• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.1108-1109
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• 2008

To survive in outdoor environments, photovoltaic modules rely on packaging materials to provide requisite durability. We analyzed the properties of encapsulant materials that are important for photovoltaic module packaging. Recently, the thickness of solar cell gets thinner to reduce the quantity of silicon. And the reduced thickness make it easy to be broken while PV module fabrication process. Solar cell's micro cracks are increasing the breakage risk over the whole value chain from the wafer to the finished module, because the wafer or cell is exposed to tensile stress during handling and processing. This phenomenon might make PV module's maximum power and durability down. So, when using thin solar cell for PV module fabrication, it is needed to optimize the material and fabrication condition which is quite different from normal thick solar cell process. Normally, gel-content of EVA sheet should be higher than 80% so PV module has long term durability. But high gel-content characteristic might cause micro-crack on solar cell. In this experiment, we fabricated several specimen by varying curing temperature and time condition. And from the gel-content measurement, we figure the best fabrication condition. Also we examine the crack generation phenomenon during experiment.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.12
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• pp.123-130
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• 2009

This study presents the application of a polymer behavior model that considers fluid mechanics and heat transfer effects in a deposition system. The analysis of the polymer fluid properties is very important in the fabrication of precise microstructures. This fluid behavior model involves the calculation of velocity distribution and mass flow rates that include the effect of heat loss in the needle. The effectiveness of the proposed method was demonstrated by comparing estimated mass fluid rates with experimental values. The mass fluid rates under various process conditions, such as pressure, temperature, and needle size, reflected the actual deposition state relatively well, and the assumption that molten polycaprolactone(PCL) is a non-Newtonian fluid was reasonable. The successful fabrication of three-dimensional microstructures demonstrated that the model is valid for predicting the polymer behavior characteristics in the microstructure fabrication process. The results of this study can be used to investigate the effect of various parameters on fabricated structures before turning to experimental approaches.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.9-9
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• 2008

Recently, the thickness of solar cell gets thinner to reduce the quantity of silicon. And the reduced thickness make it easy to be broken while PV module fabrication process. This phenomenon might make PV module's maximum power and durability down. So, when using thin solar cell for PV module fabrication, it is needed to optimize the material and fabrication condition which is quite different from normal thick solar cell process. Normally, gel-content of EVA sheet should be higher than 80% so PV module has long term durability. But high gel-content characteristic might cause micro-crack on solar cell. In this experiment, we fabricated several specimen by varying curing temperature and time condition. And from the gel-content measurement, we figure the best fabrication condition. Also we examine the crack generation phenomenon during experiment.

• Composites Research
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• v.22 no.6
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• pp.7-12
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• 2009

This paper deals with a fabrication method of composite hinge mechanisms for flapping-wing micro air vehicles. The fabrication process includes curing process of Graphite/Epoxyprepregs, laser cutting for high fabrication repeatability, laminating of Graphite/Epoxy prepregs with Kapton film which is used for flexure, and so on. The fabricated hinge mechanism was attached with PUMPS actuators and the measured flapping angle was $173^{\circ}$ when driving voltage was 300V 170Hz.

• Current Optics and Photonics
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• v.8 no.3
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• pp.259-269
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• 2024

Optical imaging systems that operate through atmospheric pathways often suffer from image degradation, mainly caused by the distortion of light waves due to turbulence in the atmosphere. Adaptive optics technology can be used to correct the image distortion caused by atmospheric disturbances. However, there are challenges in conducting experiments with strong atmospheric conditions. An optical phase plate (OPP) is a device that can simulate real atmospheric conditions in a lab setting. We suggest a novel two-step process to fabricate an OPP capable of simulating the effects of atmospheric turbulence. The proposed fabrication method simplifies the process by eliminating additional activities such as phase-screen design and phase simulation. This enables an efficient and economical fabrication of the OPP. We conducted our analysis using the statistical fluctuations of the refractive index and applied modal expansion using Kolmogorov's theory. The experiment aims to fabricate an OPP with parameters D/r₀ ≈ 30 and r₀ ≈ 5 cm. The objective is defined with the strong atmospheric conditions. Finally, we have fabricated an OPP that satisfied the desired objectives. The OPP closely simulate turbulence to real atmospheric conditions.

