• Journal of the Korean Society for Precision Engineering
• /
• v.26 no.3
• /
• pp.25-31
• /
• 2009

Femto-second laser ablation with the various feed velocities of the Invar alloy and the micro surface milling for the processing condition were studied. We used a regenerative amplified Ti:sapphire laser with a 1kHz repetition rate, 184fs pulse duration time and 785nm wavelength. Femto-second laser pulse was irradiated on the Invar alloy with the air blowing at the condition of various laser peak powers and feed velocities. An ablation characteristic according to feed velocity of the Invar alloy was appeared as the non-linear type at different zone of energy fluence. The micro surface milling of the Invar alloy using a mapping method was investigated. The optimal condition of micro surface milling was laser peak power of 22.8mW, feed velocity of 1 mm/s, beam gap of $1{\mu}m$. With the optimal processing condition, the fine rectangular shape without burr and thermal damage was achieved. Using the femto-second laser system, it demonstrates excellent tool for micro surface milling of the Invar alloy without heat effects and poor edge.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
• /
• 2001.05a
• /
• pp.479-482
• /
• 2001

We have measured terahertz electromagnetic pulses when DC voltage from V up to 90V is applied to the transmitter chip excited by femto-second laser pulse. The femto-second excitation laser pulse was injected to transmitter chip. Finally, we are observed the amplitude of electromagnetic pulse and variation of spectrum. Consequently, the amplitude of spectrum was increased to high frequency according to increase of voltage. At that time, the signal-to-noise rate(SNR) is increased from 250:1 to 10, 000:1.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
• /
• v.18 no.6
• /
• pp.31-36
• /
• 2004

Optical coherence tomography system has been extensively studied because it has some advantages such as imaging of high resolution, low cost, and compact size configuration. In order to obtain high resolution of OCT system we configured OCT system using a femto-second laser. We measure the pulse width using autocorrelator function because a femto-second laser is ultra short pulse. And we measured the practical resolution using theoretical equation and the measurement of reference sample. It is confirmed that the proposed OCT system has 1.5 times higher resolution and un distinctive cross-sectional image than OCT system with SLD as a light source.

• Journal of IKEEE
• /
• v.9 no.2 s.17
• /
• pp.115-122
• /
• 2005

We report 400 femto-second highly stable, nearly transform-limited, pulse generation at 10 GHz in $1540{\sim}1550$ nm wavelength region by adiabatic soliton pulse compression of an actively mode-locked fiber ring laser output. Without using any supermode selection device, supermode beating noise has been suppressed below -123 dB/Hz, resulting less than 100 femto-second timing jitters at the noise band of $1\;kHz{\sim}100\;MHz$.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2005.06a
• /
• pp.569-572
• /
• 2005

Technological feasibility of using recently-available femtosecond ultra short pulse lasers for advanced precision length metrology is investigated with emphasis on absolute distance measurements with $10{\mu}m$ ??resolution over extensive ranges. The idea of using femtosecond lasers for the measurement of absolute distances is based on the fact that a short pulse train is a mode-locked combination of discrete monochromatic light components spanning a wide spectral bandwidth. The synthetic wavelength is created from the repetition frequency, $f_r$ of the femtosecond laser and for more precise resolution, higher-order harmonics of the repetition frequency may be selected as the synthetic wavelength by using appropriate electronic filters.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2005.10a
• /
• pp.171-174
• /
• 2005

To improve the strength of glass is being studied in order to contribute to weight saving of flat panel displays. Generally, the strength achieved of glass-ceramics is higher as is the fracture toughness by the formation of a heterogeneous Phase inside glass. In this study, Ag-doped $45SiO_2-24CaO-24Na_2O-4P_2O_5$ glasses were irradiated to strengthen by crystallization using femto-second laser pulse. UV/VIS, Spectroscope, XRD, nano-indenter and SEM etc. irradiation of laser pulse without heat-treated samples was analyzed. Samples irradiated by laser had higher value$(4.4\~4.56{\ast}10-3Pa)$ of elastic modulus which related with strength of glass than values heat-treated samples and these are $1.2\~1.5$ times higher values than them of mother glass. This process can be applicable to the strengthening of thinner glass plate, and it has an advantage over traditional heat-treatment and ion-exchange method.

