• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.242-242
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• 2006

Increasingly complex tasks are performed by computers or cellular phone, requiring more and more memory capacity as well as faster and faster processing speeds. This leads to a constant need to develop more highly integrated circuit systems. Therefore, there have been numerous studies by many engineers investigating circuit patterning. In particular, PCB including module/package substrates such as FCB (Flip Chip Board) has been developed toward being low profile, low power and multi-functionalized due to the demands on miniaturization, increasing functional density of the boards and higher performances of the electric devices. Imprint lithography have received significant attention due to an alternative technology for photolithography on such devices. The imprint technique. is one of promising candidates, especially due to the fact that the expected resolution limits are far beyond the requirements of the PCB industry in the near future. For applying imprint lithography to FCB, it is very important to control thermal properties and mechanical properties of dielectric materials. These properties are very dependent on epoxy resin, curing agent, accelerator, filler and curing degree(%) of dielectric materials. In this work, the epoxy composites filled with silica fillers and cured with various accelerators having various curing degree(%) were prepared. The characterization of the thermal and mechanical properties wasperformed by thermal mechanical analysis (TMA), thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), rheometer, an universal test machine (UTM).

• Elastomers and Composites
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• v.40 no.1
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• pp.3-11
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• 2005

The ruling kinetics of epoxy resins with 3 different kinds or alkenylsuccinic anhydride (ASA) having C-8, C-12, and C-16 pendant side chain length with two different catalysts was studied by using differential scanning calorimetry (DSC). Nonisothermal and isoconversional method has been used for characterizing the effect of the pendant side chain length in the curing process. Results or nonisothermal method showed that there was no significant difference in the effect of the pendant side chain length of ASA. But isoconversional analysis showed that the value of the activation energy for the initiation reaction or C-8, C-12, and C-16 were $61.7{\sim}57.7kJ/mol$, $63.0{\sim}57.3 kJ/mol$, and $130.4{\sim}94.2 kJ/mol$, respectively, depending on the catalyst used. The values of activation energy for the initiation is different as reported value of 20 kJ/mol which indicating the difference in the effect of the pendant side chain length of ASA in the initial stage of the reaction.

• Elastomers and Composites
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• v.41 no.1
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• pp.19-26
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• 2006

In this study, the effect of thermal aging temperature on the weight loss, glass transition temperature, and morphology of epoxy adhesives cured with amine (D-230), amide (G-5022), and anhydride (HN-2200) was investigated. As a result, the weight loss of three specimens was increased with increasing the thermal aging temperature. The result was attributed to the thermal aging which was occurred at the surface of adhesive specimens at high aging temperature, resulting in increasing the weight loss of the specimens. According to the DSC result, the glass transition temperature of DGEBA/D-230 and DGEBA/G-5022 samples war increased as the aging temperature increased, whereas the glass transition temperature of DGEBA/HN-2200 samples was constant above aging temperature of $150^{\circ}C$ and aging tine of 7 days. The SEM result indicated that the surface of DGEBA/G-5022 specimen showed more rough topography than that of DGEBA/D-230 or DGEBA/HN-2200 specimen after thermal aging. This could be correlated with the result of weight loss.

• Composites Research
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• v.32 no.1
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• pp.6-12
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• 2019

This paper describes the characteristics for mode I interlaminar and intralaminar fractures of cross-ply carbon/epoxy composite laminates. We obtained mode I interlaminar fracture toughness and mode I intralaminar fracture toughness based on energy release rate and Finite Element Analysis (FEA). For this purpose, the Double-Cantilever Beam (DCB) test and FEA were performed for cross-ply DCB specimens. Also, the behavior of load-displacement curve at the interlaminar and intralaminar crack was analyzed. The results show that mode I intralaminar fracture toughness was lower than mode I interlaminar fracture toughness in the cross-ply DCB specimen.

• Composites Research
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• v.34 no.3
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• pp.148-154
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• 2021

Carbon/epoxy composite bipolar plate (BP) is a BP that is likely to replace existing graphite bipolar plate of vanadium redox flow cell (VRFB) due to its high mechanical properties and productivity. Multi-functional carbon/epoxy composite BP requires graphite coating or additional surface treatment to reduce interfacial contact resistance (ICR). However, the expanded graphite coating has the disadvantage of having low durability under VRFB operating conditions, and the surface treatments incur additional costs. In this work, an excessive resin absorption method is developed, which uniformly removes the resin rich area on the surface of the BP to expose carbon fibers by applying polyester fabric. This method not only reduces ICR by exposing carbon fibers to BP surfaces, but also forms a unique ditch pattern that can effectively hold carbon felt electrodes in place. The acidic environmental durability, mechanical properties, and gas permeability of the developed carbon/epoxy composite BP are experimentally verified.

