• 제목/요약/키워드: Evaporation gas

검색결과 427건 처리시간 0.019초

Molecular Dynamics Study on Evaporation Process of Adherent Molecules on Surface by High Temperature Gas

  • Yang, Young-Joon;Osamu Kadosaka;Masahiko Shibahara;Masashi Katsuki;Kim, Si-Pom
    • Journal of Mechanical Science and Technology
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    • 제18권12호
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    • pp.2104-2113
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    • 2004
  • Surface degreasing method with premixed flame is proposed as the removal method of adherent impurities on materials. Effects of adherent molecular thickness and surface potential energy on evaporation rate of adherent molecules and molecular evaporation mechanism were investigated and discussed in the present study. Evaporation processes of adherent molecules on surface molecules were simulated by the molecular dynamics method to understand thermal phenomena on evaporation processes of adherent molecules by using high temperature gas like burnt gas. The calculation system was composed of a high temperature gas region, an adherent molecular region and a surface molecular region. Both the thickness of adherent molecules and potential parameters affceted the evaporation rate of adherent molecules and evaporation mechanism in molecular scale.

MOLECULAR SCALE MECHANISM ON EVAPORATION AND REMOVAL PROCESS OF ADHERENT MOLECULES ON SURFACE BY BURNT GAS

  • Yang, Y.J.;Lee, C.W.;Kadosaka, O.;Shibahara, M.;Katsuki, M.;Kim, S.P.
    • International Journal of Automotive Technology
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    • 제7권2호
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    • pp.121-128
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    • 2006
  • The interaction between adherent molecules and gas molecules was modeled in the molecular scale and simulated by the molecular dynamics method in order to understand evaporation and removal processes of adherent molecules on metallic surface using high temperature gas flow. Methanol molecules were chosen as adherent molecules to investigate effects of adhesion quantity and gas molecular collisions because the industrial oil has too complex structures of fatty acid. Effects of adherent quantity, gas temperature, surface temperature and adhesion strength for the evaporation rate of adherent molecules and the molecular removal mechanism were investigated and discussed in the present study. Evaporation and removal rates of adherent molecules from metallic surface calculated by the molecular dynamics method showed the similar dependence on the surface temperature shown in the experimental results.

소형저장탱크의 가스발생능력에 관한 연구 (A Study on the Prediction of the Maximum Evaporation Rates from LPG Storage Tanks)

  • 이경식;유광수;조영도;박교식
    • 한국가스학회지
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    • 제10권1호
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    • pp.7-12
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    • 2006
  • 소형저장탱크를 이용한 벌크공급시스템은 LP가스의 공급이 중단되거나 공급량이 부족하지 않도록 LP가스 사용가구의 최대가스소비량을 초과하는 가스량을 발생시켜 공급할 수 있어야 한다. 이때 벌크공급시스템에서 공급할 수 있는 가스량은 소형저장탱크의 가스발생능력이 되며, 소형저장탱크의 선정기준이 된다. 현재 우리나라는 소형저장탱크의 충전량, 연속사용시간 등에 따른 가스발생능력 산정기준이 없어 LP가스 사용가구수에 대하여 적합한 소형저장탱크의 선정이 어려운 상태로서 소형저장탱크의 원활한 보급에 문제가 되고 있다. 본 연구는 소형저장탱크의 선정기준이 되는 가스발생능력을 충전량, 외기온도, 연속사용시간 및 충전조성 등에 따라 산정하여 제시하고자 한다.

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활성화 반응으로 제작된 TiO2의 박막특성 (Film Properties of TiO2 Made by Activated Reactive Evaporation)

  • 박용근;최재하
    • 열처리공학회지
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    • 제14권3호
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    • pp.151-154
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    • 2001
  • $TiO_2$ thin film has wide application because of its high capacitanca, reflection, and good transmissivity in visible range. $TiO_2$ thin film can be made by thermal deposition method, reactive evaporation method, activated reactive evaporation(ARE) method. In the case of thermal deposition, the oxygen deficiency can occur because the melting point of Ti is very high. While in the case of reactive evaporation, high density $TiO_2$ can not be made, because reactive gas($O_2$) and evaporated material(Ti) are not fully combined, activated reactive evaporation, $TiO_2$ is easily deposited at lower gas pressure compared with reactive evaporation because the ionized reactive gas is made by plasma. Therefore, activated reactive evaporation is very useful to deposit the material having the high melting point. In this work, we formed $TiO_2$ thin film by activated reactive evaporation method. The surface of $TiO_2$ thin film was analyzed by X-ray photoelectron spectroscopy. The surface morphology which was analyzed by atomic force microscopy(AFM) shows that feature of the film surface is uniform. The dielectric capacitance, withstanding voltage were $600{\mu}F/cm^2$, 0.4V respectively. In further work, we can increase the withstanding voltage by improving the deposition parameter of substrates.

