• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.04a
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• pp.53-58
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• 2000

During the curing process of thick glass/epoxy laminates, a substantial amount of temperature lag and overshoot at the center of the laminates is usually experienced due to the large thickness and low thermal conductivity of the glass/epoxy composites. Also, it requires a longer time for full and uniform consolidation. In this work, temperature, degree of cure and consolidation of a 20mm thick unidirectional glass/epoxy laminate were investigated using an experiment and a 3-dimentional numerical analysis considering the exothermic reaction. From the experimental and numerical results, it was found that the experimentally obtained temperature profile agreed well with the numerical one and the cure cycle recommended by the prepreg manufacturer should be modified to prevent a temperature overshoot and to obtain full consolidation.

• Journal of Adhesion and Interface
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• v.7 no.1
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• pp.16-22
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• 2006

In this work, the effect of cure temperature and time on the thermal stability and the exothermic cure reaction peak of a waterborne resol-type phenol-formaldehyde resin, which may be used for preparing phenolic sheet molding compounds (SMC), has been investigated using a thermogravimetric analyzer and a differential scanning calorimeter. The weight loss of waterborne phenol-formaldehyde resin was mainly occurred at three temperature stages: near $200^{\circ}C,\;400^{\circ}C$, and $500^{\circ}C$. The carbon yield at $750^{\circ}C$ for the cured resin was about 62%~65%. Their thermal stability increased with increasing cure temperature and time. Upon cure, the exothermic reaction was taken placed in the range of $120^{\circ}C{\sim}190^{\circ}C$ and the maximum peak was found in between $165^{\circ}C$ and $170^{\circ}C$. The shape and the maximum of the exothermic curves depended on the given cure temperature and time. To remove $H_2O$ and volatile components, the uncured resin needed a heat-treatment at $100^{\circ}C$ for 60 min at least prior to cure or molding. Curing at $130^{\circ}C$ for 120 min made the exothermic peak of waterborne phenol-formaldehyde resin completely disappeared. And, post-curing at $180^{\circ}C$ for 60 min further improved the thermal stability of the cured resin.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.57.1-57.1
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• 2011

The effects of relative humidity on the properties of the porous $ZrO_2$ ceramics were investigated in terms of the curing behavior of phenolic resin as a binder. The $ZrO_2$ powders containing 5wt% of phenolic resin were conditioned in a consistent chamber condition at a temperature of $50^{\circ}C$ and different humidity levels (25, 50, 75, and 95%) for 1 h. The exposure of humid atmosphere caused changes of density and microstructure in the green bodies. The higher level the powders were exposed to the humid atmosphere, the lower green density was obtained and the more irregular microstructure was observed due to aggregation by the curing of phenolic resin. After firing, the porosity of specimens has risen from 35.7% to 38.1% and Young's modulus has declined in response to the variation of green density. These results could be explained by the degree of resin cure which was associated with the area under the exothermic peak enclosed by a baseline of DSC thermogram curve. Also, the curing behavior of phenolic resin according to relative humidity has been confirmed by decrease of ether groups which have interacted with the phenolic-OH group and the hexamine as a curing agent. Consequently, it could be demonstrated that increase the relative humidity during fabrication of porous $ZrO_2$ diminished the compaction and properties of specimens after firing owing to curing of phenolic resin.

• Restorative Dentistry and Endodontics
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• v.26 no.5
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• pp.393-398
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• 2001

Polymerization of light-activated restorations results in temperature increase caused by both the exothermic reaction process and the energy absorbed during irradiation. Within composite resin, temperature increases up to 2$0^{\circ}C$ or more during polymerization. But, insulation of hard tissue of tooth lowers this temperature increase in pulp. However, many clinicians are concerned about intrapulpal temperature injury. The purpose of this study was to evaluate temperature changes in the pulp according to various restorative materials and bases during curing procedure. Caries and restoration-free mandibular molars extracted within three months were prepared Class I cavity of 3$\times$6mm with high speed handpiece fissure bur. 1mm depth of dentin was evaluated with micrometer in mesial and distal pulp horns. Pulp chambers were filled with 37.0$\pm$0.1$^{\circ}C$ water to CEJ. Chromium-alumina thermocouple was placed in pulp horn below restorative materials for evaluating of temperature changes. This thermocouple was connected to temperature-recording device(Multiplication analyzer MX, 6.000, JAPAN). Temperature changes was evaluated from initial 37.$0^{\circ}C$ after temperature changes to 37.$0^{\circ}C$. Tip of curing unit was placed in the center of prepared cavity separated 1mm from restorative materials. Curing time was 40s. The restorative materials were used with Z 100, Fuji II LC, Compoglass flow and bases were used with Vitrebond, Dycal. Resrorative materials were placed in 2mm. The depth of bases were formed in 1mm and in this upper portion, resin of 2mm depth was placed. This procedure was performed 10 times. The results were as follows. 1. All the groups showed that the temperature in pulp increased as curing time increased 2. The temperature increase of glass ionomer was significantly higher than that of Resin and Compomer during curing procedure (P<0.05). 3. The temperature increase in glass ionomer base was significantly higher than that of Calcium hydroxide base during Resin curing procedure (P<0.05).

• Polymer(Korea)
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• v.24 no.2
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• pp.201-210
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• 2000

To determine the effect of chain length of linear amine curing agents on the thermal and mechanical properties, standard epoxy resin, diglycidyl ether of bisphenol A (DGEBA) was cured with diethylenetriamine (DETA), triethylenetetraamine (TETA) and tetraethylenepentaamine (TEPA) in a stoichiometrically equivalent ratio. From this work, the effect of linear amine curing agents on the thermal and mechanical properties was significantly influenced by chain length of curing agents. In contrast, the results showed that the DGEBA/DETA system had higher values than the DGEBA/TETA and DGEBA/TEPA system in the density, shrinkage (%), thermal expansion coefficient, tensile modulus, and flexural strength. Whereas the DGEBA/DETA cure system had lower values than the DGEBA/TETA and DGEBA/TEPA cure system in the maximum exothermic temperature, conversion (%), and T$_{g}$. These findings imply that the differences in the maximum conversion about the chain length of curing agents affect the thermal and mechanical properties.s.

