• Title/Summary/Keyword: FPCB Roll to Roll

Search Result 3, Processing Time 0.021 seconds

Enabling Technology for High-Speed Laser Drilling of Roll Type FPCB (롤생산방식 유연회로기판의 레이저 드릴링 고속화 요소기술)

  • Woong-Jae Ra;Hwan Young Choi
    • Journal of Practical Engineering Education
    • /
    • v.15 no.1
    • /
    • pp.127-132
    • /
    • 2023
  • Authors report the performance indicator of Roll to Roll MC (hereinafter referred to as RTR) through experiment that it is possible to process 2.0G acceleration, which cannot be coped with in the existing FPCB RTR, by reducing the weight of the Dancer roll system and controlling the torque using the servo motor. Proposed dancer roll system provides uniform tension to FPCB by solving problems such as high rotation speed, heat generation, and low torque, which were impossible to achieve with the conventional magnet clutch type RTR. Through the development of a lightweight processing method for rolls using magnesium material and the development of a torque control algorithm for servo motor, torque stability also increased. Due to the enabling technology developed in this study, the reaction speed of the dancer roll was improved and the target speed was achieved as well.

A Development of High-Durability Copper Foil Materials for Clock Spring Cable Using Grain Size Control Techniques (결정립 제어 기술을 이용한 클락스프링 케이블용 고내구 동박 소재 개발)

  • Chae, Eul Yong;Lee, Ho Seung
    • Journal of Auto-vehicle Safety Association
    • /
    • v.13 no.3
    • /
    • pp.20-25
    • /
    • 2021
  • Flexural resistance evaluation of FFC (Flexible Flat Cable) was performed according to the grain size of rolled copper foil by adding 0.1wt% silver (Ag) and electrodeposited copper foil by slitting method after heat-treatment. These methods are aimed at enhancing the flexural durability of the FFC by growing the grain size of copper foil. By increasing the grain size of the copper foil and minimizing the miss-orientation at grain boundaries, the residual stress at the grain boundaries of the copper foil is reduced and the durability of the FFC is improved. Maximizing an average grain size of copper foil can be got a good solution in order to enhance the durability of the FFC or FPCB (Flexible Printed Circuit Board).