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도료의 부착성 개선을 위한 분자동역학적 연구 (Molecular Dynamics Study for Improving the Adhesion of Paint)

  • 양영준;이치우
    • Journal of Advanced Marine Engineering and Technology
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    • 제31권8호
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    • pp.932-938
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    • 2007
  • The interaction between adherent molecules and gas molecules was modeled in molecular scale and simulated by the molecular dynamics method in order to understand the evaporation and removal processes of adherent molecules on metallic surface using high temperature gas flow. Methanol molecules were chosen as adherent molecules to investigate effects of adhesion quantify and gas molecular collisions because the industrial oil has too complex structures of fatty acid. The effects of adherent quantify, gas temperature and surface temperature for the evaporation rate of adherent molecules and the molecular removal mechanism were investigated and discussed in the present study. Evaporation and removal rates of adherent molecules from metallic surface calculated by the molecular dynamics method showed the similar dependence on surface temperature shown in the experimental results.

열건조기내에서 슬러지 입자의 증발현상에 관한 수치해석 연구 (A Numerical Study on Evaporation of Sludge Particles in a Sludge Dryer)

  • 구본기;김상수
    • 대한기계학회논문집B
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    • 제22권8호
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    • pp.1064-1072
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    • 1998
  • The evaporation of sludge particles in a sludge dryer has been numerically investigated with commercial CFX4.1 code. Gas flow field, gas temperature field, sludge particle trajectories, and the moisture content variation of sludge particles are calculated fort various influencing factors, i. e., gas swirl velocity, initial particle distribution, gas temperature. Evaporation of sludge particles increases with gas swirl velocity, several supplying positions, and gas temperature, respectively due to increased residence time, increased contacting surface area, and increased temperature difference between gas and particle.

전기 폭발법에 의해 제조된 나노 구리 분말의 크기와 분포에 미치는 조업 가스의 영향 (Effect of Atmospheric Gas on the Size and Distribution of Cu Nano Powders Synthesized by Pulsed Wire Evaporation Method)

  • 이근희;이창규;김흥회
    • 한국분말재료학회지
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    • 제11권3호
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    • pp.210-216
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    • 2004
  • The possibility to decrease agglomeration of Cu nano powders and their separation during pulsed wire evaporation (PWE) process was investigated by controlling the working gas system, i.e., the design of the gas path, the type and pressure of the atmospheric gas. As a result, it was possible to choose the optimal design of the gas path providing large specific surface area and high degree of separation of the synthesized Cu nano powders. It was also shown that an Ar+10∼50$N_2$ mixture can be used in production of Cu nano powders, which do not react with nitrogen.

액화석유가스 용기의 자연 증발량에 관한 연구 (A Study on the Natural Evaporation Capacity of LPG Container)

  • 조영도;김지윤
    • 한국가스학회지
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    • 제5권2호
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    • pp.22-29
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    • 2001
  • 체적거래제에 의하여 소규모 공동주택에 가스를 공급하기 위하여 적절한 용기설치수의 결정 및 용기교체시기에 대한 검토가 필요하다. 그러나 지금까지 국내에 축적된 자료가 없을 뿐만 아니라 용기 설치수의 결정과 용기수 및 가스사용 형태에 따라 용기교체시 남아 있는 액화석유가스 양에 대한 이론적 검토가 없었다. 따라서 본 연구에서는 자연기화능력, 잔량, 용기의 온도, 용기내부 압력 등을 시뮬레이션으로 살펴보았다. 용기표면으로부터 액화석유가스 용기의 총괄 열전달계수의 변화에 따른 자연기화량 변화는 크지 않으며, 실험으로부터 구한 값은 약 $9{\~}13 kcal/m^2{\cdot}hr{\cdot}^{\circ}C$이었다. 그리고 액화석유가스 용기내부의 압력이 압력조정기의 압력조정 하한계에 도달하였을 때 가스방출 유량은 공기로부터 전달되는 열량과 균형을 이루는 일정한 값으로 급격히 감소하였다. LP가스용기의 자연기화능력은 외기온도 및 프로판의 조성에 따라 증가하였고, 연속사용시간에 따라 초기 급격히 감소하여 일정한 값으로 수렴하였다. 한 가구당 용기수는 자동절체기 사용에 의하여 감소시킬 수 있는 것을 알 수 있다.

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가스취입에 의한 용융 동 합금 중 납의 증발속도 (Evaporation Rate of Lead in Molten Copper Alloy by Gas Injection)

  • 김항수;정성엽;정우광;윤의한;손호상
    • 한국재료학회지
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    • 제12권1호
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    • pp.68-74
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    • 2002
  • The lead has to be removed for the recycling of copper alloy. The lead cannot be removed from the copper alloy by oxidation. It can be removed by the evaporation because of its high vapor pressure. However, rare information is found on removal of lead from copper alloy. The purpose of present work is to provide a fundamental knowledges on the removal of lead from the copper alloy by evaporation. Gas injection was made in molten copper alloy, and the evaporation rate of lead was measured. The influence of Ar gas flow rata(2~4 L/min), initial contents of lead(2~4wt%Pb), temperature(1200~140$0^{\circ}C$) was investigated based on the thermodynamic and the kinetics. The rate constant is increased with increasing flow rate of Ar and temperature. Though amount of lead removed is increased with higher initial lead concentration, the rate constant is not changed significantly. The activation energy is estimated from the temperature dependence of the rate constant. Also removal of lead from the copper by adding chloride was made for the comparison.