• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 추계학술대회 논문집 Vol.15
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• pp.190-194
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• 2002

In this study, the etching of Au thin films have been performed in an inductively coupled CF4/Cl2/Ar plasma. The etch properties were measured as the CF4 adds from 0 % to 30 % to the Cl2/(Cl2 + Ar) gas mixing ratio of 0.2. Other parameters were fixed at a rf power of 700 W, a dc bias voltage of 150 V, a chamber pressure of 15 mTorr, and a substrate temperature of $30^{\circ}C$. The highest etch rate of the Au thin film was 370 nm/min at a 10 % additive CF4 into Cl2/(Cl2 + Ar) gas mixing ratio of 0.2. The surface reaction of the etched Au thin films was investigated using x-ray photoelectron spectroscopy (XPS) analysis. From x-ray photoelectron spectroscopy (XPS) analysis, the intensities of Au peaks are changed. There is a chemical reaction between Cl and Au. Au-Cl is hard to remove on the surface because of its high melting point and the etching products can be sputtered by Ar ion bombardment. We obtained the cleaned and steep profile.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.472-472
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• 2011

The capacitive coupled plasma (CCP) has been extensively used in the semiconductor industry because it has not only good uniformity, but also low electron temperature. But CCP source has some problems, such as difficulty in varying the ion bombardment energy separately, low plasma density, and high processing pressure, etc. In this reason, dual frequency CCP has been investigated with a separate substrate biasing to control the plasma parameters and to obtain high etch rate with high etch selectivity. Especially, in this study, we studied on the etching of $SiO_2$ by using the pulse-time modulation in the dual-frequency CCP source composed of 60 MHz/ 2 MHz rf power. By using the combination of high /low rf powers, the differences in the gas dissociation, plasma density, and etch characteristics were investigated. Also, as the size of the semiconductor device is decreased to nano-scale, the etching of contact hole which has nano-scale higher aspect ratio is required. For the nano-scale contact hole etching by using continuous plasma, several etch problems such as bowing, sidewall taper, twist, mask faceting, erosion, distortions etc. occurs. To resolve these problems, etching in low process pressure, more sidewall passivation by using fluorocarbon-based plasma with high carbon ratio, low temperature processing, charge effect breaking, power modulation are needed. Therefore, in this study, to resolve these problems, we used the pulse-time modulated dual-frequency CCP system. Pulse plasma is generated by periodical turning the RF power On and Off state. We measured the etch rate, etch selectivity and etch profile by using a step profilometer and SEM. Also the X-ray photoelectron spectroscopic analysis on the surfaces etched by different duty ratio conditions correlate with the results above.

• 한국재료학회지
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• 제25권1호
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• pp.1-8
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• 2015

This study suggested comprehensive structural characterization methods for the commercial blue light emitting diodes(LEDs). By using the Z-contrast intensity profile of Cs-corrected high-angle annular dark field scanning transmission electron microscope(HAADF-STEM) images from a commercial lateral GaN-based blue light emitting diode, we obtained important structural information on the epilayer structure of the LED, which would have been difficult to obtain by conventional analysis. This method was simple but very powerful to obtain structural and chemical information on epi-structures in a nanometer-scale resolution. One of the examples was that we could determine whether the barrier in the multi-quantum well(MQW) was GaN or InGaN. Plan-view TEM observations were performed from the commercial blue LED to characterize the threading dislocations(TDs) and the related V-pit defects. Each TD observed in the region with the total LED epilayer structure including the MQW showed V-pit defects for almost of TDs independent of the TD types: edge-, screw-, mixed TDs. The total TD density from the region with the total LED epilayer structure including the MQW was about $3.6{\times}10^8cm^{-2}$ with a relative ratio of Edge- : Screw- :Mixed-TD portion as 80%: 7%: 13%. However, in the mesa-etched region without the MQW total TD density was about $2.5{\times}10^8cm^{-2}$ with a relative ratio of Edge- : Screw- :Mixed-TD portion of 86%: 5%: 9 %. The higher TD density in the total LED epilayer structure implied new generation of TDs mostly from the MQW region.