• Composites Research
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• v.35 no.2
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• pp.53-60
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• 2022

This study uses Diglycidyl ether of terephthalylidene-bis-(4-amino-3-methylphenol) (DGETAM), an amine hardener 4,4'-diaminodiphenylethane (DDE) and cationic catalyst N-benzylpyrazinium hexafluoroantimonate (BPH) to make epoxy film. For analysis, ¹H_NMR and FT-IR were used to verify proper synthesis, and the liquid crystallinity of DGETAM was checked using Differntial Scanning Calorimetry and Polarized Optical Microscopy. Thermal conductivity of the sample was measured using Laser Flash Apparatus. Thermal stability as well as thermal conductivity is important when used as a packaging material. Activated energy is the energy needed to generate a response, which can be used to estimate the energy required to maintain physical properties. It was obtained using the Arrhenius equation based on the data measured by isothermal decomposition using Thermogravimetric Analysis. Measurement of the thermal conductivity of epoxy films showed higher thermal conductivity when DDE was used, and it was found that thermal conductivity had an effect on thermal stability, given that it represented an activation energy similar to a film with BPH upon 5% decomposition.

• Composites Research
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• v.35 no.2
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• pp.61-68
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• 2022

Composite materials have been used in aerospace industry and many applications because of many advantages such as specific strength and stiffness and corrosion resistance etc. However, it is vulnerable to impacts, these impact lead to formation of cracks in composite laminate and failure of structures. In this paper, we analyzed Mode I fracture toughness of Carbon/Epoxy laminates using acoustic emission signal. DCB test was carried out to analyze Mode I failure characterization of Carbon/Epoxy laminates, and AE sensor was attached to measure AE signal induced by failure of specimen. Fracture toughness was calculated using cumulative AE energy and measured crack length using camera. The calculated fracture toughness was applied in FE model and the result of FE analysis compared with DCB test results. The results show good agreement with between FEM and DCB test results.

• Composites Research
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• v.21 no.4
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• pp.15-21
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• 2008

Interfacial shear strength between epoxy and carbon fiber was analyzed utilizing a hemi-spherical microbond specimens adhered onto single carbon fiber. The hemi-spherical microbond specimen showed high regression coefficient and small standard deviation in the measurement of interfacial strength as compared with a droplet and an inverse hemi-spherical one. This seemed to be caused by the reduced meniscus effects and the reduced stress concentration In the region contacting with a pin-hole loading device. Finite element analysis showed that the stress distributions along the fiber/matrix interface in the hemi-spherical specimen had a stable shear stress distribution along the interface without any stress mode change. The experimental data was also different according to the kinds of loading device such as the microvise-tip and the pin-holed plate.

• Composites Research
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• v.22 no.6
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• pp.39-44
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• 2009

The effect of exposure times on the aging characteristics of carbon fiber/epoxy composite ring specimen was evaluated using an accelerating aging tester. Combined exposure conditions, such as temperature, moisture, and ultraviolet, were applied up to 3000 hours. Tensile properties and flexural properties including the effect of curvature were evaluated on the specimens subject to various exposure times through a material testing system. Their aging surfaces were observed through a scanning electron microscope. According to the results, tensile modulus was little affected by the exposure times. However, tensile strength, at the early stage of the exposure times, increased due to physical aging and curing reaction, but tensile strength slightly decreased due to degradation as the exposure times increased. The flexural modulus and flexural strength increased at the early stage of the exposure times, but slightly decreased as the exposure times increased. Aging surfaces of the specimens examined using the scanning electron microscope revealed a different morphology in various exposure times and provided useful information for identifying the degradation in mechanical properties of the composite subject to various exposure times.

• Composites Research
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• v.19 no.5
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• pp.12-19
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• 2006

In this paper, conceptual structural design of the main wing for a small scale WIG(Wing in Ground Effect) among high speed ship projects, which will be a high speed maritime transportation system for the next generation in Rep. of Korea, was performed. The Carbon/Epoxy material was selected for the major structure, and the skin-spar with a foam sandwich structural type was adopted for improvement of lightness and structural stability. As a design procedure for the present study, firstly the design load was estimated through the critical flight load case study, and then flanges of the front and rear spars from major bending loads and the skin and the spar webs from shear loads were preliminarily sized using the netting rule and the rule of mixture. Stress analysis was performed by a commercial FEA code, NASTRAN. From the stress analysis results for the first designed wing structure, it was confirmed that the upper skin between the front spar and the rear spar was unstable fer the buckling. Therefore in order to solve this problem, a middle spar and the foam sandwich type structure at the skin and the web were added. After design modification, the structural safety and stability for the final design feature was confirmed. In addition to this, the insert bolt type structure with eight high strength bolts to fix the wing structure to the fuselage was adopted for easy assembly and removal as well as in consideration of more than 20 years fatigue life.