• Title/Summary/Keyword: Femto-second laser

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3D Packaging Technology Using Femto Laser (팸토초 레이저를 이용한 3차원 패키징 기술)

  • Kim, Ju-Seok;Sin, Yeong-Ui;Kim, Jong-Min;Han, Seong-Won
    • Proceedings of the KWS Conference
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    • 2006.10a
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    • pp.190-192
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    • 2006
  • The 3-dimensional(3D) chip stacking technology is one of the leading technologies to realize a high density and high performance system in package(SIP). It could be found that it is the advanced process of through-hole via formation with the minimum damaged on the Si-wafer. Laser ablation is very effective method to penetrate through hole on the Si-wafer because it has the advantage that formed under $100{\mu}m$ diameter through-hole via without using a mask. In this paper, we studied the optimum method for a formation of through-hole via using femto-second laser heat sources. Furthermore, the processing parameters of the specimens were several conditions such as power of output, pulse repetition rate as well as irradiation method and time. And also the through-hole via form could be investigated and analyzed by microscope and analyzer.

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Additive Process Using Femto-second Laser for Manufacturing Three-dimensional Nano/Micro-structures

  • Yang, Dong-Yol;Lim, Tae-Woo;Son, Yong;Kong, Hong-Jin;Lee, Kwang-Sup;Kim, Dong-Pyo;Park, Sang-Hu
    • International Journal of Precision Engineering and Manufacturing
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    • v.8 no.4
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    • pp.63-69
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    • 2007
  • The two-photon stereolithography (TPS) process is a promising technique for the fabrication of real three-dimensional (3D) nano/micro-structures via application of a femto-second laser, In TPS, when a near-infrared ultrashort-pulsed laser is closely focused onto a confined volume of photocurable resin, only the local area at the center of the focus is cured. Therefore, real 3D microstructures with resolution under the diffraction limit can be fabricated through a layer-by-layer accumulative technique, This process provides opportunities to develop neo-conceptive nano/micro devices in IT/BT industries, However, a number of issues, including development of effective fabrication methods, highly sensitive and functional materials, and neo-conceptive devices using TPS, must be addressed for the realization of industrial application of TPS. In this review article, we discuss our efforts related to TPS: effective fabrication methods, diverse two-photon curable materials for high functional devices, and applications.

Femto-second Laser Ablation Process for Si Wafer Through-hole (펨토초 레이저 어블레이션을 이용한 Si 웨이퍼의 미세 관통 홀 가공)

  • Kim, Joo-Seok;Sim, Hyung-Sub;Lee, Seong-Hyuk;Shin, Young-Eui
    • Journal of the Microelectronics and Packaging Society
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    • v.14 no.3
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    • pp.29-36
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    • 2007
  • The main objectives of this study are to investigate the micro-scale energy transfer mechanism for silicon wafer and to find an efficient way for fabrication of silicon wafer through-hole by using the femtosecond pulse laser ablation. In addition, the electron-phonon interactions during laser irradiation are discussed and the carrier number density and temperatures are estimated. In particular, the present study observes the shapes of silicon wafer through-hole with $100\;{\mu}m$ diameter and it also measures the heat-affected area and the ablation depths fur different laser fluences by using the optic microscope and the three-dimensional profile measurement technique. First, from numerical investigation, it is found that the nonequilibrium state exists between electrons and phonons during laser irradiation. From experimental results, it should be noted that the heat-affected area increases with laser fluence, and the optimal conditions for through-hole formation with minimum heat affected zone are finally obtained.

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Development of a Nano Replication Printing(nRP) Process using a Voxel Matrix Scanning Scheme (복셀 메트릭스 스캐닝법에 의한 나노 복화(複畵)공정 재발)

  • 박상후;임태우;양동열;이신욱;공홍진
    • Journal of the Korean Society for Precision Engineering
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    • v.21 no.2
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    • pp.210-217
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    • 2004
  • In this study, a new process, named as nano replication printing(nRP) process, is developed for printing any figure in the range of several micrometers by using voxel matrix scanning scheme. In this newly developed process, a femto-second laser is scanned on a photosensitive monomer resin in order to induce polymerization of the liquid resin according to a voxel matrix which is transformed from bitmap format file. After the polymerization, a droplet of ethanol is dropt to remove the unnecessary remaining liquid resin and then the polymerized figures with nano-scaled precision are only remaining on the glass plate. By the nRP process, any figure file of bitmap format could be reproduced as nano-scaled precision replication in the range of several micrometers. Also, nano/micro-scaled patterns for an extremely wide range of applications would become a technologically feasible reality. Some of figures with nano-scaled precision were printed in scaled replication as examples to prove the usefulness of this study.

Directly Nano-precision Feature Patterning on Thin Metal Layer using Top-down Building Approach in nRP Process (나노 복화공정의 역방향 적층법을 이용한 직접적 나노패턴 생성에 관한 연구)

  • 박상후;임태우;양동열;공홍진
    • Journal of the Korean Society for Precision Engineering
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    • v.21 no.6
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    • pp.153-159
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    • 2004
  • In this study, a new process to pattern directly on a thin metal layer using improved nano replication printing (nRP) process is suggested to evaluate the possibilities of fabricating a stamp for nano-imprinting. In the nRP process, any figure can be replicated from a bitmap figure file in the range of several micrometers with nano-scaled details. In the process, liquid-state resins are polymerized by two-photon absorption which is induced by femto-second laser. A thin gold layer was sputtered on a glass plate and then, designed patterns or figures were developed on the gold layer by newly developed top-down building approach. Generally, stamps fur nano-imprinting have been fabricated by using the costly electron-beam lithography process combined with a reactive ion-etching process. Through this study, the effectiveness of the improved nRP process is evaluated to make a stamp with the resolution of around 200nm with reduced cost.

Characteristic of FS-laser ablation of metal thin film with respect to the variation of material and substrate (펨토초 레이저를 이용한 박막 재료 및 기판 변화에 따른 가공 특성에 관한 연구)

  • Kim B.H.;Shin H.G.;Lee J.G.;Jeong S.C.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2006.05a
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    • pp.671-672
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    • 2006
  • We have investigated the behavior of the ultrafast laser ablation of chromium films (200nm) on the silicon and pyrex-glass(corning 7740) substrate with respect to the laser fluence and the number of laser pulses. In addition, several experiments about ITO thin film were carried out with femto-second Ti:Sapphire laser (150fs). Finally, we introduce the ablation characteristic in accordance with materials of thin film and substrate.

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High energy laser heating and ignition study

  • Lee, K.C.;Kim, K.H.;Yoh, J.J.
    • Proceedings of the Korean Society of Propulsion Engineers Conference
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    • 2008.03a
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    • pp.525-530
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    • 2008
  • We present a model for simulating high energy laser heating and ignition of confined energetic materials. The model considers effect of ablation of steel plate with long laser pulses and continuous lasers of several kilowatts and the thermal response of well-characterized high explosives for ignition. Since there is enough time for the thermal wave to propagate into the target and to create a region of hot spot in the high explosives, electron thermal diffusion of ultra-short(femto- and pico-second) lasing is ignored; instead, heat diffusion of absorbed laser energy in the solid target is modeled with thermal decomposition kinetic models of high explosives are used. Numerically simulated pulsed-laser heating of solid target and thermal explosion of cyclotrimethylenetrinitramine(RDX), triaminotrinitrobenzene(TATB), and octahydrotetranitrotetrazine(HMX) are compared to experimental results. The experimental and numerical results are in good agreement.

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