• Journal of the Korean Ceramic Society
• /
• v.42 no.6 s.277
• /
• pp.377-383
• /
• 2005

Generally, the strength achieved of glass-ceramics is higher as is the fracture toughness, as compared with the original glass. This improvement is due to the microstructure consisting of very small crystals. In this study, Ag-doped $45SiO_2-24CaO-24Na_2O-4P_2O_5$ glasses were irradiated to strengthen by the crystallization using Femto second laser Pulses. Through the UV/VIS spectroscope, XRD, Nano-indenter and SEM etc., heat-treated and irradiation of laser pulses without heat-treated samples were analyzed. Two kinds of samples, heat-treated and laser irradiated without heat-treated samples, showed the peaks in the same wavelength near 360 nm. Especially, samples irradiated by 140 mW laser with XYZ stage having at the rate of 100$\~$l000 $\mu$m/s had the largest absorption peak among them, and heat-treated samples was shown lower absorption range than over 90 mW laser irradiated samples. Moreover, samples irradiated by laser had higher values ($4.4\~4.56{\times}10^{-3}(Pa)$) of elastic modulus which related with strength of glass than values of heat-treated samples and these are 1.2$\~$1 .5 times higher values than them of mother glass.

• Proceedings of the KWS Conference
• /
• 2006.10a
• /
• pp.190-192
• /
• 2006

The 3-dimensional(3D) chip stacking technology is one of the leading technologies to realize a high density and high performance system in package(SIP). It could be found that it is the advanced process of through-hole via formation with the minimum damaged on the Si-wafer. Laser ablation is very effective method to penetrate through hole on the Si-wafer because it has the advantage that formed under $100{\mu}m$ diameter through-hole via without using a mask. In this paper, we studied the optimum method for a formation of through-hole via using femto-second laser heat sources. Furthermore, the processing parameters of the specimens were several conditions such as power of output, pulse repetition rate as well as irradiation method and time. And also the through-hole via form could be investigated and analyzed by microscope and analyzer.

• Journal of the Korean Society for Precision Engineering
• /
• v.27 no.11
• /
• pp.17-23
• /
• 2010

Titanium alloy is one of the hard processing materials made by the traditional manufacturing method because of the excellent mechanical strength. Ablation of titanium alloy is investigated by using a femtosecond laser which is a regenerative amplified Ti:sapphire laser with 1kHz repetition rate, 184fs pulse duration time and 785nm wavelength. Experiments are carried out under various ablation conditions with different pulse overlap ratios for the rectangular shape and micro hole. Test results show that the ablation characteristic according to pulse overlap ratio of titanium alloy seems to be as non-linear type at the different zone of energy fluence. The optimal condition of rectangular shape processing is obtained at the laser peak power 1.3mW, pulse overlap ratio of 90%, beam gap of $1\;{\mu}m$. The micro hole has a good quality from the pulse overlap ratio of 99% at the same laser peak power. With the optimal processing condition, the fine rectangular shape and micro hole without burr and thermal damage are achieved.

• Journal of the Microelectronics and Packaging Society
• /
• v.14 no.3
• /
• pp.29-36
• /
• 2007

The main objectives of this study are to investigate the micro-scale energy transfer mechanism for silicon wafer and to find an efficient way for fabrication of silicon wafer through-hole by using the femtosecond pulse laser ablation. In addition, the electron-phonon interactions during laser irradiation are discussed and the carrier number density and temperatures are estimated. In particular, the present study observes the shapes of silicon wafer through-hole with $100\;{\mu}m$ diameter and it also measures the heat-affected area and the ablation depths fur different laser fluences by using the optic microscope and the three-dimensional profile measurement technique. First, from numerical investigation, it is found that the nonequilibrium state exists between electrons and phonons during laser irradiation. From experimental results, it should be noted that the heat-affected area increases with laser fluence, and the optimal conditions for through-hole formation with minimum heat affected zone are finally obtained.