• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 추계학술대회 논문집
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• pp.355-358
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• 2004

In this study, the deformation characteristics of grain-size controlled rheology materials surfaces were investigated as a part of the research on the surface crack prediction in semi-solid formed automobile components. The microstructure of rheology Al-Si alloys consists of primary and eutectic regions. In eutectic regions the crack initiation begins with initial fracture of the eutectic silicon particles and inside other intermetallic phases. Nano-deformation characteristics in the eutectic and primary region of semi-solid aluminum alloys (356 alloy and 319 alloy) were investigated through the nanoindentation/scratch experiments and the AFM observation.

• 소성∙가공
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• 제13권4호
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• pp.374-381
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• 2004

In this study, the deformation behavior of semi-solid Al-Si alloy was investigated by nanoindenter as a part of the research on the surface crack behavior in thixoformed automobile component. The microstructure of semi-solid Al-Si alloy consists of primary and eutectic regions. In eutectic regions the crack initiation begins with initial fracture of the eutectic silicon particles and inside other intermetallic phases. Nano-deformation characteristics in the eutectic and primary phase of semi-solid aluminium alloy were investigated through the nano-indentation experiments and the AFM observation. In addition, mechanical properties of each region were investigated and compared with each other.

• 한국주조공학회지
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• 제8권4호
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• pp.453-458
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• 1988

Al-Si alloy powder produced by the gas atomizer showed fine eutectic structure between ${\alpha}-dendrites$, that was grown by coupled growth, and there remained small amount of ${\alpha}$ in Al - 20 wt% Si alloy. The morphology of Si in the eutectic structure was largely influenced by the recalescence caused by solidification latent heat, and that was thought to be due to decrement of the surface energy of Si. In modified eutectic Si by rapid solidification, fine twin about $0.01\;{\mu}m$ was observed and growth direction of eutectic Si was <112>. This fact implied that the growth mechanism of eutectic Si in rapid solidification was related to TPRE mechanism. Due to rapid solidification Si was soluble in ${\alpha}-phase$ in Al - 12.6wt%Si alloy up to about 3.4wt%, and the solubility of Si in ${\alpha}-phase$ reaches the equilibrium solubility stare after 60min, holding when it was held isothermally at $253-296^{\circ}C$.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
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• pp.303-304
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• 2005

In this paper, we report a fluxless eutectic die bonding process which uses 80Au-20Sn eutectic alloy. The chip LEDs are picked and placed on silicon substrate wafers. The bonding process temperatures and force are $305\sim345^{\circ}C$ and 10$\sim$100gf, respectively. The bonding process was performed on graphite heater with nitrogen atmosphere. The quality of bonding are evaluated by shear test and thermal resistance. Results of fluxless eutectic die bonding show that shear strength is Max. 3.85kgf at 345$^{\circ}C$ /100gf and thermal resistance of junction to die bonding is Min. 3.09K/W at 325$^{\circ}C$/100gf.

• 한국주조공학회지
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• 제14권6호
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• pp.530-540
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• 1994

Aluminium-silicon alloy(JIS AC8A) matrix composites reinforced with SiC particles were fabricated by spray-cast forming process, and the microstructure of powders and preforms produced were studied by using an optical and scanning electron microscopy. SiC particles were co-sprayed by mixed phase injection method during the spray casting process. Most of the composite powders formed by this mixed phase injection method exhibit morphology of particle-embedded type, and some exhibits the morphology of particle attached type due to additional attachment of the SiC particles on the surface of the powders in flight. The preforms deposited were resulted in dispersed type microstructure. The pre-solidified droplets and the deposited preform of SiC-reinforced aluminium alloy exhibit finer equiaxed grain size than that of unreinforced aluminium alloy. Eutectic silicons of granular type are crystallized at the corner of the aluminum grains in the preforms deposited, and some SiC particles seem to act as nucleation sites for primary/eutectic silicon during solidification. Such primary/eutectic silicons seem to retard grain growth during the continued spray casting process. It is envisaged from the microstructural observations for the deposited preform that the resultant distribution of SiC injected particles in the Al-Si microsturcture is affected by the amount of liquid phase in the top part of the preform and by the solidification rate of the preform deposited.

