• Proceedings of the KIEE Conference
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• 2003.10a
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• pp.128-130
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• 2003

As toughness-investigation to improve brittleness of existing epoxy resin, elastic-factor of elastic epoxy using TMA (Thermomechanical Analysis), DMTA (Dynamic Mechanical Thermal Analysis) and FESEM (Field Emission Scanning Electron Microsope) for structure-images analysis were investigated. A range of measurement temperature of the TMA, DMTA was changed from -20[$^{\circ}C$] to 200[$^{\circ}C$]. When modifier was ratio of 0[phr], 20[phr], 35[phr], glass transition temperature (Tg) of elastic epoxy was measured through thermal analysis devices. Also, it was investigated thermal expansion coefficient ($\alpha$), modulus and loss factor through DMTA. In addition, it was analyzed structure through FSSEM and made sure elastic-factor of elastic epoxy visually. As thermal analysis results, 20[phr] was superior than 30[phr] thermally and mechanically. Specially, thermal expansion coefficient, modulus, damping properties were excellent. By structure-images analysis through FESEM, we found elastic-factor of elastic epoxy that is not existing epoxy, and proved high impact.

• Journal of the Korean Association of Oral and Maxillofacial Surgeons
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• v.39 no.1
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• pp.31-34
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• 2013

In dentistry, tissue expanders have been used to obtain sufficient soft tissue for alveolar bone augmentation in the severely atrophic ridge. Herein, we review two cases of soft tissue augmentation using a self-inflating tissue expander in patients in the Department of Oral and Maxillofacial Surgery at Ewha Womans University Mokdong Hospital for bone graft and implant operations. The results of each patient were presented using pre-operative and post-operative radiographs and clinical exams. The results of our study indicate successful bone graft and implant surgery using a self-inflating tissue expander.

• The Transactions of the Korean Institute of Power Electronics
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• v.17 no.6
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• pp.495-499
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• 2012

Recently, DC distribution systems become hot issues since DC type loads increase rapidly according to the expansion of IT equipment such as computers, servers, and digital devices; DC type loads will cover 50% for all electricity loads in 2020 which was mere 10% in 2000. DC distribution systems are also accelerated by the expansion of renewable power systems since they are easy to be interfaced with DC grids rather than AC grids. However, removing the fault current in DC grids is comparably difficult since the current in DC grids has non zero-crossing point like in AC grids. Thus, developing dedicated DC circuit breakers for DC grids is necessary to get safety for human and electrical facilities. Magnet arc extinguishing method is proper to small size DC circuit breakers. However, simple Magnet arc extinguishing method is not enough to break inductive fault currents. This paper proposed a novel DC circuit breaker against inductive fault current defined by IEEE C37.14-2004 Standard for Low-Voltage DC Power Circuit Breakers Used in Enclosures. The performance of the proposed DC circuit breaker was verified by an experimental circuit breaker test system built in this research.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.32-35
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• 2002

The work focuses on the development of a Cu lead-frame with a single-sided adhesive tape for cost reduction and reliability improvement of LOC (lead on chip) package products, which are widely used for the plastic-encapsulation of memory chips. Most of memory chips are assembled by the LOC packaging process where the top surface of the chip is directly attached to the area of the lead-frame with a double-sided adhesive tape. However, since the lower adhesive layer of the double-sided adhesive tape reveals the disparity in the coefficient of thermal expansion from the silicon chip by more than 20 times, it often causes thermal displacement-induced damage of the IC pattern on the active chip surface during the reliability test. So, in order to solve these problems, in the resent work, the double-sided adhesive tape is replaced by a single-sided adhesive tape. The single-sided adhesive tape does net include the lower adhesive layer but instead, uses adhesive materials, which are filled in clear holes of the base film, just for the attachment of the lead-frame to the top surface of the memory chip. Since thermal expansion of the adhesive materials can be accommodated by the base film, memory product packaged using the lead-flame with the single-sided adhesive tape is shown to have much improved reliability. Author allied this invention to the Korea Patent Office for a patent (4-2000-00097-9).

• Applied Science and Convergence Technology
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• v.23 no.4
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• pp.192-199
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• 2014

The electronic property of graphene was investigated by hydrazine treatment. Hydrazine ($N_2H_4$) highly increases electron concentrations and up-shifts Fermi level of graphene based on significant shift of Dirac point to the negative gate voltage. We have observed contact resistance and channel length dependent mobility of graphene in the back-gated device after hydrazine monohydrate treatment and continuously monitored electrical characteristics under Nitrogen or air exposure. The contact resistance increases with hydrazine-treated and subsequent Nitrogen-exposed devices and reduces down in successive Air-exposed device to the similar level of pristine one. The channel conductance curve as a function of gate voltage in hole conduction regime keeps analogous value and shape even after Nitrogen/Air exposure specially whereas, in electron conduction regime change rate of conductance along with the level of conductance with gate voltage are decreased. Hydrazine could be utilized as the highly effective donor without degradation of mobility but the stability issue to be solved for future application.

