• Restorative Dentistry and Endodontics
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• 제28권3호
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• pp.209-221
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• 2003

The objectiveness of this study was to evaluate whether low-viscosity composite can bond effectively to dentin surface without bonding resin. The low-viscosity composites being 50wt% filler content were made by the inclusion of bonding resin of two self-etching systems(Cleafil SE Bond, Unifil Bond) varied with contents as 0, 10, 20, 30, 40, 50wt%. Exposed dentin surfaces of extracted 3rd molars are used. Dentin bond strengths were measured. The tests were carried out with a micro-shear device placed testing machine at a CHS of 1mm/min after a low-viscosity composite was filled into an iris cut from micro tygon tubing with internal diameter approximately 0.8mm and height of 1.0mm. 1 Flexural strength and modulus was increased with the addition of bonding resin. 2. Micro-shear bond strength to dentin was improved according to content of bonding resin irrespective of applying or not bonding resin in bonding procedure, and that of Clearfil SE Bond groups was higher than Unifil Bond. 3. There were no significant difference whether use of each bonding resin in bonding procedure for S-40, S-50, U-50(p＞0.05). 4. In SEM examination, resin was well infiltrated into dentin after primed with self-etching primer only for S-50 and U-50 in spite of the formation of thinner hybrid layer. Low viscosity composite including some functional monomer may be used as dentin bonding resin without an intermediary bonding agent. It makes a simplified bonding procedure and foresees the possibility of self-adhesive restorative material.

• Korean Chemical Engineering Research
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• 제46권1호
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• pp.131-136
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• 2008

용매 N-methyl-2-pyrrolidone(NMP)과 dimethyl acetamide(DMAc)를 각각 사용하고 물을 비용매로 사용하는 상반전 기법에 의해, 실리카($SiO_2$)와 티타니아($TiO_2$) 나노입자가 각각 충진된 poly(vinylidene fluoride-co-hexafluoropropylene) (PVdF-HFP) 고분자 전해질을 제조하고, 이를 고용량 양극재료인 $Li[Ni_{0.15}Co_{0.10}Li_{0.20}Mn_{0.55}]O_2$를 주성분으로 하는 양전극과 리튬금속 음전극 사이에 채용하는 리튬금속 고분자 2차전지를 제작하여 그 충방전 특성을 조사하였다. 고분자 전해질 제조에 사용한 용매에 상관없이 실리카 충진재의 함량이 40~50 wt%인 상반전막을 고분자 전해질로 적용하였을 때 가장 높은 방전용량(180 mAh/g)을 나타내었으며, 이 경우 대개 80 사이클까지 초기용량의 99% 정도의 지속성을 보이다가 그 이후 급격한 용량 감소를 보였다. 이 용량 감소는 상반전막이 보장하는 용량 유지능력이 더이상 발휘될 수 없는 상태로 고분자 전해질에 리튬 dendrite가 침적되었기 때문이라 생각된다.