• Composites Research
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• v.17 no.6
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• pp.44-51
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• 2004

To determine the effect of numbers of nitrogen atom bonded at ethyl group included in main chain of linear amine curing agents of epoxy-cure systems on the thermal and mechanical properties, standard epoxy resin DGEBF was cured with DETA, TETA and TEPA in a stoichiometrically equivalent ratio. From this work, the effect of curing agents of the DGEBF/amine systems oil the thermal and mechanical properties was significantly influenced by numbers of nitrogen atom of curing agents. The results showed that heat of reaction increased, and maximum exothermic temperature decreased with the decrease of numbers of nitrogen atom. In case of cured systems, density and maximum conversion(%) had no relation to numbers of nitrogen atom, but flexural modulus and tensile modulus increased with the decrease of numbers of nitrogen atom in main chain. Thermal stability, shrinkage(%), Tg, tensile and flexural strength showed irregular tendency having nothing to do with numbers of nitrogem atom at a sight. This findings imply that the differences in the maximum conversion(%) about the chain length of curing agents affect the thermal and mechanical properties.

• Journal of the Korean Ceramic Society
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• v.48 no.4
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• pp.293-297
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• 2011

The thermodynamic behavior of phenolic resin was investigated to verify the relation between the properties of porous ceramics with $ZrO_2$-C system for submerged entry nozzle and the characteristics of phenolic resin with various relative humidity. The green and the sintered density were decreased between 25% and 50% relative humidity, whereas they were gradually enhanced above 50% relative humidity. The highest value of apparent porosity was 20.1% and the minimum compressive strength was 69MPa in the specimen using the powder exposed to 50% relative humidity. As a result of thermal analysis for phenolic resin, the shift of endothermic peak to low temperature and the reduction of exothermic peak were observed, and the peaks corresponded to melting and curing of phenolic resin, respectively. The melting and the curing of phenolic resin generate the change of green density, and it can affect the properties of submerged entry nozzle.

• Korean Journal of Materials Research
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• v.11 no.9
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• pp.786-791
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• 2001

$\alpha$,$\omega$-Bis(4-glycidyloxybenzylidene-4-aminophenyl)methane (BGBAM) was synthesized from the initial materials, 4-hydroxylbenzaldehyde (HBA), 4,4'-methylenedianiline (MDA) and epichlorohydrin. The DSC trace for BGBAM shows two endotherms associated with the liquid crystalline phase transition around $104.2^{\circ}C$ and the isotropic transition around $171.2^{\circ}C$, and it also has a broad exotherm in the range of $178~300^{\circ}C$ due to the anionic homopolymerization of BGBAM. DSC curve for the curing of BGBAM with hexamethylene diamine (HMD) shows an endothermic peak around $93^{\circ}C$ attributed to the melting of BGBAM. It also has three exothermic peaks around $128.4^{\circ}C$ and $180.2^{\circ}C$ associated with the epoxide-amine reaction and weak peak in the range of $200~263^{\circ}C$ related to the anionic homopolymerization between the unreacted epoxide groups. The activation energy values of cure reaction by Kissinger method are 66.5, 67.3 and 90.6 kJ/mol for $T_{pl},\; T_{p2}\; and \;T_{p3},\; respectively$. The kinetic parameters by isoconverional method are similar value to those from Kissinger method.

• Polymer(Korea)
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• v.35 no.3
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• pp.196-202
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• 2011

The cure kinetics of a bisphenol A epoxy resin and polyoxypropylene diamine curing agent system are investigated in both dynamic and isothermal conditions by differential scanning calorimetry (DSC). In dynamic experiments, the shift of exothermic peaks obtained at different heating rates is used to obtain activation energy of overall cure reaction based on the methods of Ozawa and Kissinger. Isothermal DSC data at different temperatures are fitted to an autocatalytic Kamal kinetic model. The kinetic model is in a good agreement with the experimental data in the initial stage of cure. A diffusion effect is incorporated to describe the later stage of cure, predicting the cure kinetics over the whole range of curing process. Also, dynamic mechanical analysis is performed to evaluate the storage modulus and average molecular weight between crosslinkages.

• Composites Research
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• v.18 no.4
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• pp.14-20
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• 2005

To determine the effect of chemical structure of aromatic amino curing agents on thermal and mechanical properties, standard epoxy resin DGEBF (diglycidylether of bisphenol F) was cured with diaminodiphenyl methane (DDM) and diaminodiphenyl sulphone (DDS) in a stoichiometrically equivalent ratio. From this work the effect of aromatic amino curing agents on the thermal and mechanical properties is significantly influenced by the chemical structure of curing agents. In contrast, the results show that the DGEBF/DDS system having the sulfone structure between the benzene rings had higher values in the thermal stability, density, shrinkage ($\%$), thermal expansion coefficient, tensile modulus and strength, flexural modulus and strength than the DGEBF/DDM system having methylene structure between the benzene rings, whereas the DGEBF/DDS system presented low values in maximum exothermic temperature, conversion of epoxide, and grass transition temperature. These results are caused by the relative effects of sulfone group having strong electronegativity and methylene group having (+) repulsive property. The result of fractography shows that the grain distribution of DGEBF/DDS system is more irregular than that of the DGEBF/DDM system.