriched hard zone at the interface between the ferritic steel and the buttering material enhanced the notch tensile properties of the heat-affected-zone (HAZ) of P91. The complex microstructure developed at the interfaces of the DMWJs was the reason for inhomogeneous mechanical properties.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.158-158
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• 2008

모바일 정보통신기기를 중심으로 실장모듈의 초소형화, 고집적화로 인해 접속단자의 피치가 점점 미세화 됨에 따라 플립칩 본딩용 접착제에 함유되는 무기충전제인 실리카 필러의 크기도 미세화되고 있다. 본 연구에서는 NCP (non-conductive paste)의 실리카 필러의 크기가 COB(chip-on-board) 플립칩 패키지의 신뢰성에 미치는 영향을 조사하였다. 실험에 사용된 실리카 필러는 Fused silica 3 종과 Fumed silica 3종이며 response surface 실험계획법에 따라 혼합하여 최적의 혼합비를 정하였다. 테스트베드로 사용된 실리콘 다이는 투께 $700{\mu}m$, 면적 5.2$\times$7.2mm로 $50\times50{\mu}m$ 크기의 Au 도금범프를 $100{\mu}m$ 피치, peripheral 방식으로 형성시켰으며, 기판은 패드를 Sn으로 finish 하였다. 기판을 플라즈마 전처리 후 Panasonic FCB-3 플립칩 본더를 이용하여 플립칩 본딩을 수행하였다. 패키지의 신뢰성 평가를 위해 $-40^{\circ}C{\sim}80^{\circ}C$의 열충격시험과 $85^{\circ}C$/85%R.H.의 고온고습시험을 수행하였으며 Die shear를 통한 접합 강도와 4-point probe를 통한 접속저항을 측정하였다.

• Korean Journal of Optics and Photonics
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• v.25 no.4
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• pp.221-224
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• 2014

We present a method for manufacturing a TIM used for packaging a high-power LED. In this method a mixture of diamond powder and hydrogen peroxide is used as a filler epoxy. The thermal resistance of the TIM with hydrogen peroxide was improved by about 30% over the thermal resistance of the TIM without hydrogen peroxide. We demonstrate that as a result the heat generated from the chip is easily dissipated through the TIM.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.242-242
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• 2006

Increasingly complex tasks are performed by computers or cellular phone, requiring more and more memory capacity as well as faster and faster processing speeds. This leads to a constant need to develop more highly integrated circuit systems. Therefore, there have been numerous studies by many engineers investigating circuit patterning. In particular, PCB including module/package substrates such as FCB (Flip Chip Board) has been developed toward being low profile, low power and multi-functionalized due to the demands on miniaturization, increasing functional density of the boards and higher performances of the electric devices. Imprint lithography have received significant attention due to an alternative technology for photolithography on such devices. The imprint technique. is one of promising candidates, especially due to the fact that the expected resolution limits are far beyond the requirements of the PCB industry in the near future. For applying imprint lithography to FCB, it is very important to control thermal properties and mechanical properties of dielectric materials. These properties are very dependent on epoxy resin, curing agent, accelerator, filler and curing degree(%) of dielectric materials. In this work, the epoxy composites filled with silica fillers and cured with various accelerators having various curing degree(%) were prepared. The characterization of the thermal and mechanical properties wasperformed by thermal mechanical analysis (TMA), thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), rheometer, an universal test machine (UTM).

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.10
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• pp.834-838
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• 2011

This research shows the electrical characteristic using excellent epoxy nano-composite of MgO 5.0 wt% and $SiO_2$ 0.4 wt% in mechanical strength test depending on nano-additive. First of all, volume resistance depending on nano-additive and temperature using high resistance meter (HP. 4329A) by increasing 10, 100, 1,000 V of applying voltage was measured. Moreover, temperature range of $25{\sim}120^{\circ}C$ with virgin sample was tested using TO-9B oven by Ando Company. The result showed that virgin and the samples added with MgO and $SiO_2$ had similar value of volume resistance in low temperature and low electric field region and reduced with slow slope. The nano-composite's volume resistance of sample added with MgO and $SiO_2$ had higher value than virgin sample's volume resistance in high temperature region more than $80^{\circ}C$. Moreover, the slope has steeply reduced. The volume resistance of sample added with MgO 5.0 wt% was $8.38{\times}10^{13}\;{\Omega}{\cdot}cm$ and it was 6.8 times more than virgin sample in high temperature at $120^{\circ}C$. The insulation characteristics were constant although filler has changed in low temperature region. But, in high temperature region, the value of volume resistance of sample with MgO 5.0 wt% was 7.6 times more than the virgin sample's volume resistance.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.126-127
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• 2007

Sn-filled and Fe-doped $CoSb_3$ skutterudites were synthesized by encapsulated induction melting. Single ${\delta}$-phase was successfully obtained by subsequent annealing and confirmed by X-ray diffraction analysis. Temperature dependences of Seebeck coefficient, electrical resistivity and thermal conductivity were examined from 300 K to 700 K. The positive Seebeck coefficient confirmed the p-type conduction. Electrical resistivity increased with increasing temperature, which shows that the $Sn_zCo_3FeSb_{12}$ skutterudite is highly degenerate. Thermal conductivity was reduced by Sn-filling because the filler atoms acted as phonon scattering centers in the skutterudite lattice. Thermoelectric figure of merit was enhanced by Sn filling and its optimum filling content was considered to be z=0.3 in the $Sn_zCo_3FeSb_{12}$ system.

