• 대한산업공학회지
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• 제21권3호
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• pp.357-369
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• 1995

Wafer fabrication process is the most important and critical process in semiconductor manufacturing. The process is very complicated and hard to establish an efficient schedule due to its complexity. Furthermore, several performance indices such as due dates, throughput, cycle time and workstation utilizations are to be considered simultaneously for an efficient schedule, and some of these indices have negative correlations in performances each other. We develop an efficient heuristic scheduling algorithm; Hybrid Input Control Policy and Hybrid Dispatching Rule. Through numerical experiments, it is shown that the proposed Hybrid Scheduling Algorithm gives better performance compared with existing algorithms.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1992년도 추계학술대회 논문집
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• pp.106-109
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• 1992

In this study, a single optical modulator which is fabricated on X-cut $LiNbO_3$ substrate by using proton exchange method is described. It is well-known that the proton exchange method is characterized by index change of the single optical modulator. As a results, it is found that the single optical waveguide varied widely with controlling diffusion process. The diffusion process was used to optimize the fabrication of the single optical modulator. On the other hand, the process was used to provide another performance improvement and it reduced the fabrication process.

• 국제학술발표논문집
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• The 3th International Conference on Construction Engineering and Project Management
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• pp.1081-1087
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• 2009

An automatic construction system in Korea is now at the stage of the full automation like in Japan, and an actual pilot project is going to be built in 2009. However, in developing a new construction system that has never been implemented before, there is a need to assess the performance and to consider the uncertainty of the system. The program evaluation and review technique (PERT) allows dealing with this uncertainty. Thus, this paper implements an analysis of the process of steel fabrication and makes suggestions for time-related problems arising from the analysis. The time required for steel erection by the automatic system was compared with that in the traditional method. In the result, finding out another construction process and improving robot performance were proposed to resolve the problems. The results will contribute to promoting the development of an efficient system for the new automatic construction system.

• 한국시뮬레이션학회논문지
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• 제26권4호
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• pp.35-41
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• 2017

사물 인터넷 기술의 발전에 따라 모바일 기기와 센서 등에 대한 수요가 급증하고 있으며, 다양한 전자 제품에 대한 개발이 이루어지고 있다. 이러한 신제품들에 사용될 반도체 소자와 재료, 공정 장비들도 다양해지고 있으며, 공정마다 최적의 공정 변수를 찾는 과정들이 수반된다. 효율적인 공정 최적화를 위하여 시뮬레이션을 이용하거나 실시간 공정 제어 시스템을 사용하여 공정 변수를 찾을 수 있겠지만, 공정 데이터의 피드백과 비용, 범용성 등의 한계가 있다. 본 연구에서는 효율적으로 최적의 공정 변수를 찾기 위해 소자의 목표 특성과 제작된 소자의 특성을 비교하여 공정 장비를 자동으로 제어하는 시뮬레이터를 개발하였다. 이 시뮬레이터의 범용성을 극대화하기 위하여 온라인 기능이 구현되어 있지 않은 반도체 공정 장비에 장착할 수 있는 각종 센서 모듈과 조작 모듈들을 제작하였고, 이 모듈들을 원격에서 접근이 가능하도록 사물 인터넷 기술을 접목하였다. 최적의 공정 변수를 찾기 위한 방법은 딥러닝 기반의 인공지능을 사용하였다. 제안하는 시뮬레이터는 기존의 공정 장비들을 온라인으로 제어하고 최적의 공정 변수들을 찾을 수 있기 때문에 신제품 개발에 필요한 시간과 비용을 줄일 수 있을 것으로 기대된다.

• 한국재료학회지
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• 제14권8호
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• pp.542-546
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• 2004

We report a new fabrication process for high performance triode type CNT field emitters and their superior electrical properties. The CNT-based triode-type field emitter structure was fabricated by the conventional semiconductor processes. The keys of the fabrication process are spin-on-glass coating and trim-and-leveling of the carbon nanotubes grown in trench structures by employing a chemical mechanical polishing process. They lead to strong adhesion and a uniform distance from the carbon nanotube tips to the electrode. The measured emission property of the arrays showed a remarkably uniform and high current density. The gate leakage current could be remarkably reduced by coating of thin $SiO_{2}$ insulating layer over the gate metal. The field enhancement factor(${\beta}$) and emission area(${\alpha}$) were calculated from the F-N plot. This process can be applicable to fabrication of high power CNT vacuum transistors with good electrical performance.