• 한국산업융합학회 논문집
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• 제26권4_2호
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• pp.591-598
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• 2023

In this study, the corrosion resistance by salt spray was evaluated using A6061-T6 for an electric vehicle battery pack case coated with an organic/inorganic hybrid solution. The lowest curing temperature of 190 ℃ resulted in significant corrosion and pitting. Meanwhile, no corrosion was observed in the coated specimens at 210 ℃ and 230 ℃ except at 210 ℃ - 6 min and 8 min. The surface of the as-received coating specimen observed by FE-SEM exhibited streaks and dents in the rolling direction, but the coating surface was clean. On the 190 ℃ - 6 min coating specimen, which had a lot of corrosion, rolling streaks spread, and dents were caused by corrosion. The 200 ℃ - 12 min coating specimen did not show corrosion, but it showed an etched surface. In the line profile, Si, the main component of the coating solution, was detected the most, and Ti was also detected. In the coating specimens with salt spray, O increased and Si decreased, regardless of corrosion. The peeling rate by adhesion evaluation was 26 - 87% for the 190 ℃ coating specimen, 4 - 83% for the 210 ℃ coating specimen, and 94 - 100% for the 230 ℃ coating specimen. The optimal curing conditions for the coating solution used in this study were 210 ℃ for 10 min.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 1999년도 추계학술발표회 초록집
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• pp.49-49
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• 1999

In this study, $Cl_2/BCI_3$ magnetized inductively coupled plasmas (MICP) were used to etch GaN and the effects of magnetic confinements of inductively coupled plasmas on the GaN etch characteristics were investigated as a function of $Cl_2/BCI_3$. Also, the effects of Kr addition to the magnetized $Cl_2/BCI_3$ plasmas on the GaN etch rates were investigated. The characteristics of the plasmas were estimated using a Langmuir probe and quadrupole ma~s spectrometry (QMS). Etched GaN profiles were observed using scanning electron microscopy (SEM). The small addition of $Cl_2/BCI_3$ (10-20%) in $Cl_2$ increased GaN etch rates for both with and without the magnetic confinements. The application of magnetic confinements to the $Cl_2/BCI_3$ inductively coupled plasmas (ICP) increased GaN etch rates and changed the $Cl_2/BCI_3$ gas composition of the peak GaN etch rate from 10% $BCI_3$ to 20% $BCI_3$. It also increased the etch selectivity over photoresist, while slightly reducing the selectivity over $Si0_2$. The application of the magnetic field significantly increased positive $BCI_2{\;}^+$ measured by QMS and total ion saturation current measured by the Langmuir probe. Other species such as CI, BCI, and CI+ were increased while species such as $BCl_2$ and $BCI_3$ were decreased with the application of the magnetic field. Therefore, it appears that the increase of GaN etch rate in our experiment is related to the increased dissociative ionization of $BCI_3$ by the application of the magnetic field. The addition of 10% Kr in an optimized $Cl_2/BCI_3$ condition (80% $Cl_2/$ 20% $BCI_3$) with the magnets increased the GaN etch rate about 60%. More anisotropic GaN etch profile was obtained with the application of the magnetic field and a vertical GaN etch profile could be obtained with the addition of 10% Kr in an optimized $Cl_2/BCI_3$ condition with the magnets.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1995년도 춘계학술대회 논문집
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• pp.58-61
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• 1995

