• 한국레이저가공학회지
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• 제13권1호
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• pp.11-15
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• 2010

Indium tin oxide (ITO) provides high electrical conductivity and transparency in the visible and near IR (infrared) wavelengths. Thus, it is widely used as a transparent electrode for the fabrication of liquid crystal displays (LCDs) and organic light emitting diode displays (OLRDs), photovoltaic devices, and other optical applications. Lasers have been used for removing coating on polymer substrate for flexible display and electronic industry. In selective removal of ITO layer, laser wavelength, pulse energy, scan speed, and the repetition rate of pulses determine conditions, which are efficient for removal of ITO coating without affecting properties of the polymer substrate. ITO coating removal with a laser is more environmentally friendly than other conventional etching methods. In this paper, pattering of ITO film from polymer substrates is described. The Yb:KGW femtosecond laser processing system with a pulse duration of 250fs, a wavelength of 1030nm and a repetition rate of 100kHz was used for removing ITO coating in air. We can remove the ITO coating using a scanner system with various pulse energies and scan speeds. We observed that the amount of debris is minimal through an optical and a confocal microscope, and femtosecond laser pulses with 1030nm wavelength are effective to remove ITO coating without the polymer substrate ablation.

• 한국레이저가공학회지
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• 제11권1호
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• pp.25-31
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• 2008

The characteristics of femtosecond laser ablation of $Al_2O_3$ for prescision microfabrication are studied experimentally. Specifically, the process time during femtosecond laser drilling of microholes with $sub-100{\mu}m$ diameter are investigated for varying laser fluence, scan speed and beam path designs like trepanning with continuously changed start points. The accumulation of sub-micrometer size particles within the hole and the deterioration of edge clarity and roundness for decreasing hole diameter are examined and through process optimization the microdrilling with good hole quality is achieved using a femtosecond laser system (repetitionrate 1 kHz, wavelength 785 nm, pulse duration 185 fs)

• Journal of the Optical Society of Korea
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• 제8권3호
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• pp.127-131
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• 2004

This paper investigates applications of femtosecond lasers for the micromachining of transparent materials and fabrication of optical devices. We show commercial micromachining examples of transparent materials which have been fabricated for various applications. Near infrared femtosecond laser processing is an attractive method to fabricate three-dimensional optical waveguides into various transparent materials. Focused femtosecond laser pulses induce a permanent refractive-index change only near the focal point. We also demonstrate a Y coupler with the splitting ratio of 1:1 written by femtosecond laser pulses into a fused silica glass. The minimum propagation loss of 0.8 ㏈/㎝ awl the refractive-index change of 0.006-0.01 at the wavelength of 1550 ㎚ were achieved by optimization of the laser fluence.

• 한국레이저가공학회지
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• 제10권4호
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• pp.18-22
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• 2007

In this paper, we suggested the femtosecond laser processing using the mask which makes Gaussian spatial beam distribution to a normalized distribution by Fresenel diffraction. Holography pattern of the size of $320{\times}320{\mu}m^2$ on the Cr thin film on glass substrate with a pixel size of $5{\times}5{\mu}m^2$ was fabricated according to the pattern generated by the iterative Fourier transform algorithm(IFTA) algorithm. We analysed the damage threshold with an assumption the power distribution as Gaussian profile as 45 $mJ/cm^2$. The regenerated image of letters through the diffractive pattern was well recognized at the screen.

• 한국레이저가공학회지
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• 제14권3호
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• pp.17-20
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• 2011

We fabricated a multi-layer diffraction grating inside fused silica glass by using a femtosecond laser direct writing method. The femtosecond laser with a wavelength of 515 nm, a pulse width of 250 fs, a repetition rate of 100 kHz, and an average output power of 6 W was used. Two layer diffraction grating with a grating period of $6{\mu}m$ was successfully fabricated with the layer gap of 0.5, 1, 2, 3, and $5{\mu}m$, respectively. Also, we investigated the diffraction pattern by illuminating a He-Ne laser beam. Finally, we demonstrated the diffraction grating with a grating period of $3{\mu}m$ by adjusting the gap of each layer with a grating period of $6{\mu}m$. Femtosecond laser direct writing technology of multi-layer has a potential to fabricate the diffraction grating with a grating period of below $1.5{\mu}m$.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.655-656
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• 2006

We will provide the ultra-precise material processing technique with a femtosecond pulse laser system.

• 한국레이저가공학회지
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• 제11권1호
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• pp.19-24
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• 2008

It has been recognized that laser dicing of wafers results in low mechanical strength compared to the conventional sawing techniques. Thermal shock generated by rapid thermal loading is responsible for this problem. This work presents a two-dimensional ultra-short thermo elastic model for numerical simulation of femtosecond laser ablation of metals in the high-fluence regime where the phase explosion is dominant. Laser-induced thermoelastic stress is analyzed for Ni. The results show that the laser-induced thermal shock is large enough to induce mechanical damages.

• 한국레이저가공학회:학술대회논문집
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• 한국레이저가공학회 2005년도 춘계학술발표대회 논문집
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• pp.61-65
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• 2005

• 한국레이저가공학회:학술대회논문집
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• 한국레이저가공학회 2004년도 추계학술대회논문집
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• pp.62-67
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• 2004

• 한국레이저가공학회지
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• 제17권3호
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• pp.10-14
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• 2014

By the specific character of femtosecond laser controlled volume of magnitude of micrometer scale could be ablated without melting phase in SKD11 and SUS304. According to the laser machining parameters various sectional shapes could be engraved on the surface of metals. Typical engraved lines were $10{\mu}m$ wide and deep. Coarse-milled surface was made $10{\mu}m$ lower than the original elevation by a bunch of laser-engraved lines in suitable spacing. The repeated banks with a height of $10{\mu}m$ could be made with the combination of the intact area.