• Journal of Electrical Engineering and Technology
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• 제13권4호
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• pp.1638-1643
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• 2018

Multi-layer ceramic capacitors as decoupling capacitor were fabricated by dielectric composition with a high dielectric constant. The fabricated decoupling capacitors were embedded in the PCB of the 10G RF transceiver module and evaluated for the characteristics of electrical noise by the level of AC input voltage. In order to further improve the electrical properties of the $BaTiO_3$ based composite, glass frit, MgO, $Y_2O_3$, $Mn_3O$, $V_2O_5$, $BaCO_3$, $SiO_2$, and $Al_2O_3$ were used as additives. The electrical properties of the composites were determined by various amounts of additives and optimum sintering temperature. As a result of the optimized composite, it was possible to obtain a density of $5.77g/cm^3$, a dielectric constant of 1994, and an insulation resistance of $2.91{\times}10^{12}{\Omega}$ at an additive content of 5wt% and a sintering temperature of $1250^{\circ}C$. After forming a $2.5{\mu}m$ green sheet using the doctor blade method, a total of 77 layers were laminated and sintered at $1180^{\circ}C$. A decoupling capacitor with a size of $0.6mm(W){\times}0.3mm(L){\times}0.3mm(T)$ (width, length and thickness, respectively) and a capacitance of 100 nF was embedded using a PCB process for the 10G RF Transceiver modules. In the range of AC input voltage 400mmV @ 500kHz to 2200mV @ 900kHz, the embedded 10G RF Transceiver modules evaluated that it has better electrical performance than the non-embedded modules.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 C
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• pp.1366-1367
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• 2006

Embedded capacitor technology is one of the effective packaging technologies for further miniaturization and higher performance of electric package systems. So we used the 3D EM simulator for embedded capacitor design in 8-layed PCB(Printed Circuit Board). The designed capacitors value are 2 pF, 5pF, 10 pF, respectly. we investigated characteristics of capacitance - frequency and SRF(Self Resonance Frequency) as changing the rate of hight and width of upper pad of embedded capacitors.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2012년도 춘계학술발표회 논문집
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• pp.291-292
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• 2012

플렉시블 (F-PCB, Flexible Printed Circuit Board)은 얇고 유연하며 모바일, 광학, 노트북, 프린터, LCD 등 IT산업전반에 걸쳐 사용되고 있다. 통신기기가 이동용으로 전환되면서 대용량, 고속의 정보 전달이 필요하다. 인접 회로간의 전자파 차폐, 구리성분의 편석방지와 고성능의 회로소재 확보가 요구된다. 본고에서는 최근의 플렉시블 인쇄회로기판의 주석도금의 위스커방지 품질향상을 중심으로 기술하였다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2000년도 하계종합학술대회 논문집(2)
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• pp.96-99
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• 2000

We presents a BGA(Ball Grid Array) package for RF circuit modules and extracted its electrical parameters. We constructed a BGA package of ITS(Intelligent Transportation System) RF module and examined electrical parameters with a HP5475A TDR(Time Domain Reflectometry) equipment and compared its electrical parasitic parameters with PCB RF circuits. With a BGA substrate of 3 $\times$ 3 input and output terminals, we have found that self capacitance of BGA solder ball is 68.6fF, self inductance 146pH, mutual capacitance 10.9fF and mutual inductance 16.9pH. S parameter measurement with a HP4396B Network Analyzer showed the resonance frequency of 1.55㎓ and the loss of 0.26dB. Thus, we may improve electrical performance when we use BGA package structures in the design of RF circuit modules.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2009년도 제40회 하계학술대회
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• pp.1587_1588
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• 2009

In this paper, PCB embedded balanced-to-unbalamced duplexer using coupled LC resonator was introduced for low cost dualband WiMax front-end-module application. In order to obtain the function of bandpass filter and balun transformer, proposed duplexer was configured by using magnetically coupled LC resonator. Out-of-band suppression was enhanced by applying two m-Derived transform circuits to obtain transmission zeros at 2GHz and 4.8GHz. In order to reduce the size of embedded duplexer, BaSrTiO3 (BST) composite high Dk RCC film was applied to improve the capacitance density. This high Dk film provided the capacitance density of 12.2 pF/mm2. The simulation results shows that fabricated duplexer had an insertion loss of 2.9dB and 5.5dB and return loss of 15dB and 16dB for 2.5GHz~2.6GHz and 3.5GHz~3.6GHz, respectively. The maximum magnitude and phase imbalance were 0.01dB and 0.17dB, and 1degree and 2degree in its passband, respectively. The out-of-band suppression was observed approximately 29dB and 40dB below 1.9GHz and over 4.5GHz, respectively. It has a volume of 6 mm $\times$ 7 mm $\times$ 0.7 mm (height).