• 센서학회지
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• 제15권2호
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• pp.148-152
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• 2006

This paper describes the fabrication of SiCN microstructures for super-high temperature MEMS using photopolymerization of pre-ceramic polymer. In this work, polysilazane liquide as a precursor was deposited on Si wafers by spin coating, microstructured and solidificated by UV lithography, and removed from the substrate. The resulting solid polymer microstructures were cross-linked under HIP process and pyrolyzed to form a ceramic of withstanding over $1400^{\circ}C$. Finally, the fabricated SiCN microstructures were annealed at $1400^{\circ}C$ in a nitrogen atmosphere. Mechanical characteristics of the SiCN microstructure with different fabrication process conditions were evaluated. The elastic modules, hardness and tensile strength of the SiC microstructure implemented under optimum process condtions are 94.5 GPa, 10.5 GPa and 11.7 N/min, respectively. Consequently, the SiCN microstructure proposed in this work is very suitable for super-high temperature MEMS application due to very simple fabrication process and the potential possiblity of sophisticated mulitlayer or 3D microstructures as well as its good mechanical properties.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제53권10호
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• pp.546-550
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• 2004

Two fabrication approaches are proposed to planarize the sacrificial layer over hollow structures. One is the photoresist filling method that makes use of photolithography, thermal curing and plasma ashing. The other is the lamination method that is applying pressure and temperature to the organic film over the hollow structures. The fabrication results are compared with those of CMP process. Trenches and cavities with various dimensions have been made for the porposed process. Upon measuring the planarization levels, they are dependent on planarization methods and the geometrical size of hollow structures. The photoresist filling method is so strongly dependent on the width and depth of trenches that we have problems to use it for large dimensional trenches. To the contrary, the flatness of sacrificial layer over the trenches was found to be almost independent of trench dimensions for the lamination method. A CMP process shows the most excellent results, but the fabrication is complicated and the access to it is not so easy. It is important to choose the proper planarization method by considering the required flatness levels, materials to be planarized, and connection between the planarization step and the previous or the following process of it.

• 한국정보처리학회논문지
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• 제5권1호
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• pp.111-118
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• 1998

직물의 밀도를 측정하는 작업은 직물 제직 공정에서 매우 중요한 사항이나 일반적으로 직물 제직 공장에서는 고속의 제직 라인에서 수작업에 의해 비효율적으로 행해지고 있다. 따라서 직물 제직 공정에서 직물의 포목 교정을 통해 고품질의 직물을 생산하기 위해서는 정확한 밀도 측정 과저잉 필수적인 사항이다. 본 논문에서는 고속의 제직 공정에서 광학적인 실린더 렌즈를 이용하여 직물의 위사 정보를 검출한 후 밀도 측정을 자동화함으로써 양질의 직물 생산과 직물 생산 효율을 극대화하고자 자동 밀도 측정 시스템을 제안하였다. 제안한 자동 밀도 측정 시스템은 고속의 직물 제직 공정에서 직물의 전체 영역에 걸쳐 일정한 밀도를 유지시켜 고품질의 직물 생산을 가능하게 하였다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1825-1828
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• 2008

A simple method for the fabrication of porous nano-master for antireflective surface is presented. In conventional fabrication methods for antireflective surface, coating method with low refractive index has usually been used. However, it is required to have high cost and long times for mass production. In this paper, we suggested the fabrication method of antireflective surface by the hot embossing process using the porous nano patterned master on silicon wafer fabricated by low-temperature anodic aluminum oxidation. Through multi-AAO and etching processes, nano patterned master with high aspect ratio was fabricated at the large area. Pore diameter and inter-pore distance are about 150nm and from 150 to 200nm. In order to replicate anti-reflective structure, hot embossing process was performed by varying the processing parameters such as temperature, pressure and embossing time etc. Finally, antireflective surface can be successfully obtained after etching process to remove selectively silicon layer of AAO master.

• Journal of Welding and Joining
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• 제28권4호
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• pp.41-48
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• 2010

The purpose of this study is to establish the control method of the global bending distortion caused by fabrication process of hatch-cover in a container ship. In order to do it, the transitional behavior of global bending distortion in the deck of hatch-cover during fabrication process was measured by 3-dimensional measuring instrument. From the results, the principal factor controlling the global bending distortion was identified as the bending moment associated with the longitudinal shrinkage force and transverse shrinkage caused by welding and flame heating and the change of the centroid axis of hatch-cover in each fabrication process. Therefore, in this study, with the predictive equations of the longitudinal shrinkage force and transverse shrinkage caused by welding and flame heating and the simplified thermo elastic method, the predictive method for the global bending distortion was established and verified by comparing with the measured result. Based on the results, the amount of reverse bending distortion of main stiffeners was determined to prevent the global bending distortion of hatch-cover.