• Current Optics and Photonics
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• v.1 no.6
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• pp.618-625
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• 2017

In the present research, a new bending system using a segmented vacuum chuck for Stressed Mirror Polishing (SMP) is developed. SMP is a special fabrication method for thin aspheric mirrors, where simple flat or spherical fabrication is applied while a mirror blank is deflected. Since a mirror blank is usually glued to a bending fixture in the conventional SMP process, there are drawbacks such as long curing time, inconvenience of mirror replacement, risk of mirror breakage, and stress concentration near the glued area. To resolve the drawbacks, a new bending system is designed to effectively hold a mirror blank by vacuum. For the developed bending system, the optimal bending load to achieve the designated mirror deflection is found by finite element analysis and an optimization algorithm. With the measurement results of the deflected mirror surfaces with the optimal bending loads, the feasibility of the developed bending system is investigated. As a result, it is shown that the bending system is appropriate for the SMP process.

• Journal of Sensor Science and Technology
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• v.24 no.1
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• pp.35-40
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• 2015

Electrospinning method has easy preparation of nanofibers with a simple and versatile technique. Electrospun nanofiber is widely used by the simple approach and have great potentials in the numerous applicaitons of medicine, photonics, catalysts, sensors, etc. including advantage of their specific characteristics such as large surface to volume ratio. This paper focused on the fabrication of cobalt electrospun nanofibrer for applications such as electronic, optical and mechanical devices by metal based material. We fabricated cobalt nanofibers on aluminum foil by an electrospinning method. The electrospinning process was performed at a high voltage, 8 kV. The distance between the needle tip and the solution surface in the bath was 5 cm. The PVB - cobalt based nitrate solution was filled in a 10 mL syringe connected to a 22 gauge needle. We confirmed electrospun cobalt nanofiber after annealing process by SIMS (Secondary Ion Mass Spectrometry) analysis. The concept design, fabrication and results of mapping measurements are reported.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.335-336
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• 2006

Compound semiconductor manufacturing environment also has been emerged as mass customization and open foundry service so integrated manufacturing system is needed. In this study, we design data acquisition system of compound semiconductor fabrication that has monitoring and control of process. The developed DAS is consisted of key-in system inputted by operator and automatic acquisition system by GEM protocol. And we implemented them in the actual compound semiconductor. It is expected that using developed system would offer precise process information to buyer, reduce a lead-time, and obey a due-dates and so on.

• Proceedings of the Korean Nuclear Society Conference
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• 1995.05a
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• pp.662-667
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• 1995

An internal gelation process was adopted for the fabrication of carbon-dispersed UO$_3$ microspheres which will be fed to the fabrication for uranium nitride microsphere fuels by the carbothermic reduction. For investigating the proper process conditions, a composition range of feed solution for preparing good UO$_3$ gel spheres was firstly defined by observing the gelation behavior. Within the defined solution compositions, carbon-dispersed microspheres were prepared and carbon distribution in microspheres were observed by SEM. The results showed that production of good carbon-dispersed microspheres was possible, and the most of carbon were evenly distributed in the microspheres although large carbon-rich aggregates were sparsely existent.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.53 no.4
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• pp.231-236
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• 2004

A normally open thermopneumaticc-actuated microvalve has been fabricated and their properties are investigated. The advantages of the proposed microvalve are of the low cost fabrication process and the transparent optical property using polydimethylsiloxane (PDMS) and indium tin oxide (ITO) glass. The fabricated microvalves with in-channel configuration are easily integrated with other microfluidic devices on the same substrate. The fabrication process of thermopneumatic-actuated microvalvesusing PDMS is very simple and its performance is very suitable for a disposable lab-on-a-chip. The PDMS membrane deflection increases and the flow rates of the microchannel with microvalvels decrease as the applied power to the ITO heater increases. The powers at flow-off are dependent on the membrane thickness and the applied inlet pressure but are independent of the channel width of microvalves. The flow rate is well controlled by the switching function of ITO heater and the closing/opening times are around 20 sec and 25 sec, respectively.

• Proceedings of the KAIS Fall Conference
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• 2001.05a
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• pp.91-94
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• 2001

Powder Metallurgy method have been used to fabricate TiC base composite with ferrous binder. TiC base composite has versatile hardness and is usable as sintered, or after heat treatment as required by the given applications. Smooth, round TiC grains impart high wear resistance and lubricity as well known characteristics of this composite. Annealed composite can be formed by conventional machining and be hardened up to 70 H$\_$R/C in vacuum. The optimizing fabrication process enables this composite to improve mechanical properties in heat, wear and corrosion environments. This study has examine the relationship between fabrication condition and mechanical property in TiC-Cr-Mo-Fe Composite.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.3
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• pp.139-146
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• 2004

In this study, to achieve the optimal conditions for mechanical hyper-fine pattern fabrication process, deformation behavior of the materials during indentation scratch test was studied with numerical method by ABAQUS S/W. Brittle materials (Si, Pyrex glass 7740) were used as specimens, and forming conditions to reduce the elastic recovery and pile-up were proposed. The indenter was modeled as a rigid surface. Minimum mesh sizes of specimens are 1-l0nm. Variables of the nanoindentation scratch test analysis are scratching speed, scratching load, tip radius and tip geometry. The nano-indentation scratch tests were performed by using the Berkovich pyramidal diamond indenter. Comparison between the experimental data and numerical result demonstrated that the FEM approach can be a good model of the nanoindentation scratch test. The result of the investigation will be applied to the fabrication of the hyper-fine pattern.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.9
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• pp.100-105
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• 2019

In wire drawing, aterial deformation is concentrated on the surface of the drawn wire because of surface contact with the drawing die. Therefore, strain varies from the center to the surface of the drawn wire. In this study, based on the upper bound method, an effective strain prediction method from the center to the surface of a drawn wire was proposed. Using the proposed method, the effective strain of the drawn wire was calculated verify the proposed prediction method, the predicted effective strain was compared with the result of finite element analysis.

• Journal of Industrial Technology
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• v.43 no.1
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• pp.49-55
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• 2023

Cluster tools are extensively employed in various wafer fabrication processes within the semiconductor manufacturing industry, including photo lithography, etching, and chemical vapor deposition. Contemporary fabrication facilities encounter customer orders with technical specifications that are similar yet slightly varied. Consequently, modern fabrications concurrently manufacture two or three different wafer types using a cluster tool to maximize chamber utilization and streamline the flow of wafer lots between different process stages. In this review, we introduce two methods of concurrent processing of multiple wafer types: 1) concurrent processing of multiple wafer types with different job flows, 2) concurrent processing of multiple wafer types with identical job flows. We describe relevant research trends and achievements and discuss future research directions.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.603-604
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• 2008