• 분석과학
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• 제14권2호
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• pp.147-158
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• 2001

고분해능 가스크로마토그래프/고분해능 질량분석기를 이용하여 시화공단 지역 근로자와 일반주민의 혈액에서 다이옥신류를 분석하였다. 평균 다이옥신류의 농도는 근로자가 일반주민보다 높았다. 근로자와 일반주민의 평균 다이옥신 TEQ 농도는 각각 40.3 pg I-TEQ/g lipid, 16.6 pg I-TEQ/g lipid였고, 전체 PCBs 농도는 각각 174.1 ng/g lipid, 151.0 ng/g lipid였다. 주성분분석을 한 결과, 근로자와 일반주민의 다이옥신 이성질체 분포는 구별되었지만, 모두 식품류에서의 분포와 유사하였다. 각 개인의 일일 다이옥신 섭취량을 계산했을 때 40%만이 WHO에서 제시한 1-4 pg I-TEQs/kg bw/day의 허용범주를 만족하였다.

• 한국전자파학회논문지
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• 제25권4호
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• pp.387-392
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• 2014

본 논문에서는 USB Dongle에 적용 가능하고 Wibro(2.3~2.4 GHz), Wi-Fi(2.4~2.5 GHz), LTE7(2.5~2.7 GHz) 대역을 지원하는 광대역 안테나 설계 기법을 제안한다. 제안된 안테나는 PIFA(Planar Inverted-F Antenna) 구조를 기본으로 설계되었고, 리액티브 소자를 이용하여 임피던스 조절이 가능하고, 급전 구조와 방사체 간의 커플링을 조절하여 광대역을 실현하였다. 그 결과, 유전율이 4.4인 FR-4 PCB에서 $15{\times}5$ mm의 협소한 공간에서 안테나의 대역폭은 반사계수 -10 dB 기준으로 약 1 GHz 대역폭을 실현했다. 측정된 반사 손실, 대역폭과 방사 패턴은 시뮬레이션 값과 잘 일치하였다.

• 한국전자파학회논문지
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• 제22권7호
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• pp.737-743
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• 2011

본 논문에서는 커플링 급전 구조를 사용하여 모든 이동 통신 대역을 만족하는 단말기용 모노폴+IFA(Inverted F Antenna) 하이브리드 안테나를 설계하고 이를 제작하였다. 1개의 급전 구조를 가지면서도 커플링을 이용하여 모노폴과 IFA가 동시에 동작하도록 함으로써 넓은 대역 특성을 갖도록 하였다. 안테나는 저가격 실현을 위해 carrier 부품이 없는 PCB embedded 형태로 설계하였다. 베어 보드로 제작된 안테나는 LTE/CDMA/GSM900/DCS/USPCS/WCDMA/WiBro/WiFi 대역에서 VSWR 2.5:1 특성을 만족하였다. 평균 이득과 효율은 LTE, CDMA, GSM-900 대역에서 -3.98~-0.09 dBi 및 40.03~97.99 %가 측정되었다. 또한, DCS, USPCS, WCDMA, WiBro, WiFi 대역에서는 -3.90~-1.01 dBi 및 40.70~79.31 %의 효율 특성을 가짐으로써 LTE를 포함한 휴대폰 전 대역 안테나로 사용될 수 있음을 보였다.

• 한국공작기계학회논문집
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• 제17권2호
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• pp.110-113
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• 2008

Embedded capacitor technology is one of the effective packing technologies for further miniaturization and higher performance of electric packaging system. In this paper, the embedded capacitors were simulated and fabricated in 8-layered printed circuit board employing standard PCB processes. The composites of barium titanante($BaTiO_3$) powder and epoxy resin were employed for the dielectric materials in embedded capacitors. Theoretical considerations regarding the embedded capacitors have been paid to understand the frequency dependent impedance behavior. Frequency dependent impedance of simulated and fabricated embedded capacitors was investigated. Fabricated embedded capacitors have lower self resonance frequency values than that of the simulated embedded capacitors due to the increased parasitic inductance values. Frequency dependent capacitances of fabricated embedded capacitors were well matched with those of simulated embedded capacitors from the 100MHz to 10GHz range. Quality factor of 20 was observed and simulated at 2GHz range in the 10 pF embedded capacitors. Temperature dependent capacitance of fabricated embedded capacitors was presented.

• Nuclear Engineering and Technology
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• 제50권7호
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• pp.1068-1078
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• 2018

Experiments were performed to investigate bubble behaviors and pool boiling Critical Heat Flux (CHF) on a thin flat rectangular copper heater fabricated on Printed Circuit Board (PCB), at various inclination angles. The surface inclination angles were $0^{\circ}$, $45^{\circ}$, $90^{\circ}$, $135^{\circ}$, and $180^{\circ}$. Results showed the Onset of Nucleate Boiling (ONB) heat flux increased with increasing heater orientation from $0^{\circ}$ to $90^{\circ}$, while early ONB occurred when the heater faced downwards ($135^{\circ}$ and $180^{\circ}$). The nucleate boiling was observed to be unstable at low heat flux (1-21% of CHF) and changed into typical boiling when the heat flux was above 21% of CHF. The result shows the CHF decreased with increasing heater orientation from $0^{\circ}$ to $180^{\circ}$. In addition, the bubble departure diameter at the heater facing upwards ($0^{\circ}$, $45^{\circ}$, and $90^{\circ}$) was more prominent compared to that of the heater facing downward ($135^{\circ}$). The nucleation site density also observed increased with increasing heat flux. Moreover, the departed bubbles with larger size were observed to require a longer time to re-heat and activate new nucleation sites. These results proved that the ONB, CHF, and bubble dynamics were strongly dependent on the heater surface orientation.