• 제목/요약/키워드: FED packaging

검색결과 26건 처리시간 0.041초

Tubeless Packaging된 Field Emission Display의 개발 (Development of Tubeless-Packaged Field Emission Display)

  • 주병권;이덕중;이윤희;오명환
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제48권4호
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    • pp.275-280
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    • 1999
  • The glass-to-glass electrostatic bonding process in vacuum environment was developed and the tubeless-packaged FED was fabricated based on the bonding process. The fabricated tubeless-packaged FED showed stable field emission characteristics and potential applicability to the FED tubeless packaging and vacuum in-line sealing.

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디지털 FID용 패널제작과 패키 방법에 관한 연구 (A Study on Panel Manufacture and Packaging Method for Digital FED)

  • 김수용
    • 조명전기설비학회논문지
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    • 제23권5호
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    • pp.29-35
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    • 2009
  • FED는 잠재적인 평판기술에 따라 현재 연구되고 있다. 이 논문의 제안은 FED 핵심적인 개발을 위한 진공 패키징 기술에 대한 연구결과를 보여준다. FED 진공 패키징을 위해서는 유리/유리 접합, 진공배기, 게터기술, 그리고 시뮬레이션, 진공패키징 기술을 연구하였다. 유리/유리 접합은 프릿 글래스를 사용하므로 형태에 따르고, 내부 압력은 $2{\times}10^{-5}$[Torr]이며 패널로서 완성을 보여준다. 게터의 결과에 따라 그것은 압력의 증가는 박막 게터에 의해 불순기체가 줄어드는 것을 보여주었다.

Field Emission Display의 고진공 실장에 관한 연구 (Study on Vacuum Packaging of Field Emission Display)

  • 이덕중;주병권;장진;오명환
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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    • pp.103-106
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    • 1999
  • In this paper, we suggest the FED packaging technology that have 4mm thickness, using sodalime glass-to-sodalime glass electrostatic bonding. It based on conventional silicon-glass bonding. The silicon film was deposited an around the exhausting hole on FED backside panel. And then, the silicon film of panel was successfully bonded with capping(bare) glass in vacuum environment and the FED panel was vacuum-sealed. In this method, we could achieve more 153 times increased conductance and 200 times increased vacuum efficiency than conventional tube packaging method. The vacuum level in panel, by SRG test, was maintained about low 10$_{-4}$ Torr during above two months And, the light emission was observed to 0.7-inch tubeless packaged FED. Then anode current was 34 $\mu$ A. Emission stability was constantly measured for 10 days.

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FedEx Earth Smart: Practices of Environment-Friendly Management

  • Jung, Young-Su
    • 융합경영연구
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    • 제3권4호
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    • pp.21-27
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    • 2015
  • With the recent increasing interest in sustainability management, the latest environmental report tends to be substituted by the expanded sustainability management report. In this work, I would like to introduce the management pattern of a global enterprise that values environmental soundness (environmental friendly) and implements eco-friendly measures. The enterprise chosen in this study is FedEx. In this article, FedEx case is presented how companies can adopt environmental friendly management in their businesses. FedEx has maintained an eco-friendly management since the introduction of the company's eco-friendly transport trucks in 2003, following its development in 2000. In 2005, it installed a solar power plant that can supply up to 80% of the electricity consumed by Oakland Logistics Center in California, USA. FedEx has published the "Global Enterprise Citizenship Report," which contains its business developments in 2009. FedEx has worked hard to minimize the influence caused by packaging of goods to the environment and appealed to customers to use recycled products as much as they can. FedEx also encourages customers to use packaging materials efficiently. A considerable amount of energy has been expended in the eco-friendly programs of FedEx. Although thousands of FedEx vehicles and aircraft operate daily with using large amounts of electricity and fuel, FedEx focuses on energy savings and global environment protection.

비정질 실리콘 박막을 이용한 Sodalime-Sodalime 정전 열 접합 및 FEA Packaging 응용 (Sodalime-sodalime Electrostatic Bonding using Amorphous Silicon Interlayer and Its Application to FEA Packging)

  • 주병권;이덕중;최우범;김영조;이남양;오명환
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제48권9호
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    • pp.656-661
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    • 1999
  • As a fundamental study for FED tubeless packaging, sodalime-sodalime electrostatic bonding was performed by using on the developed bonding mechanism. Thebonding properties of the bonded sodalime-sodalime structure were investigated through SEM and SIMS analyses. Mo-tip FEA was vacuum-packaged by the developed bonding process and the packaged device generated the field emission current.

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