• Current Optics and Photonics
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• v.4 no.6
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• pp.509-515
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• 2020

A practical single photon source for fiber-based quantum information processing is still lacking. As a possible 1.55-㎛ quantum-dot single photon source, an InGaAsP/InP-air-aperture micropillar cavity is investigated in terms of fabrication tolerance. By properly modeling the processing uncertainty in layer thickness, layer diameter, surface roughness and the cavity shape distortion, the fabrication imperfection effects on the cavity quality are simulated using a finite-difference time-domain method. It turns out that, the cavity quality is not significantly changing with the processing precision, indicating the robustness against the imperfection of the fabrication processing. Under thickness error of ±2 nm, diameter uncertainty of ±2%, surface roughness of ±2.5 nm, and sidewall inclination of 0.5°, which are all readily available in current material and device fabrication techniques, the cavity quality remains good enough to form highly efficient and coherent 1.55-㎛ single photon sources. It is thus implied that a quantum dot contained InGaAsP/InP-air-aperture micropillar cavity is prospectively a practical candidate for single photon sources applied in a fiber-based quantum information network.

• Transactions of Materials Processing
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• v.12 no.5
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• pp.457-464
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• 2003

In the powder compact melting technique, proper precursor fabrication is very important because density distribution after foaming and foamability are determined during precursor fabrication process. The fabrication of the precursor has to be performed very carefully because any residual porosity or other defects will lead to poor results in further processing. In order to evaluate the effect of the compaction parameters on the kinetics of the foaming process, a series of experiments were performed. In this study, aluminium foams with a closed cell structure were fabricated by using both the powder compact method and the induction heating process. A proper induction coil was designed to obtain a uniform temperature distribution over the entire cross sectional area of precursor. To establish the foamable precursor fabrication conditions, effects of process parameters such as the titanium hydride content (0.3∼1.5 wt.%), pressing pressure of the foamable precursor (50∼150kN) on the pore morphology were investigated.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.12
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• pp.771-775
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• 2015

In this paper, we designed and fabricated low cost imprinting process for micro patterning on FCCL (flexible copper clad laminate). Compared to conventional imprinting process, developed fabrication method processing imprint and UV photolithography step simultaneously and it does not require resin etch process and it can also reduce the fabrication cost and processing time. Based on proposed method, patterns with $10{\mu}m$ linewidth are fabricated on $180mm{\times}180mm$ FCCL. Compared to conventional methods using LDI (laser direct imaging) equipment that showed minimum line with $10{\sim}20{\mu}m$, proposed method shows comparable pattern resolution with very competitive price and shorter processing time. In terms of mass production, it can be applied to fabrication of large-area low cost applications including FPCB.

• Journal of Industrial Technology
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• v.43 no.1
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• pp.49-55
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• 2023

Cluster tools are extensively employed in various wafer fabrication processes within the semiconductor manufacturing industry, including photo lithography, etching, and chemical vapor deposition. Contemporary fabrication facilities encounter customer orders with technical specifications that are similar yet slightly varied. Consequently, modern fabrications concurrently manufacture two or three different wafer types using a cluster tool to maximize chamber utilization and streamline the flow of wafer lots between different process stages. In this review, we introduce two methods of concurrent processing of multiple wafer types: 1) concurrent processing of multiple wafer types with different job flows, 2) concurrent processing of multiple wafer types with identical job flows. We describe relevant research trends and achievements and discuss future research directions.

• Transactions of Materials Processing
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• v.15 no.7 s.88
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• pp.490-495
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• 2006

The application of Al parts in passenger car has been increasing for the last decade, which gives many advantages such as better fuel efficiency, driving performance and safety. Control arm is one of the most preferably substituted parts from steel into Al alloys among numerous automotive parts. Currently, both wrought and cast Al alloys can find the application for control arm in passenger car. The balance between performance and cost determines a material as well as a fabrication process for a particular part model. In the present study, comparison among various processing techniques has been carried out to build up a data base for Al control arm fabrication.

• Journal of Welding and Joining
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• v.16 no.3
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• pp.85-94
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• 1998

Welding fabrication invariantly involves three district sequential steps: preparation, actual process execution and post-weld inspection. One of the major problems in automating these steps and developing autonomous welding system, is the lack of proper sensing strategies. Conventionally, machine vision is used in robotic arc welding only for the correction of pre-taught welding paths in single pass. In this paper, developed vision processing techniques are detailed, and their application in welding fabrication is covered. The software for joint tracking system is finally proposed.

• Journal of the Korean Institute of Telematics and Electronics
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• v.25 no.6
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• pp.637-646
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• 1988

The CMOS physical parameters are extracted using by processing models in fabrication steps, processing parameters, fabrication disturbances, control parameters. Statistical CMOS process and device simulator is proposed to evaluate the effect of inherent fluctuations in IC fabrication. Using this simulator, we perform worst case analysis in terms of statistically independent disturbances and compare this proposed method to Monte Carlo method, previous Worst Case method. And simulation results with this proposed method are more accurate than the past worst case analysis. This package is written in C language and runs on a IBM PC AT(OPUS).

• Proceedings of the Korean Society of Laser Processing Conference
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• 2000.11a
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• pp.3-6
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• 2000

• Proceedings of the Korean Society of Laser Processing Conference
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• 1998.11a
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• pp.47-50
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• 1998

• Journal of the Korean Institute of Telematics and Electronics
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• v.24 no.4
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• pp.618-624
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• 1987

This paper describes the design and fabrication of a signal processing integrated circuit required for the recording and playback of VTR audio signal. The integrated circuit was designed using 8\ulcorner design rule and its chip size is 2.5x2.5mm\ulcorner It was fabricated using SST bipolar standard process technology. The measurement analysis of the fabricated circuit proves the satisfactory DC characteristics and its proper audio signal processing funcstion.