• 산업공학
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• 제22권2호
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• pp.126-134
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• 2009

As product quality and yield are essential factors in semiconductor manufacturing, monitoring the main manufacturing steps is a critical task. For the purpose, FDC(Fault detection and classification) is used for diagnosing fault states in the processes by monitoring data stream collected by equipment sensors. This paper proposes an FDC model based on decision tree which provides if-then classification rules for causal analysis of the processing results. Unlike previous decision tree approaches, we reflect the structural aspect of the data stream to FDC. For this, we segment the data stream into multiple subregions, define structural features for each subregion, and select the features which have high relevance to results of the process and low redundancy to other features. As the result, we can construct simple, but highly accurate FDC model. Experiments using the data stream collected from etching process show that the proposed method is able to classify normal/abnormal states with high accuracy.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.44-44
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• 2009

Fault detection is necessary for yield enhancement and cost reduction in semiconductor manufacturing. Sensory data acquired from the semiconductor processing tool is too large to analyze for the purpose of fault detection and classification(FDC). We studied the techniques of fault detection using statistical method. Multiple regression analysis smoothly detected faults and can be easy made a model. For real-time and fast computing time, the huge data was analyzed by each step. We also considered interaction and critical factors in tool parameters and process.

• 산업공학
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• 제20권3호
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• pp.288-297
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• 2007

Success of semiconductor/LCD industry depends on its yield and quality of product. For the purpose, FDC (Fault Detection and Classification) system is used to diagnose fault state in main manufacturing processes by monitoring time series data collected by equipment sensors which represent various conditions of the equipment. The data set is segmented at the start and end of each product lot processing by a trigger event module. However, in practice, segmented sensor data usually have the features of data asynchronization such as different start points, end points, and data lengths. Due to the asynchronization problem, false alarm (type I error) and missed alarm (type II error) occur frequently. In this paper, we propose a robust process fault detection system by integrating a process event detection method and a similarity measuring method based on dynamic time warping algorithm. An experiment shows that the proposed system is able to recognize abnormal condition correctly under the asynchronous data situation.

• 반도체디스플레이기술학회지
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• 제19권4호
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• pp.121-125
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• 2020

With miniaturization of semiconductor, the manufacturing process become more complex, and undetected small changes in the state of the equipment have unexpectedly changed the process results. Fault detection classification (FDC) system that conducts more active data analysis is feasible to achieve more precise manufacturing process control with advanced machine learning method. However, applying machine learning, especially in supervised learning criteria, requires an arduous data labeling process for the construction of machine learning data. In this paper, we propose a semi-supervised learning to minimize the data labeling work for the data preprocessing. We employed equipment status variable identification (SVID) data and optical emission spectroscopy data (OES) in silicon etch with SF6/O2/Ar gas mixture, and the result shows as high as 95.2% of labeling accuracy with the suggested semi-supervised learning algorithm.

• 한국정보과학회논문지:컴퓨팅의 실제 및 레터
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• 제15권11호
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• pp.806-818
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• 2009

반도체(semiconductor) 기술은 1950년대에 집적 회로(integrated circuit, IC)가 발명된 이후 오늘날까지 급속한 발전을 거듭하고 있다. 하나의 완전한 반도체를 제조하기 위해서는 매우 다양하고 긴 공정을 거쳐야 한다. 반도체 제조 생산성을 높이기 위하여 공정들이 종료되기 전에 미리 이상(fault)을 발견하기 위한 이상탐지 및 분류(fault detection and classification, FDC)에 대한 많은 연구가 진행되고 있다. 이를 위하여 다양한 반도체 장비에 갖가지 종류의 센서를 부착하여 일정한 시간 간격으로 원하는 값을 측정한다. 이러한 측정 값은 실수 값들의 연속이므로 시계열(time-series) 데이터의 일종이다. 본 논문에서는 반도체 공정에서의 이상탐지 및 클러스터링을 수행하는 알고리즘을 제안한다. 제안된 알고리즘은 시계열 데이터를 심볼릭 표현법(symbolic representation)으로 변환하여 이상을 탐지하는 기존의 알고리즘을 수정한 것이다. 본 논문의 공헌은 일반적인 시계열 데이터에 대한 기존의 이상탐지 알고리즘을 수정하여 반도체 공정 데이터에 대해서도 활용할 수 있음을 보일 뿐만 아니라, 이상탐지 및 클러스터링의 정확성을 높이는 실험 결과를 제시하는 것이다. 실험 결과, 본 논문에서 제안한 알고리즘은 긍정 오류(false positive) 및 부정 오류(false negative)를 모두 발생하지 않았다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.473-474
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• 2008

