• Journal of the Korean Society for Heat Treatment
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• v.36 no.4
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• pp.198-205
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• 2023

We investigated the effects of Al and Mg on the microstructure and hardness of the coating layer of galvanized steel sheets, by thermodynamic calculations, X-ray diffraction, scanning electron microscopy, and Vickers hardness tests of Zn-0.2Al, Zn-6Al-2Mg, and Zn-10Al-5Mg coating layers. Regardless of the alloy composition of the galvanizing bath, a Fe-Al layer was observed between the coating layer and steel sheet. The Zn-0.2Al coating layer consists of major h.c.p. Zn phase and minor f.c.c. Al phase. The fraction of f.c.c. Al phase (containing a significant amount of Zn) of the coating layer increases with increasing the chemical composition of Al of the galvanizing bath. The h.c.p. MgZn₂ phase was formed in the Al/Mg-containing Zn-6Al-2Mg and Zn-10Al-5Mg coating layers, forming Zn-Al-MgZn₂ eutectic microstructure. The primary MgZn₂ phase was additionally formed in the Zn-10Al-5Mg coating layers containing high concentrations of Al and Mg. The Vickers hardness values of Zn-0.2Al, Zn-6Al-2Mg, and Zn-10Al-5Mg coating layers were 59.1 ± 1.2 HV, 161.2 ± 5.7 HV, and 215.5 ± 40.3 HV, respectively. The addition of Al and Mg increased the hardness of the coating layer by increasing the fraction of the Al phase (containing Zn) and MgZn₂ intermetallic compound, which were harder than the Zn phase.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.33 no.6
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• pp.234-243
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• 2023

Zinc crystals of ZnO and SiO₂ in glaze raw materials, developed according to composition and firing requirements, are preferred because of their high decorative properties. However, most zinc crystal glazes have a high firing temperature and a narrow firing temperature range, making it difficult to use them as commercial glazes in ceramics. Therefore, in this study, it was expected that the firing temperature of a typical zinc crystal glaze could be lowered to below 1270℃ by using the eutectic effect through mixing frit, the main raw material used in manufacturing zinc crystal glaze. As a result, not only was the formation temperature of zinc crystals lower in the mixed frit glaze, but also the firing temperature range was widened to 1230~1270℃, making it possible to develop a glaze that produces crystals stably. The firing temperature was lowered to 1230~1250℃ and the holding temperature during cooling was lowered to about 950℃, resulting in the development of an economically effective glaze. When using a combination of frit, it has been shown that the holding temperature during cooling affects the recrystallization of zinc crystals depending on the composition of the glaze, and the crystal structure can be adjusted at this time. Additionally, the amount and shape of crystals can be controlled by using a nucleating agent.

• Journal of Korea Foundry Society
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• v.42 no.6
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• pp.337-346
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• 2022

In order to optimize the solution treatment conditions of Al-7Si-(0.3~0.5)Mg-(0~0.5)Cu alloys, a series of heat treatment experiments were conducted under various solution treatment times up to 7 hours at 545℃, followed by a microstructural analysis using optical microscopy, FE-SEM, and Brinell hardness measurements. Rapid coarsening of eutectic Si particles was observed in the alloys during the first 3 hours of solution treatment but the size of those Si particles did not change at longer solution treatment conditions. Meanwhile, the degree of spheroidisation of eutectic Si particles increased until the solution treatment time was increased up to 7 hours. Q-Al5Cu2Mg8Si6 andθ-Al2Cu were observed in as-cast Cu-containing Al alloys but the intermetallic compounds were dissolved completely after 3 hours of solution treatment at 545℃. Depending on the initial Mg composition of the Al alloys, π-Al8FeMg3Si either disappeared in the alloy with 0.3wt% of Mg content after 5 hours of solution treatment or remained in the alloy with 0.5wt% of Mg content after 7 hours of solution treatment time. Mg and Cu content in the primary-α phase of the Al alloys increased until the solution treatment time reached 5 hours, which was in accordance with the dissolution behavior of Mg or Cu-containing intermetallic compounds with respect to the solution treatment time. From the results of microstructural changes in the Al-7Si-Mg-Cu alloys during solution treatment, it was concluded that at least 5 hours of solution treatment at 545℃ is required to maximize the age hardening effect of the present Al alloys. The same optimal solution treatment conditions could also be derived from Brinell hardness values of the present Al-7Si-Mg-Cu alloys measured at different solution treatment conditions.

• Journal of Welding and Joining
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• v.30 no.5
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• pp.64-69
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• 2012

Sn-Bi eutectic alloy has been widely used as one of the key solder materials for step soldering at low temperature. The Sn-58Bi solder paste containing chloride flux was adopted to compare with that using the chloride-free flux. The paste was applied on the electroless nickel-immersion gold (ENIG) surface finish by stencil printing, and the reflow process was then performed at $170^{\circ}C$ for 10 min. After reflow, the solder joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 h in an oven. The interfacial microstructures were obtained by using scanning electron microscopy (SEM), and the composition of intermetallic compounds (IMCs) was analyzed using energy dispersive spectrometer (EDS). Two different IMC layers, consisting of $Ni_3Sn_4$ and relatively very thin Sn-Bi-Ni-Au were formed at the solder/surface finish interface, and their thickness increased with increasing aging time. The wettability of solder joints was investigated by wetting balance test. The mechanical property of each aging solder joint was evaluated by the ball shear test in accordance with JEDEC standard (JESD22-B117A). The results show that the highest shear force was measured when the aging time was 100 h, and the fracture mode changed from ductile fracture to brittle fracture with increasing aging time. On the other hand, the chloride flux in the solder paste did not affect the shear force and fracture mode of the solder joints.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.4
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• pp.1-9
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• 2002

The metallurgical reaction properties between the pad consisted of 0.5 $\mu\textrm{m}$Au/5 $\mu\textrm{m}$Ni/Cu layers on a conventional ball grid array (BGA) substrate and In-15 (wt.%)Pb-5Ag solder ball were characterized during the reflow process and solid aging. During the reflow process of 1 to 5 minutes, it was observed that thin $AuIn_2$ or Ni-In intermetallic layer was formed at the interface of solder/pad. The dissolution rate of the Au layer into the molten solder was about $2\times 10^{-3}$ $\mu\textrm{m}$/sec which is remarkably low in comparison with a eutectic Sn-37Pb solder. After solid aging treatment for 500 hrs at $130^{\circ}C$, the thickness of $Ni_{28}In_{72}$ intermetallic layer was increased to about 3 $\mu\textrm{m}$ in all the conditions nevertheless the initial reflow time was different. These result show that In atoms in the solder alloy were diffused through the $AuIn_2$ phase to react with underlaying Ni layer during solid aging treatment. From the microstructural observation and shear tests, the reaction properties between In-15Pb-5Ag alloy and Au/Ni surface finish were analyzed not to trigger Au-embrittlement in the solder joints unlike Sn-37Pb composition.