• Journal of the Korean Society of Industry Convergence
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• v.14 no.3
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• pp.87-93
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• 2011

When applying back panel(this material is aluminum complex panel coated with fire resistance substances) for curtain wall, solar radiation and heat storage of indoor air occurs to result in thermal warpage for back panel. The purpose of this analysis is to find out the cause of thermal warpage and come up with a solution to prevent changes of back panel and reduce elements that bring negative visual elements. Also to solve this problem analyse that case to reduce heat transfer by inserting additional material and cases to increase air space distance.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.149-154
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• 2018

This paper describes the fabrication and heat transfer property of 50 watts rated LED array module where multiple chips are mounted on chip-on-board type ceramic-metal hybrid substrate with high heat dissipation property for high power street and anti-explosive lighting system. The high heat transfer ceramic-metal hybrid substrate was fabricated by conformal coating of thick film glass-ceramic and silver pastes to form insulation and conductor layers, using thick film screen printing method on top of the high thermal conductivity aluminum alloy heat-spreading panel, then co-fired at $515^{\circ}C$. A comparative LED array module with the same configuration using epoxy resin based FR-4 PCB with thermalvia type was also fabricated, then the thermal properties were measured with multichannel temperature sensors and thermal resistance measuring system. As a result, the thermal resistance of the ceramic-metal hybrid substrate in the $4{\times}9$ type LEDs array module exhibited about one third to the value as that of FR-4 substrate, implying that at least triple performance of heat transfer property as that of FR-4 substrate was realized.