• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.10
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• pp.641-645
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• 2017

In this study, an epoxy insulation barrier for high voltage GIS was developed using epoxy and a filler with a Young's modulus of 11 GPa. The material was investigated using a simulation of the principal stress, displacement, and safety factors while optimizing the profile shape. The simulation showed that thelarger Young's modulus of the $Al_2O_3$ filler compared to the $SiO_2$ in the epoxy insulation can contribute to an increase in resistance to mechanical fracturing for theoptimized profile barrier in high voltage GIS. In addition, the safety factor was improved by 10%. It can be concluded that the mechanical fracturing properties of the insulation barrier can be enhanced by increasing the content of the elastic filler, $Al_2O_3$, for high voltage GIS applications.

• Journal of Welding and Joining
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• v.34 no.4
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• pp.1-8
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• 2016

Metal AM(Additive Manufacturing) has been steadily developed and that is classified into two method. PBF(Powder Bed Fusion) deposited in the bed by the laser or electron beam as a heat source of the powder material and DED(Directed Energy Deposition) deposited by varied heat source of powder and solid filler material. In the developed countries has been applying high productivity process of solid filler metal based DED method to the aerospace and defense sectors. The price of the powder material is quite expensive compared to the solid filler metal. A study on DED method that is based on a solid filler metal is increasing significantly although was low accuracy and degree of freedom.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.47 no.5
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• pp.74-79
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• 2015

Wood powder is widely used in paperboard mills to increase bulk and reduce drying-energy consumption, but this material also deteriorates paper strength because it interferes with the bonds between fibers. Although there have been many studies done to improve the strength of paperboard containing wood powder, specific applications have not recently been observed in paperboard mills. In this study, we carried out a new approach for improving paperboard strength by developing a new organic filler with the ability to increase the bonds between fibers. The residue of tapioca starch was used as raw material to manufacture an organic filler. The functionalities, including bulk and strength, were evaluated by making handsheets containing either wood powder or tapioca organic filler, or a mixture of the two, and measuring their physical properties. The organic filler showed lower bulk improvement and higher paperboard strength than the wood powder. The mixture of tapioca organic filler and wood powder showed improved paperboard strength compared to wood powder alone. Therefore, tapioca residue can be used as a raw material to manufacture an organic filler for paperboard mills.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.249-249
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• 2009

we have studied that a effect depending on dielectric properties of epoxy resin mixing filler nano/micro. When compare with nano/micro composite and virgin, the nano/micro composite is better than virgin. A specimen mixing nano/micro is changed as temperate, however the width of change is low.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1580-1582
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• 2007

The composites were fabricated with titania used commercially and calcite as a filler in BZB glass matrix and their thermal, optical and electrical properties were investigated. From our results, calcite may be the profitable and highly efficient reflectance material as a filler for flat panel display devices.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.9 no.5
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• pp.34-39
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• 2010

The characteristic evaluation of an aluminium filler tube for automotive is presented in this paper. The material of filler tube was used AL3003 aluminium. In characteristic evaluation of an aluminium filler, we measured the corrosion, chemical resistance, weight, leak, welding strength, exciting endurance, and the solt spray test etc.. It has been shown that the weight decreased approximately 61% in aluminum filler tube developed comparing with steel filler tube. As the characteristic evaluation on the manufactured aluminium filler it was enough satisfied to use at the automotive filler tube.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.36 no.2
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• pp.151-157
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• 2023

Integrating dielectric materials into LTCC is a convenient method to increase the integration density in electronic circuits. To enable co-firing of the high-k and low-k dielectric LTCC materials in a multi-material hetero-laminate, the shrinkage characteristics of both materials should be similar. Moreover, thermal expansion mismatch between materials during co-firing should be minimized. The alternating stacking of an LTCC with silica filler and that with calcium-zirconate filler was observed to examine the use of the same glass in different LTCCs to minimize the difference in shrinkage and thermal expansion coefficient. For the LTCC of silica filler with a low dielectric constant and that of calcium zirconate filler with a high dielectric constant, the amount of shrinkage was examined through a thermomechanical analysis, and the predicted appropriate fraction of each filler was applied to green sheets by tape casting. The green sheets of different fillers were alternatingly laminated to the thickness of 500 ㎛. As a result of examining the junction, it was observed through SEM that a complete bonding was achieved by constrained sintering in the structure of 'calcium zirconate 50 vol%-silica 30 vol%-calcium zirconate 50 vol%'.

• Polymer(Korea)
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• v.37 no.1
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• pp.34-40
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• 2013

Commercially available polyamide thermoplastic elastomer (PA-TPE) was blended with hybrid filler which was prepared by means of the reaction between polyhedral oligomeric silsesquioxane (POSS) containing amine group and toluene diisocyanate (TDI)-caprolactam (CL) to explore the effect of blending the hybrid filler with the TPE. The chemical structure of the filler was identified by using FTIR and $^1H$ NMR. The composites, PA-TPE/POSS-(TDI+CL), which were the blends of TDI+CL modified POSS filler and PA-TPE up to 7 wt%, showed better elastic recovery delivered from lower tension setting compared to the PA-TPE and the PA-TPE/octaphenyl POSS blend. In addition the tensile strength and the initial modulus increased with increasing the hybrid filled content. Consequently it was assumed that the POSS-(TDI+CL) filler was a suitable material for enhancing strength and modulus without loss of elastic properties for the original PA-TPE.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05b
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• pp.159-163
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• 2003

In this study, the DC dielectric breakdown of epoxy composites used for PCB material was experimented and then its data were simulated by Weibull distribution equation. The more hardener increased the stronger breakdown strength at low temperature because of cross-linked density by the virtue of ester radical, and the breakdown strength of specimens with filler was lower than it of non-filler specimens because it is believed that the adding filler forms interface and charge is accumulated in it, therefore the molecular motility is raised, the electric field is concentrated, and the acceleration of electron and the growth of electron avalanche are early accomplished. From the analysis of Weibull distribution, it was confirmed that as the allowed breakdown probability was given by 0.1[%], the applied field value needed to be under 21.5[kV/mm].

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1994.05a
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• pp.9-12
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• 1994

Epoxy-Ceramic Composite have good insulating, therma1 and mechanical properties, so it is studied actively on this material. In this thesis, we made a composite material b)\ulcorner filling Epoxy Resin with ceramics treated with Sillane Coupling Agent and studied dielectric and insulating characteristics according to treatment density of Sillane Coupling Agent and weight percent of filler. As a result, loss tangent increase and electrical breakdown voltage decrease according to increasing treatment density of sillane coupling agent because Interface matching between matrix and filler is not good. The best treatment density of sillane coupling agent is 0.5% water solution, in this density the best interface matching is achieved so good dielectric and insulation characteristics are shown. Dielectric and insulation characteristics according to weight percent of filler are best at 25wt.