레이저 유기에 대한 GaAs 의 건석에칭에 있어서 기존의 $CCl_4$와CCl$_2$F$_2$ 가스를 에칭하스로 사용하는 대신에 본 연구팀이 새로 개발한 CFCs 대체가스를 사용하여 기존의 가스와의 에칭률과 그 가공된 형태를 비교하였다. 실험은 power 밀도 12.7 MW/$\textrm{cm}^2$에서 27 MW/$\textrm{cm}^2$까지로 가변시키면서 하고 에칭가스의 압력은 260 Torr에서760 Torr 까지 변화를 주면서 하였다. 빔의 주사속도는 8.3$\mu\textrm{m}$/sec에서 80$\mu\textrm{m}$/sec 까지 가변을 시켰다. 그 결과 CHCiF$_2$가스에서의 에칭율(etch rate)은 최대 136$\mu\textrm{m}$/sec이고 aspect ratio 는 2.6 이 됨을 알 수 있었다. 애칭된 형태를 측정하기 위해서 SEM(Scanning Electron Microscopy)을 사용하였으며, 시료 표면의 물질 분석을 위해서 AES(Auger Electron Spectroscopy)를 사용하였다.

• 한국광학회지
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• 제31권5호
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• pp.213-217
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• 2020

본 논문에서는 아디아바틱(adiabatic) 광섬유 테이퍼의 습식 식각 기반 제조 방법에 대해 보고하고 1550 nm 파장에서의 아디아바틱 성질 및 테이퍼드 광섬유에서 HE₁₁ 모드의 전개에 대해 설명하고자 한다. 제조한 결과물은 아디아바틱 성질을 잘 만족하며 far field 패턴 측정 결과로부터 테이퍼 전체에 걸쳐 고차 모드 커플링 없이 기본 HE₁₁ 모드가 유지되는 것을 보여준다. 측정한 far field 패턴의 경우에 시뮬레이션 결과와 잘 일치하는 것을 검증하였고, 테이퍼드 광섬유는 다수의 광자 응용에 적용할 수 있으며 특히 광섬유-칩 패기지에 적용할 수 있다. 시뮬레이션을 통해서 제작한 아디아바틱 광섬유 테이퍼를 모델링한 후 역방향 테이퍼드 실리콘 도파관 사이의 광 전송률 시뮬레이션을 살펴보았을 때, 1 dB 초과 손실(실리콘 도파관 각도 1°)이 약 ~60 ㎛ 길이라는 여유있는 공간 치수 공차를 보이며, 0.4 dB 미만의 삽입 손실(실리콘 도파관 각도 4°)을 보인다. 또한, 본 연구자들이 제시하는 아디아바틱 커플러가 O 밴드 및 C 밴드 대역을 넘어, 초 광대역 결합 효율 가능성을 보이는 것을 확인하였다.

• 한국진공학회지
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• 제14권4호
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• pp.252-257
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• 2005

고휘도 마이크로빔 X-선원에 사용할 고휘도 전자빔원을 탄소나노튜브를 이용하여 설계, 제작하였다. 전자빔원은 탄소나노튜브 팁을 이용한 음극, 전자빔 인출용 그리드, 전자빔 가속용 양극으로 이루어진 삼극관 형태의 구조를 가진다. 설계된 휘도 값을 얻기 위하여 X-선 발생부에서의 전자빔 직경이 5 $\mu$m 이하, 빔전류가 약 30 $\mu$A 이상이 요구된다 이러한 요구조건을 만족시키기 위하여, EGUN Code를 이용하여 전자빔의 궤적 및 공간분포 등을 계산함으로써, 탄소나노튜브 팁 및 전자빔원의 구조 등을 최적화 하였다. 제작된 탄소나노튜브 팁은 직경 200 $\mu$m 의 텅스텐 와이어를 전기화학적으로 에칭하여 그 끝을 뽀족하게 만든 뒤 텅스텐의 끝 부분에 탄소나 노튜브를 화학기상법으로 증착하여 제작하였다. 제작된 탄소나노튜브를 이용하여 전자빔 인출실험을 수행하였다. 개발 중인 탄소나노튜브 팁을 이용한 고휘도 전자빔원의 설계 특성 및 기초 실험결과를 보고한다.