• 한국주조공학회지
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• 제18권4호
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• pp.349-356
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• 1998

In this study, the influence of impurity element Ca, P on solidification behavior and morphology of eutectic silicon was examined by observation of microstructure and by DSC analysis. In the case of 1.3 ppm P, eutectic Si was fine and fibrous when the added amount of Ca was 500 ppm, However, the modification of eutectic Si was depressed by formation of polygonal Ca-Si compounds when the addition amount of Ca was greater than 1000 ppm. The addition of Ca 500 ppm depressed the primary and eutectic temperature. The primary and eutectic temperature were depressed with Ca 500 ppm but rather ascended when the addition amount of Ca was more than 1000 ppm. When the content of P was 17.5 ppm, eutectic Si had modified morphology with Ca addition. DAS was increased, the primary temperature was ascended and eutectic temperature was depressed with Ca added. Eutectic Si appeared as coarse flake phase and DAS was decreased with the increase of P content. The existence of P in the melt depressed the primary temperature and ascended eutectic temperature.

• 한국주조공학회지
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• 제17권4호
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• pp.327-337
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• 1997

The current understanding of the mechanism of inoculation of the eutectic in commercial Fe-C-Si alloys using either silicon containing alloys or graphite has been discussed. The mechanism whereby inclusion formation within a cast iron melt is essential for inoculation effectiveness in ferro silicon inoculation has been reviewed. The role of graphitic inoculants has been presented, including the results of recent research that confirms the inoculating capability of graphite and demonstrates those factors which must be considered in evaluating inoculation effectiveness. Fading of inoculation, both ferro silicon and graphite, and the mechanism whereby this occurs, has also been discussed.

• Current Photovoltaic Research
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• 제4권4호
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• pp.145-149
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• 2016

Characteristic of aluminum-silicon alloy paste which is applied on the rear side of PERC cell was investigated. The paste was made by aluminum-silicon alloy with eutectic composition to avoid the formation of void which is responsible for the degradation of the open-circuit voltage. Also, the glass frit component of the paste was changed to improve the adhesion of aluminum-silicon paste. We observed the formation of void and local back surface field between aluminum electrode and silicon base by SEM. The light IV, quantum efficiency and reflectance of the solar cells were characterized and compared for each paste.

• 센서학회지
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• 제16권1호
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• pp.62-67
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• 2007

This paper presents a novel MEMS condenser microphone with rigid backplate to enhance acoustic characteristics. The MEMS condenser microphone consists of membrane and backplate chips which are bonded together by gold-tin (Au/Sn) eutectic solder bonding. The membrane chip has 2.5 mm${\times}$2.5 mm, $0.5{\mu}m$ thick low stress silicon nitride membrane, 2 mm${\times}$2 mm Au/Ni/Cr membrane electrode, and $3{\mu}m$ thick Au/Sn layer. The backplate chip has 2 mm${\times}$2 mm, $150{\mu}m$ thick single crystal silicon rigid backplate, 1.8 mm${\times}$1.8 mm backplate electrode, and air gap, which is fabricated by bulk micromachining and silicon deep reactive ion etching. Slots and $50-60{\mu}m$ radius circular acoustic holes to reduce air damping are also formed in the backplate chip. The fabricated microphone sensitivity is $39.8{\mu}V/Pa$ (-88 dB re. 1 V/Pa) at 1 kHz and 28 V polarization voltage. The microphone shows flat frequency response within 1 dB between 20 Hz and 5 kHz.

• 한국소음진동공학회논문집
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• 제16권12호
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• pp.1272-1278
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• 2006

This paper presents a novel MEMS condenser microphone with rigid backplate to enhance acoustic characteristics. The MEMS condenser microphone consists of membrane and backplate chips which are bonded together by gold-tin(Au/Sn) eutectic solder bonding. The membrane chip has $2.5mm{\times}2.5mm$, 0.5${\mu}m$ thick low stress silicon nitride membrane, $2mm{\times}2mm$ Au/Ni/Cr membrane electrode, and 3${\mu}m$ thick Au/Sn layer. The backplate chip has $2mm{\times}2mm$, 150${\mu}m$ thick single crystal silicon rigid backplate, $1.8mm{\times}1.8mm$ backplate electrode, and air gap, which is fabricated by bulk micromachining and silicon deep reactive ion etching. Slots and $50{\sim}60{\mu}m$ radius circular acoustic holes to reduce air damping are also formed in the backplate chip. The fabricated microphone sensitivity is 39.8 ${\mu}V/Pa$(-88 dB re. 1 V/Pa) at 1 kHz and 28 V polarization voltage. The microphone shows flat frequency response within 1 dB between 20 Hz and 5 kHz.