• Journal of Korean Institute of Industrial Engineers
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• v.36 no.1
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• pp.42-51
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• 2010

The semiconductor industry is highly capital and technology intensive. Technology advancement on circuit design and process improvement requires chip makers continuously to invest a new fabrication facility that costs more than 3 billion US dollars. Especially major semiconductor companies recently started to discuss 450mm fabrication substituting existing 300mm fabrication of which facilities were initiated to build in 1998. If the plan is consolidated, the yield of 450mm facility would be more than doubled compared to existing 300mm facility. In steps of this important investment, facility layout has been acknowledged as one of the most important factors to be competitive in the market. This research proposes a new concept of semiconductor facility layout using hexagonal floor plan and its compatible material flow pattern. The main objective of this proposal is to improve the productivity of the unified layout that has been popularly used to build existing facilities. In this research, practical characteristics of the semiconductor fabrication are taken into account to develop a new layout alternative based on the analysis of Chung and Tanchoco (2009). The performance of the proposed layout alternative is analyzed using computer simulation and the results show that the new layout alternative outperforms the existing layout alternative, unified layout. However, a few questions on space efficiency to the new alternative were raised in communication with industry practitioners. These questions are left for a future study.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.93.2-93.2
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• 2010

Recently, printing and coating technologies application fields have been expanded to the energy field such as solar cell. One of the main reasons, why many researchers have been interested in printing technology as a manufacturing method, is the reduction of manufacturing cost. In this paper, We fabricated CIGS solar cell thin film layer by doctor blade methods using synthesis of CIS precursor nanoparticles ink on molybdenum (Mo) coated soda-lime glass substrate. Synthesis CIS precursor nanoparticles ink fabrication was mixed Cu, In, Se powder and Ethylenediamine, using microwave and centrifuging. Using multi coating process as we could easily fabrication a fine flatness CIS thin-film layer ($0.7{\sim}1.35{\mu}m$), and reduce a manufacture cost and process steps. Also if we use printing and coating method and solution process in each layer of CIGS solar cell (electrode, buffer), it is possible to fabricate all printed thin-film solar cell.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2002.02a
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• pp.259-262
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• 2002

Cable-in-Conduit Conductors (CICC) have been used for fabrication of nuclear fusion magnets. Bending process is included in fabrication of superconducting magnet such as termination of conductors. Because of plastic deformation by bending process, there can be a large residual stress and change of shape in bent conductors. Void volume fraction in conductors is also changed by bending process. In this study, Commercial code was used to analyze the bending process at various bending curvature radius. The calculated residual stress of conductors bent at less than about 40cm curvature radius exceeded the allowable stress.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.04a
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• pp.190-194
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• 2000

The fabrication process and thermal properties of 50∼76vo1% SiCp/Al metal matrix composites (MMCs) were investigated. The 50∼76vo1% SiCp/Al MMCs fabricated by pressure infiltration casting process showed that thermal conductivities were 85∼170W/mK and coefficient of thermal expansion (CTE) were ranged 10∼6ppm/K. Specially, the thermal conductivity and CTE of 71vo1%SiCp/Al MMCs were ranged l15∼156W/mK and 6∼7ppm/K, respectively, which showed a improved thermal properties than the conventional electronic packaging materials such as ceramics and metals.

• Journal of the Korean institute of surface engineering
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• v.29 no.1
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• pp.60-72
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• 1996

A photoetching process is widely used for small and high precision parts in machinery, electronic and semi-conductor industries. One of the high precision parts, grid is very important part of digitron which use electron display, and it is fabricated by only photoetching process because of high precision. In this study, to develop high precision digitron grid, characteristics of etching solution were investigated with electrochemical test, that was potentiodynamic test and immersion test in the ferric chloride solution and added some additives. Based on the electrochemical etching test, grid was fabricated by continuous photoetching process at various etching condition. From the result of measured line width and etching depth under-cut and etching factor were calculated. For the fabrication of 25$\mu\textrm{m}$ line width, optimal etching condition was etching temperature 40~$45^{\circ}C$, spray pressure 1.5kg/$\textrm{cm}^2$ and etching time 3~4min.