• Korean Journal of Materials Research
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• v.27 no.12
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• pp.664-671
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• 2017

A composite material was prepared for the bipolar plates of phosphoric acid fuel cells(PAFC) by hot pressing a flake type natural graphite powder as a filler material and a fluorine resin as a binder. Average particle sizes of the powders were 610.3, 401.6, 99.5, and $37.7{\mu}m$. The density of the composite increased from 2.25 to $2.72g/cm^3$ as the graphite size increased from 37.7 to $610.3{\mu}m$. The anisotropy ratio of the composite increased from 1.8 to 490.9 as the graphite size increased. The flexural strength of the composite decreased from 15.60 to 8.94MPa as the graphite size increased. The porosity and the resistivity of the composite showed the same tendencies, and decreased as the graphite size increased. The lowest resistivity and porosity of the composite were $1.99{\times}10^{-3}{\Omega}cm$ and 2.02 %, respectively, when the graphite size was $401.6{\mu}m$. The flexural strength of the composite was 10.3MPa when the graphite size was $401.6{\mu}m$. The lowest resistance to electron mobility was well correlated with the composite with lowest porosity. It was possible the flaky large graphite particles survive after the hot pressing process.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.51-57
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• 2021

This paper analyzed the effects of the concentration of nano-silica particles contained in epoxy resin on the thermomechanical properties of the composite materials. The 12nm sized nanoparticles were mixed with epoxy polymer by 5 different weight ratios for the test samples. The glass transition temperature, stress relaxation, and thermal expansion behaviors were measured using dymanic mechanical analyzer (DMA) and thermomechanical analyzer (TMA). It was shown that the nano particle mixing ratios had significant influences on the viscoelastic behaviors of the materials. As the content of the silica particles was increased, the elastic modulus was also increased, while the glass transition temperatures were decreased. Fourier Transform Infrared Spectroscopy (FTIR) results played an important role in determining the causes of the property changes by the filler contents in terms of the molecular structures, enabling the interpretations on the material behaviors based on the chemical structure changes.

• Steel and Composite Structures
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• v.46 no.4
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• pp.497-512
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• 2023

Using light weight concrete as infill material in conventional cold-formed steel (CFS) shear wall systems can considerably increase their load bearing capacity, ductility, integrity and fire resistance. The compressive strength of the filler concrete is a key factor affecting the structural behaviour of the composite wall systems, and therefore, achieving maximum compressive strength in lightweight concrete while maintaining its lightweight properties is of significant importance. In this study a new type of optimum polystyrene lightweight concrete (OPLC) with high compressive strength is developed for infill material in composite CFS shear wall systems. To study the seismic behaviour of the OPLC-filled CFS shear wall systems, two full scale wall specimens are tested under cyclic loading condition. The effects of OPLC on load-bearing capacity, failure mode, ductility, energy dissipation capacity, and stiffness degradation of the walls are investigated. It is shown that the use of OPLC as infill in CFS shear walls can considerably improve their seismic performance by: (i) preventing the premature buckling of the stud members, and (ii) changing the dominant failure mode from brittle to ductile thanks to the bond-slip behaviour between OPLC and CFS studs. It is also shown that the design equations proposed by EC8 and ACI 318-14 standards overestimate the shear force capacity of OPLC-filled CFS shear wall systems by up to 80%. This shows it is necessary to propose methods with higher efficiency to predict the capacity of these systems for practical applications.

• Journal of Ceramic Processing Research
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• v.13 no.spc2
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• pp.332-335
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• 2012

A molded transformer is maintenance-free, which makes it unnecessary to replace the insulating material, like in an oil-filled transformer, because the epoxy, which is a molded insulating resin, does not suffer variations in its insulating performance for heat cycles over a long time, as compared to insulating oil. In spite of these advantages, a molded transformer may still be accessed by the user, which is not good in regards to reliability or noise compared to the oil transformers. In particular, a distrust exists regarding reliability due to the long-term insulating performance. These properties have been studied in regards to the improvement of epoxy composites and molded transformer insulation. There have nevertheless been insufficient investigations into the insulation properties of epoxy composites. In this study, it is a researching of the epoxy for insulating material. In order to prepare the specimens, a main resin, a hardener, an accelerator, and a nano/micro filler were used. Varying amounts of TiO2 and ZnO nano fillers were added to the epoxy mixture along with a fixed amount of micro silica. This paper presents the DC insulation breakdown test, thermal expansion coefficient, and thermal conductivity results for the manufactured specimens. From these results, it has been found that the insulating performance of nano/micro epoxy composites is improved as compared to plain molded transformer insulation, and that nano/micro epoxy composites contribute to the reliability and compactness of molded transformers.