• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.05a
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• pp.241-244
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• 2004

Microlens patterned micro-mold fabrication method for Light Guiding Plate(LGP), kernel part of LCD-BLU(Back Light Unit), was presented. Instead of erosion dot pattern for LCP optical design, microlens pattern, fabricated by LIGA-reflow process, was applied. Optical pattern design method was also developed not only for negative pattern LGP, but also positive pattern LGP. In order to achieve flow balance during the micro-injection molding process and dimensional accuracy, two LGP pattern was made in one micro-mold.

• JSTS:Journal of Semiconductor Technology and Science
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• v.2 no.4
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• pp.273-279
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• 2002

This paper presents a fabrication technology for the integration of single crystal Si microstructures with on-chip circuitry. It is a dissolved wafer technique that combines an electro-chemical etch-stop for the protection of circuitry with an impurity-based etch-stop for the microstructures, both of which are defined in an n-epi layer on a p-type Si wafer. A CMOS op. amp. has been integrated with $p^{++}$ Si accelerometers using this process. It has a gain of 68 dB and an output swing within 0.2 V of its power supplies, unaffected by the wafer dissolution. The accelerometers have $3{\;}\mu\textrm{m}$ thick suspension beams and $15{\;}\mu\textrm{m}$ thick proof masses. The structural and electrical integrity of the fabricated devices demonstrates the success of the fabrication process. A variety of lead transfer methods are shown, and process details are discussed.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.1-5
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• 2015

Recently, data throughput of smart electric devices increases dramatically. There is a great interest in a new technology which exceeds the limit of electrical transmission method. Optical PCB can supplement the weakness of electrical signal processing, the research for optical PCB is very active. In this paper, we propose the thermal imprint lithography process to fabrication optical layer of optical PCB and experiment to optimize the process conditions. We confirm process time, pressure, process temperature, demolding temperature and fabricate optical interconnection structure which has $45^{\circ}$ tilted mirror surface for confirm the interconnection efficiency.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.389-392
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• 2001

The characteristics of thixoforming process can decrease liquid segregation because of the improvement in fluidity in a globular microstructure state and utilizes flow without an air entrapment. Therefore, in order to obtain the sound parts of metal matrix composites by using thixoforming process which is co-existing solidus-liquidus phase, it is very important to obtain a die design, fabrication conditions which affects the uniformity of the solid fraction on unfilling state and various defects throughout the fabricated parts. The die designs and fabrication conditions to obtain the good piston part are proposed for thixogorging process of metal matrix composites.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.1
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• pp.16-22
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• 1993

A via-hole process for reproducible and reliable GaAs MMIC fabrication is described. The via-hole etching process consists of two step dry etching. During the first etching step a BC $I_{3}$/C $I_{2}$/Ar gas mixure is used to achieve high etch rate and small lateral etching. In the second etching step. CC $L_{2}$ $F_{2}$ gas is used to achieve selective etching of the GaAs substrate with respect to the front side metal layer. Via holes are formed from the backside of a 100$\mu$m thick GaAs substrate that has been evaporated initially with 500.angs. thick chromium and subsequently a 2000.angs. thick gold layer. The fabricated via holes are electroplated with gold (~20$\mu$m thick) to form via connections. The results show that established via-hole process is satisfactory for GaAs MMIC fabrication.

• IE interfaces
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• v.21 no.2
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• pp.141-150
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• 2008

In this paper, an efficient control method for semiconductor fabrication process is presented. Generally, control is performed with data which is under the influence of process disturbance. EWMA is one of the most popular control methods in semiconductor fabrication that effectively deals with varying process condition. A new method using EWMA, called the Dual Damping EWMA, is presented in this study to reduce over-control by separating weight factor of input and output. The goal is to reflect Drift but reduce the effects of White noise in run to run control. Simulation is performed to evaluate the performance of DPEWMA and to compare with EWMA and Double EWMA.

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.2257-2259
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• 2000

This paper reports on the design, fabrication and driving experiment of micro mirror array(MMA) for lithography process to apply to biochip fabrication Photolithography technology is applied to activate specific area on the surface of modified glass surface, DNA monomers are bound on the activated area of the glass surface. After repeat of DNA monomer synthesizing process, DNA single strand probes could be solid-synthesized on the glass substrate. Without using photomask, photolithography process is tried using micro mirror array(MMA). Photomask or mask alignment is not required in maskless photolithography process using micro mirror array.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.11a
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• pp.58-62
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• 2000

The fabrication process and analysis of thermal properties of 50~76vo1% SiCp/Al metal matrix composites(MMCs) for heatsink materials in electronic packaging were investigated. The 50~76vo1% SiCp/Al MMCs fabricated by pressure infiltration casting process showed that thermal conductivities were 85~170W/mK and coefficient of thermal expansion(CTE) were ranged 10~6ppm1k. Specially, the thermal conductivity and CTE of 71vo1%SiCp/Al MMCs were ranged 115~156W/mK and 6~7ppm/K. respectively, which showed a improved thermal properties than the conventional electronic packaging materials such as ceramics and metals.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.9
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• pp.1517-1523
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• 2003

Deep X-ray lithography (DXRL), a fabrication method for the production of microstructures with a high aspect ratio, plays an important role in the subsequent electroplanting process. However, secondary radiation is generated during X-ray exposure and damages the resist adhesion to the metal layer. To solve adhesion problems, we modified the conventional DXRL process, changing the sequence of polymer adhesion in DXRL process. With optimized X-ray exposure and development conditions based on a calculated and modified X-ray power spectrum, we fabricated various polymer microstructures and achieved a maximum aspect ratio of 40.

• Proceedings of the Korea Society for Simulation Conference
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• 1999.04a
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• pp.105-109
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• 1999

Tool shop of the D Heavy Industries Co.(DHI) fabricates engines for a bus, truck, small ship. In order to increase the production capacity of engines, DHI will be established the new tool shop that consists of a block line, head line, assembly line, test line and AS/RS in 1999. In order to assure the production capacity designed of the new tool shop for producing engines and improve the production process of it, it is needed to find a bottleneck process and an optimal way of allocating workloads among machines and workers to maximize the production. In a way to solve this, we model the engine fabrication process of the tool shop and analyze its performance by computer simulation. In this study, we at first identify the bottleneck processes of the engine fabrication process under the designed operation policy. Then, we derive some alternative operating policies applicable to the new tool shop of an engine, and analyze the optimal operation policy by comparing the performance of the tool shop following each alternative policy.