• Composites Research
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• v.15 no.6
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• pp.16-23
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• 2002

In this work, the effect of anodic oxidation on surface characteristics of high strength PAN-based carbon fibers was investigated in mechanical interfacial properties of composites. The surface properties of the carbon fibers were determined by acid-base values, scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), and contact angles. And their mechanical interfacial properties of the composites were studied in interlaminar shear strength (ILSS) and critical stress intensity factor ($K_{IC}$). As a result, the acidity or the $O_{ls}/C_{ls}$ ratio of carbon fiber surfaces was increased, due to the development of the oxygen functional groups. Consequently, the anodic oxidation led to an increase in surface free energy of the carbon fibers, mainly due to the increase of its specific (or polar) component. The mechanical interfacial properties of the composites, including ILSS and $K_{IC}$, had been improved in the anodic oxidation on fibers. These results were explained that good wetting played an important role in improving the degree of adhesion at interfaces between fibers and epoxy resin matrix.

• Composites Research
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• v.25 no.6
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• pp.178-185
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• 2012

One of a unique technique in manipulating a multifunctional composite is demonstrated in this study. An electric field is applied to a liquid suspension in order to align the inclusions along with the direction electric field. This is called FAiMTa(Field Aided Micro Tailoring). It makes orthotropic polymer composites by arranging the micro and/or nano size particle inclusions in chain-line formation. Several kinds of particles such as $Al_2O_3$, graphite, CNT(Carbon Nano Tube), W(Tungsten) are tested to verify the effectiveness of the FAiMTa. The particles redistributed in an epoxy suspension and their coupons show that mechanical and thermal properties of orthotropic and random composites containing those particles depend on the trend of particles' alignment. The micro-images of the functional composite from FAiMTa have been captures and their physical properties demonstrate their wide-range and state-of-the-art application for advanced multifunctional composites.

• Composites Research
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• v.29 no.6
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• pp.336-341
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• 2016

This paper conducted the study on the electromagnetic and mechanical applicability of CNT-coated glass fiber for wind blades. Large-size wind blade has the serious pending problems to meet the target, such as interfering radar signals, increasing weights, and increasing repair costs. In this paper, we are suggesting the CNT-coated glass fiber in order to overcome these problems. First, the CNTs were strongly coated on the surfaces of glass fiber by suggested coating process, and the CNT-coated glass fiber/epoxy composites were fabricated by Va-RTM process. We designed and fabricated a radar absorbing structure using the CNT-coated glass fiber, which showed over 90% radar absorbing performance between 8.3 and 12.1 GHz frequency. In addition, we confirmed the improvement of mechanical properties on the strength and modulus of tensile, compressive, and in-plane shear.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2004.04a
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• pp.182-185
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• 2004

In this work, the effect of chemical treatments on surface properties of SiC was investigated in mechanical interfacial properties of carbon fibers-reinforced composites. The surface properties of the SiC were determined by acid/base values and contact angles. The thermal stabilities of carbon fibers-reinforced composites were investigated by thermogravimetric analysis (TGA). Also, the mechanical interfacial properties of the composites were studied in interlaminar shear strength (ILSS) and critical strain energy release rate mode II $(G_{IIC})$ measurements. As a result, tile acidically treated SiC (A-SiC) had higher acid value than that of untreated SiC (V-SiC) or basically treated SiC (B-SiC). According to the contact angle measurements, it was observed that chemical treatments led to an increase of surface free energy of the SiC surfaces, mainly due to the increase of the specific (polar) component. The mechanical interfacial properties of the composites, including ILSS and $(G_{IIC})$, had been improved in the specimens treated by chemical solutions. These results were explained that good wetting played an important role in improving the degree of adhesion at interfaces between SiC and epoxy resin matrix.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.40 no.12
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• pp.1037-1046
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• 2016

In this study, to enhance the electrical insulation of composite specimens in addition to the improved mechanical properties, the epoxy composite were reinforced with carbon nanotubes and silica particles. Tensile strength, Young's modulus, dynamic mechanical behavior, and electrical resistivity of the specimens were measured with varied contents of the two fillers. The mechanical and electrical properties were discussed, and the experimental results related to the mechanical properties of the specimens were compared with those from several micromechanics models. The hybrid composites specimens with 0.6 wt％ of carbon nanotubes and 50 wt％ of silica particles showed improved mechanical properties, with increase in tensile strength and Young's modulus up to 11％ and 35％, respectively, with respect to those of the baseline specimen. The electrical conductivity of the composite specimens with carbon nanotubes filler also improved. Further, the electrical insulation of the hybrid composites specimens with the two fillers improved in addition to the improvement in mechanical properties.

• Applied Chemistry for Engineering
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• v.7 no.2
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• pp.387-392
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• 1996

Natural zeolite/epoxy resin composites were prepared and the cure kinetics was studied by dynamic DSC analysis. With the increments of natural zeolite content, the reaction starting temperature and the exothermic peak temperature were decreased. When diglycidyl ether of bisphenol A(DGEBA)/4,4'-methylene dianiline(MDA)/malononitrile(MN, 10phr) was filled with 20phr of zeolite, DSC thermogram had one peak and when it was filled with 30phr of zeolite, a shoulder appeared on the DSC thermogram. With the filling of 40phr of zeolite, DSC thermogram was separated into two peaks and the activation energy of the first peak, $Ea_1$ was 12.30 kJ/mol and that of the second peak, $Ea_2$ was 12.70 kJ/mol.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.14 no.1
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• pp.53-58
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• 2000

In this paper, the variable mechanical strength and dielectric breakdown strength of epoxy composites were measured at boiling absorption condition in order to observe the influences of moisture in out door use. Also, in order to improve water resistance of matrix resin, IPN(interpenetrating polymer network) method which had been already reported, was introduced and the influence was investigated. As Adding filter(SiO2) classified by o[phr], 50[phr] and 100[phr] to two kinds of matrix resin, six kinds of specimens were manufactured. As a result, it was confirmed that the moisture absorption rate was increased and mechanical strength and dielectric breakdown strength were degraded with boiling time and filler content increasing. On the other hand, it was confirmed that moisture absorption rates were decreased and the degrading rates of mechanical strength and dielectric breakdown strength were lowered according to improvement of adhesion strength in case of IPN specimens.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.32 no.6
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• pp.64-71
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• 2004

The object of this study is to design the Radar Absorbing Structures (RAS) having sandwich structures in the X-band ($8.2{\sim}12.4GHz$) frequencies. Glass fabric/epoxy composites containing conductive carbon blacks and carbon fabric/epoxy composites were used for the face sheets. Polyurethane(PU) foams containing multi-walled carbon nanotube (MWNT) were used for the core. Their permittivities in the X-band were measured using the transmission line technique. The reflection loss characteristics for multi-layered sandwich structures were calculated using the theory of transmission and reflection in a multi-layered medium. Three kinds of specimens were fabricated and their reflection losses in the X-band were measured using the free space technique. Experimental results were in good agreements with simulated ones in 10dB absorbing bandwidth.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.