• Journal of the Korean Ceramic Society
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• v.29 no.10
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• pp.827-835
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• 1992

The effects of CeO2 on the properties of cordierite-based glass-ceramics and its applicability to low firing temperature substrate were examined. Glass-ceramics were prepared by sintering the glass powder compacts at 900~100$0^{\circ}C$ for 3 h. Density, bending strength, dielectric constant and thermal expansion coefficient of the glass-ceramics were measured as functions of CeO2 contents and sintering temperatures. By adding CeO2, dense glass-ceramics were obtained below 100$0^{\circ}C$. dielectric constant and bending strength were more dependent on the porosity of glass-ceramics containing 5 wt% CeO2, sintered at 100$0^{\circ}C$ for 3 h, were as follows; relative density is 95.3%, bending strength is 178$\pm$11 MPa, dielectric constant is 4.98$\pm$0.20 (at 1 MHz) and thermal expansion coefficient is 33.7$\times$10-7/$^{\circ}C$. Therefore, the glass-ceramics containing 5 wt% CeO2 appeared to be suitable for low firing temperature substrate of electronic devices.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.53 no.4
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• pp.192-199
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• 2004

Elastic-factor of elastic epoxy were investigated by TMA (Thermomechanical Analysis), DMTA (Dynamic Mechanical Thermal Analysis), TGA (Thermogravimetric Analysis) and FESEM (Field Emission Scanning Electron Microscope) for structure-images analysis as toughness-investigation to improve brittleness of existing epoxy resin. A range of measurement temperature of the TMA and DMTA was changed from -20($^{\circ}C$) to $200^{\circ}(C)$, and TGA was changed from $0^{\circ}(C)$ to $600^{\circ}(C)$. Glass transition temperature (Tg) of elastic epoxy was measured through thermal analysis devices with the content of 0(phr), 20(phr) and 35(phr). Also, thermal expansion coefficient (a), high temperature, modulus and loss factor were investigated through TMA, TGA, and DMTA. In addition, the structure of specimens was analyzed through FESEM, and then elastic-factor of elastic epoxy was visually showed by FESEM. As thermal analysis results, 20(phr) was more excellent than 30(phr) thermally and mechanically. Specially, thermal expansion coefficient, high temperature, modulus, and damping properties were excellent. By structure-images analysis through FESEM, we found elastic-factor of elastic epoxy that is not existing epoxy, and proved high impact.

• The Journal of the Korean dental association
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• v.56 no.2
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• pp.103-112
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• 2018

The treatment of skeletal Class II growing patient is to move the mandible into the Class I molar positon via facilitating mandibular growth. The functional appliances are to be designed to exert three major functions such as palatal expansion, forward growth of mandible and increase of the posterior vertical dimension. One of the devices that can achieve both the palatal expansion and the eruption of the mandibular molar is the Twin-Block introduced by Clark in 1982. In this part, we present the treatment method with Twin-Block functional appliance for the correction of skeletal Class II growing patient.

• Transactions of the Korean Society of Automotive Engineers
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• v.22 no.7
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• pp.57-62
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• 2014

This study presented the feasibility of a coolant heat-source heat pump system as an alternative heating system for electrically driven vehicles. Heat pumps are among the most environmentally friendly and efficient heating technologies in residential buildings. In various countries, electric mobiles devices such as EV, PHEV, and FCEV, have been mainly concerned with heat pumps for new mobile markets. The experiments herein were conducted for various ambient temperatures and coolant temperatures to reflect the winter season. The system, a coolant heat-source heat pump, consisted of an inside heat exchanger, an outside heat exchanger, a motor driven compressor, an electronic expansion valve, and plumbing parts. For the experimental results, the maximum heating capacity and air discharge temperature are up to 6.3 kW and $62^{\circ}C$ respectively at an ambient temperature of $10^{\circ}C$, and coolant at $10^{\circ}C$. However, at $-20^{\circ}C$ ambient temperature and $-10^{\circ}C$ coolant temperature, conditions were insufficient to warm the cabin as the air discharge temperature was $13^{\circ}C$.

• Structural Engineering and Mechanics
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• v.70 no.6
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• pp.723-735
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• 2019

Track-bridge interaction (TBI) problem often arises from the adoption of modern continuously welded rails. Rail expansion devices (REDs) are generally required to release the intensive interaction between long-span bridges and tracks. In their necessity evaluations, the key techniques are the numerical models and methods for obtaining TBI responses. This paper thus aims to propose a preferable model and the associated procedure for TBI analysis to facilitate the designs of long-span bridges as well as the track structures. A novel friction-spring model was first developed to represent the longitudinal resistance features of fasteners with or without vertical wheel loadings, based on resistance experiments for three types of rail fasteners. This model was then utilized in the loading-history-based TBI analysis for an urban rail transit dwarf tower cable-stayed bridge installed with a RED at the middle. The finite element model of the long-span bridge for TBI analysis was established and updated by the bridge's measured natural frequencies. The additional rail stresses calculated from the TBI model under train loadings were compared with the measured ones. Overall agreements were observed between the measured and the computed results, showing that the proposed TBI model and analysis procedure can be used in further study.