This paper proposes that the relative transmittance and emission intensity measured via optical emission spectroscopy (OES) is a useful for fault detection of reactive ion etch process. With the increased requests for non-invasive as well as real-time plasma process monitoring for fault detection and classification (FDC), OES is suggested as a useful diagnostic tool that satisfies both of the requirements. Relative optical transmittance and emission intensity of oxygen plasma acquired from various process conditions are directly compared with the process variables, such as RF power, oxygen flow and chamber pressure. The changes of RF power and Pressure are linearly proportional to the emission intensity while the change of gas flow can be detected with the relative transmittance.

• Transactions on Electrical and Electronic Materials
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• 제14권2호
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• pp.71-77
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• 2013

Advanced semiconductor manufacturing technology requires methods to maximize tool efficiency and improve product quality by reducing process variability. Real-time plasma process monitoring and diagnosis have become crucial for fault detection and classification (FDC) and advanced process control (APC). Additional sensors may increase the accuracy of detection of process anomalies, and optical monitoring methods are non-invasive. In this paper, we propose the use of a chromatic data acquisition system for real-time in-situ plasma process monitoring called the Plasma Eyes Chromatic System (PECS). The proposed system was initially tested in a six-inch research tool, and it was then further evaluated for its potential to detect process anomalies in an eight-inch production tool for etching blanket oxide films. Chromatic representation of the PECS output shows a clear correlation with small changes in process parameters, such as RF power, pressure, and gas flow. We also present how the PECS may be adapted as an in-situ plasma arc detector. The proposed system can provide useful indications of a faulty process in a timely and non-invasive manner for successful run-to-run (R2R) control and FDC.

• JSTS:Journal of Semiconductor Technology and Science
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• 제11권1호
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• pp.1-5
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• 2011

To enter next process control, numerous approaches, including run-to-run (R2R) process control and fault detection and classification (FDC) have been suggested in semiconductor manufacturing industry as a facilitation of advanced process control. This paper introduces a novel type of optical plasma process monitoring system, called plasma eyes chromatic system (PECSTM) and presents its potential for the purpose of fault detection. Qualitatively comparison of optically acquired signal levels vs. process parameter modifications are successfully demonstrated, and we expect that PECSTM signal can be a useful indication of onset of process change in real-time for advanced process control (APC).

• 제어로봇시스템학회논문지
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• 제21권9호
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• pp.875-880
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• 2015

Traditional semiconductor process control has been performed through statistical process control techniques in a constant process-recipe conditions. However, the complexity of the interior of the etching apparatus plasma physics, quantitative modeling of process conditions due to the many difficult features constraints apply simple SISO control scheme. The introduction of the Advanced Process Control (APC) as a way to overcome the limits has been using the APC process control methodology run-to-run, wafer-to-wafer, or the yield of the semiconductor manufacturing process to the real-time process control, performance, it is possible to improve production. In addition, it is possible to establish a hierarchical structure of the process control made by the process control unit and associated algorithms and etching apparatus, the process unit, the overall process. In this study, the research focused on the methodology and monitoring improvements in performance needed to consider the process management of future developments in the semiconductor manufacturing process in accordance with the age of the APC analysis in real applications of the semiconductor manufacturing process and process fault diagnosis and control techniques in progress.

• 한국정보처리학회:학술대회논문집
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• 한국정보처리학회 2021년도 춘계학술발표대회
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• pp.459-462
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• 2021

본 연구는 반도체 제조 공정중 발생하는 센서 데이터를 활용하여 딥러닝기반으로 불량을 예측하는 모델을 제안한다. 반도체 공장에서는 FDC((Fault Detection and Classification)라는 불량을 예측하는 시스템이 있지만, 공정의 복잡도가 높고 센서의 종류가 많아 공정 관리자가 모든 센서의 기준을 설정 및 관리하는데 한계가 있다. 이를 해결하기 위해 공정 설비의 센서 데이터를 딥러닝을 활용하여 학습시켜 센서 기준정보로 임계치를 제공하고, 가공중 발생하는 센서 데이터가 입력되면 정상 여부를 판정하는 모델을 제안한다.