• 한국주조공학회지
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• 제5권4호
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• pp.258-270
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• 1985

The structures and mechanical properties of undirectionally solidified Sn-Zn eutectic alloys have been examined over the growth range 7mm/h to 6,000mm/h. The structures of unidirectionally solidified Sn-Zn eutectic alloys were primarily broken-lamellar at growth rates below 760mm/h and became fibrous at higher growth rates above that. At a growth rate 3,084mm/h the structures were fibrouse only. There is no dendrites at any growth rates, but occasionally ribbon-like morphologies were seen. The under cooling increased parabolically with growth rate increase. The hardness of specimes increased with growth rates increase but heat-treated specimen decreased after growth rates 760mm/h and became constant value. The effect of heat-treatment was good at lower growth rate. At room temperature tensile strength increased with growth rates up to R=990mm/h and then tensile strength became near-constant value. The effect of heat-treatment was well at lower growth rate.

• 융복합기술연구소 논문집
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• 제5권2호
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• pp.43-48
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• 2015

Deep eutectic solvents (DESs) are now broadly understood as a new kind of ionic liquid (IL) because they exhibit many characteristics and properties similar with ILs. The DESs made of quaternary ammonium salt blended with one of hydrogen bonding donor (HBD) compounds behave as ILs even at very low temperature. In this study, properties such as density, viscosity, surface tension, conductivity, and electrochemical behavior of DESs were reported and their applications were reviewed. Study on DESs has been drawn attention on application in metal finishing, but these solvents can be used in a variety of synthesis, and their potentials have been demonstrated in various areas. DESs are expected to offer applicability by extending the types of salts and hydrogen bond donor mixtures.

• 한국주조공학회지
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• 제11권1호
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• pp.63-70
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• 1991

Aluminium alloy castings, which can be not only manufactured in larger geometrically complex shapes, but also show good mechanical properties in addition to light weight, have kept their potential use as structures in the field of automotives, industrial machines and aircrafts. The variations of eutectic Si size a great effect on the elongation, impact value, fracture toughness and fatigue crack propagation rate without changes in the tensile strength or yield strength. The cooling curves with the solidification rate between $1.4^{\circ}C\;/min$ and $19.1^{\circ}C\;/min$ were obtained. With the increase of solidification rate, DAS, eutectic Si size and grain size were all decreased, which enhanced the mechanical properties. The tensile strength and yield strength were the most greatly influenced by DAS, and the elongation and impact value by eutectic Si size.

• 한국주조공학회지
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• 제15권4호
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• pp.408-415
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• 1995

Polycrystalline Al-Cu ribbons were produced by planar flow casting(PFC). Solidification behavior and microstructual changes of the ribbons have been investigated as a function of ribbon thickness and processing parameters. The solidification front velocity, V varies within the ribbon, decreasing with increasing the distance, S from the wheel-contact surface, as $V=17.6S^{-1}$. In Al-4.5wt%Cu alloy, rapid decrease in solidification velocity toward the free surface causes a change in solidification morphology from planar to cellular, and finally, to dendritic. The length and inclination of columnar grains solidified with planar front were related to the wheel velocity. The transition from particulate degenerate eutectic structure to regular lamellar eutectic structure was observed to be caused by a difference of the relative growth velocites of ${\alpha}-Al$ and ${\theta}$ during solidification in the Al-Cu eutectic alloy.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.469-474
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• 2002

Laser and hot air reflow soldering of PBGA solder ball was investigated. Experimental results showed that surface quality and shear strength of solder bumps reflowed by laser was superior than the solder bumps reflowed by hot air, and the microstructure inside the solder bumps reflowed by laser was much finer. Analysis on interfacial reaction showed that eutectic solder reacted with Au/Ni/Cu pad shortly after the solder was melted. Interface of solder bump reflowed by laser consists of a continuous AuSn$_4$ layer and remnant Au element. Needle-like AuSn$_4$ grew sidewise from interface, and then spread out to the entire interface region. A thin layer of Ni$_3$Sn$_4$ intermetallic compound was found at the interface of solder bump reflowed by hot air, AuSn$_4$ particles distributed inside the whole solder bump randomly. It is the combination effect of the continuous AuSn$_4$ layer and finer eutectic microstructure inside the solder bump reflowed by laser that resulted in higher shear strength.

• 한국결정성장학회:학술대회논문집
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• 한국결정성장학회 1999년도 PROCEEDINGS OF 99 INTERNATIONAL CONFERENCE OF THE KACG AND 6TH KOREA·JAPAN EMG SYMPOSIUM (ELECTRONIC MATERIALS GROWTH SYMPOSIUM), HANYANG UNIVERSITY, SEOUL, 06월 09일 JUNE 1999
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• pp.403-418
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• 1999

Fiber growth of Al2O3/R-Al-O(R=Y, Gd, Dy, Ho, Er) eutectic by the micro-pulling down methods is described. The thermal stability and strength at elevated temperature of each material is evaluated in relation to the microstructure. PACS: 81.05 Mh, 81.10 Fq, 81.30-t.

• 한국주조공학회지
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• 제17권2호
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• pp.188-194
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• 1997

The effects of solidification condition and vibration on structure refinement were investigated for unidirectionally solidified $Al-CuAl_2$ eutectic composites. Eutectic composites were unidirectionally solidified under vibration with different growth rates (R) and thermal gradient(G). The lamellar structure was varied according to growth condition (G/R ratio). For the structure refinement the effect of G/R was found out to be greater than that of vibration. The interlamellar spacing(${\lambda}$) in this materials was varied with the growth rates(R) with "${\lambda}^2R$=Constant" relationship.

• 센서학회지
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• 제14권6호
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• pp.381-386
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• 2005

A Co-C eutectic cell for thermocouple calibration was manufactured and tested to investigate its phase transition characteristics using Type B thermocouples. It was observed that the freezing plateaus were flatter than those of melting, but the melting points were closer to the true transition temperature than the freezing points. The expanded uncertainty of melting temperature was calculated not to exceed $0.2^{\circ}C$ (k = 2). Based on the observed results, the melting process is recommended for the calibration of thermocouples.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년도 춘계 학술대회 개요집
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• pp.230-232
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• 2006

Eutectic Au-20Sn solder has been widely used for optoelectronic packages because of fluxless soldering process and thus are particularly valuable for many applications such as biomedical, photonic, and MEMS devices that can not use any flux. Also when good joint strength, superior resistance to corrosion, whisker-free, and good thermal conductivity are demanded, eutectic Au-20Sn solder can be satisfied with above-mentions best. In this study, we tried to know the interfacial reactions between Au-20Sn solder and Cu substrate with or without ENIG plating layer In the results, Au-Cu-Sn ternary phases were formed at the Au-20Sn/Cu substrate, and Au-Ni-Sn, Au-Ni-Cu-Sn phases were formed at the Au-20Sn/ENIG substrate.

• 한국주조공학회지
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• 제10권5호
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• pp.399-407
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• 1990

The effect of thermal cycling and isothermal exposure on the high temperature microstructural stability of unidirectionally solidified $Al-CuAl_2$ eutectic composite has been studied. A coarsening procedures of lamellar eutectic structures were initiated at growth fault region because of diffusion through low angle boundary at this region. It was considered that thermally induced residual stresses produced by thermal cycling were high enough to increase the dislocation density in Al-rich matrix phase. However, it was also considered that dislocations generated by these high thermal stresses were annihilated at high temperature by stress relaxation. Consequently, the thermal cycling up to 1440 cycles between 20 and $520^{\circ}C$ did not affect the microstructural stability.